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Nozzle tip wetting in gasoline direct injection injector and its link with nozzle internal flow
International journal of engine research, 2020-02, Vol.21 (2), p.340-351
2020
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Nozzle Tip Wetting in GDI Injector at Flash-boiling Conditions
International journal of heat and mass transfer, 2021-04, Vol.169, p.120935, Article 120935
2021
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Hydraulic flip in a gasoline direct injection injector and its effect on injected spray
Fuel (Guildford), 2022-02, Vol.310, p.122303, Article 122303
2022
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Drag reduction on a flat-back ground vehicle with active flow control
Journal of wind engineering and industrial aerodynamics, 2015-10, Vol.145, p.292-303
2015
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Electro-migration evaluation between organic interposer and build-up substrate on 2.3D organic package
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.716-722
2020
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Study on thermal stress behavior of mold type POL tile
2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 2023, p.1161-1166
2023
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Nozzle tip wetting in gasoline direct injection injector and its link with nozzle internal flow
International journal of engine research, 2019-08, Vol.21 (2)
2019
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Warpage control of silicon interposer for 2.5D package application
2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.879-884
2013
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Electro-migration behavior in low temperature flip chip bonding
2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.608-614
2012
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Development of High Reliability Joint of Sn-Bi Solder for 2.3D Organic Package
2021 International Conference on Electronics Packaging (ICEP), 2021, p.91-92
2021
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Thermal Characteristic Evaluation of Silver and Copper Sintering Materials
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 2019, p.300-304
2019
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Effects of Au and Pd in Pad Surface Finish on Electro-Migration of Flip Chip Interconnection Between Cu-Pillar and Sn-Bi Solder Alloy System
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.875-881
2018
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Effects of the Inter-Metallic Compounds Microstructure on Electro-Migration of Sn-Bi Solder System
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.464-469
2017
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Study of Crystal Orientation and Microstructure in Sn-Bi and Sn-Ag-Cu Solder with Thermal Compression Bonding and Mass Reflow
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.909-916
2016
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Low stress bonding for large size die application
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2015, p.1846-1853
2015
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Effects of Culture Conditions on Growth and Protease Production of Bacillus stearothermophilus YG185
JOURNAL OF CHEMICAL ENGINEERING OF JAPAN, 1994, Vol.27(3), pp.425-428
1994
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Influence of micro voids in flip chip bump on electro-migration reliability
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.1144-1152
2022
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Study of electro-migration resistivity of micro bump using SnBi solder
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.1166-1172
2014
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Predictive Modelling Methodologies for Bi-Material Wafer Warpage
2021 International Conference on Electronics Packaging (ICEP), 2021, p.45-46
2021
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Electro-migration behavior in fine pitch SnBi eutectic solder bump interconnections
IEEE CPMT Symposium Japan 2014, 2014, p.71-74
2014
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Studies on electrical performance and thermal stress of a silicon interposer with TSVs
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), 2010, p.1088-1093
2010
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Warpage behavior in 2.5D package using Si-interposer
2013 3rd IEEE CPMT Symposium Japan, 2013, p.1-4
2013
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Electrical and morphological characterization for high integrated silicon interposer and technology transfer from 200 mm to 300mm wafer
2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.334-341
2013
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Development of interconnect technologies for embedded organic packages
53rd Electronic Components and Technology Conference, 2003. Proceedings, 2003, p.1484-1489
2003
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Low-power 808-nm laser irradiation inhibits cell proliferation of a human-derived glioblastoma cell line in vitro
Lasers in medical science, 2012-01, Vol.27 (1), p.87-93
2012
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