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Embedded compensation for DDQ/Bipolar-Q IPT Charging Pads
2019 IEEE Energy Conversion Congress and Exposition (ECCE), 2019, p.551-556
2019
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Magnetic Design of a Q-Coil for a 10 kW DDQ System for Inductive Power Transfer
2019 IEEE PELS Workshop on Emerging Technologies: Wireless Power Transfer (WoW), 2019, p.140-143
2019
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Analysis of Simultaneous Wireless Power and High-Speed Data Transfer System Based on ASK Modulation
2023 IEEE Wireless Power Technology Conference and Expo (WPTCE), 2023, p.1-5
2023
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Design and Testing of Wireless EV Charging System with Improved Lateral Misalignment Tolerance
2022 IEEE Vehicle Power and Propulsion Conference (VPPC), 2022, p.1-6
2022
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On the Utilization of Double-D Quadrature Coils in Dynamic Wireless Electric Vehicle Charging Systems
2022 9th International Conference on Electrical and Electronics Engineering (ICEEE), 2022, p.55-59
2022
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Design and Optimization of a Compact and Misalignment-tolerant Wireless Power Transfer System
2021 IEEE 12th Energy Conversion Congress & Exposition - Asia (ECCE-Asia), 2021, p.1287-1292
2021
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Bridging Faults in CMOS: Possibilities of Current Testing
ESSCIRC '90: Sixteenth European Solid-State Circuits Conference, 1990, Vol.1, p.117-120
1990
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Outlier Detection for Analog Tests Using Deep Learning Techniques
2023 IEEE 41st VLSI Test Symposium (VTS), 2023, p.1-7
2023
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Advanced Outlier Detection Using Unsupervised Learning for Screening Potential Customer Returns
2020 IEEE International Test Conference (ITC), 2020, p.1-10
2020
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CNN-based Stochastic Regression for IDDQ Outlier Identification
2020 IEEE 38th VLSI Test Symposium (VTS), 2020, p.1-6
2020
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Eigen-signatures for regularity-based IDDQ testing
Proceedings 20th IEEE VLSI Test Symposium (VTS 2002), 2002, p.289-294
2002
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Learning Dialogue Policy Efficiently Through Dyna Proximal Policy Optimization
Collaborative Computing: Networking, Applications and Worksharing, p.396-414
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Identification of Suspicious Semiconductor Devices Using Independent Component Analysis with Dimensionality Reduction
2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC), 2019, p.1-6
2019
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Some considerations on choosing an outlier method for automotive product lines
2017 IEEE International Test Conference (ITC), 2017, p.1-10
2017
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CMOS IC reliability indicators and burn-in economics
Proceedings International Test Conference 1998 (IEEE Cat. No.98CH36270), 1998, p.194-203
1998
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Reliability hazard characterization of wafer-level spatial metrology parameters based on LOF-KNN method
2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA), 2019, p.1-4
2019
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The leading edge of production wafer probe test technology
2004 International Conferce on Test, 2004, p.1168-1195
2004
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LISOCHIN: An NBTI Degradation Monitoring Sensor for Reliable CMOS Circuits
VLSI Design and Test, p.441-451
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Development and evaluation of single sided flux couplers for contactless electric vehicle charging
2011 IEEE Energy Conversion Congress and Exposition, 2011, p.614-621
2011
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Design of a double coupled IPT EV highway
IECON 2013 - 39th Annual Conference of the IEEE Industrial Electronics Society, 2013, p.4606-4611
2013
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Testing of Trusted CMOS Data Converters
2012 IEEE Computer Society Annual Symposium on VLSI, 2012, p.350-355
2012
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On a New Outlier Rejection Technique
25th IEEE VLSI Test Symposium (VTS'07), 2007, p.97-103
2007
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Elimination of Vmin failures in 0.15um logic process
2006 IEEE International Symposium on Semiconductor Manufacturing, 2006, p.152-155
2006
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Diagnosis of Bridging Defects Based on Current Signatures at Low Power Supply Voltages
25th IEEE VLSI Test Symposium (VTS'07), 2007, p.145-150
2007
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An analysis of the delay defect detection capability of the ECR test method
Proceedings International Test Conference 2000 (IEEE Cat. No.00CH37159), 2000, p.1060-1069
2000
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