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CMP Aerogels: Ultrahigh-Surface-Area Carbon-Based Monolithic Materials with Superb Sorption Performance

Advanced materials (Weinheim), 2014-12, Vol.26 (47), p.8053-8058

2014

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Radiosynthesis and evaluation of [11C]CMP, a high affinity GSK3 ligand

Bioorganic & medicinal chemistry letters, 2019-03, Vol.29 (6), p.778-781

2019

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Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper

Applied sciences, 2021-08, Vol.11 (16), p.7232

2021

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Chemoenzymatic synthesis of CMP–sialic acid derivatives by a one-pot two-enzyme system: comparison of substrate flexibility of three microbial CMP–sialic acid synthetases

Bioorganic & medicinal chemistry, 2004-12, Vol.12 (24), p.6427-6435

2004

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XPS, UV–vis spectroscopy and AFM studies on removal mechanisms of Si-face SiC wafer chemical mechanical polishing (CMP)

Applied surface science, 2014-10, Vol.316, p.643-648

2014

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Insights into triazole derivatives as potential corrosion inhibitors in CMP process: Experimental evaluation and theoretical analysis

Applied surface science, 2022-11, Vol.602, p.154165, Article 154165

2022

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Effect of arginine-based cleaning solution on BTA residue removal after Cu-CMP

Colloids and surfaces. A, Physicochemical and engineering aspects, 2020-02, Vol.586, p.124286, Article 124286

2020

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Germanium electrochemical study and its CMP application

Applied surface science, 2017-11, Vol.422, p.247-256

2017

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Enhanced optomechanical properties of mechanochemiluminescent poly(methyl acrylate) composites with granulated fluorescent conjugated microporous polymer fillers† †Electronic supplementary information (ESI) available: Experimental procedures, characterization data for granulated CMPs, CMP/PMA composites, optomechanical test results of CMP/PMA and mechanochemiluminescent videos of CMP/PMA films during stretching. See DOI: 10.1039/c8sc04701d

Chemical science (Cambridge), 2018-12, Vol.10 (7), p.2206-2211

2018

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Corrosion control of copper wiring by barrier CMP slurry containing azole inhibitor: Combination of simulation and experiment

Colloids and surfaces. A, Physicochemical and engineering aspects, 2020-08, Vol.599, p.124872, Article 124872

2020

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Influence mechanism of defects on the subsurface damage and structural evolution of diamond in CMP process

Applied surface science, 2021-11, Vol.566, p.150638, Article 150638

2021

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Fluorescent conjugated microporous polymer (CMP) derived sensor array for multiple Organic/Inorganic contaminants detection

Sensors and actuators. B, Chemical, 2020-10, Vol.320, p.128448, Article 128448

2020

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Effect of ionic strength on ruthenium CMP in H2O2-based slurries

Applied surface science, 2014-10, Vol.317, p.332-337

2014

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Study using ReaxFF-MD on the CMP process of fused glass in pure H2O/aqueous H2O2

Applied surface science, 2021-08, Vol.556, p.149756, Article 149756

2021

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Polishing Mechanism of CMP 4H-SiC Crystal Substrate (0001) Si Surface Based on an Alumina ( Al 2 O 3 ) Abrasive

Materials, 2024-01, Vol.17 (3), p.679

2024

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Effect of a novel chelating agent on defect removal during post-CMP cleaning

Applied surface science, 2016-08, Vol.378, p.239-244

2016

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Study on chemical effects of H2O2 and glycine in the Copper CMP process using ReaxFF MD

Applied surface science, 2020-04, Vol.508, p.145262, Article 145262

2020

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Effect of complexing agent on ceria particle removal in post-STI CMP cleaning process

Colloids and surfaces. A, Physicochemical and engineering aspects, 2023-02, Vol.658, p.130668, Article 130668

2023

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Investigation of the effect of different cleaning forces on Ce-O-Si bonding during oxide post-CMP cleaning

Applied surface science, 2021-04, Vol.545, p.149035, Article 149035

2021

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Atomistic scale nanoscratching behavior of monocrystalline Cu influenced by water film in CMP process

Applied surface science, 2018-03, Vol.435, p.983-992

2018

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Performance of colloidal silica and ceria based slurries on CMP of Si-face 6H-SiC substrates

Applied surface science, 2015-12, Vol.359, p.664-668

2015

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Adsorption of nucleotides on biomimetic apatite: The case of cytidine 5′ monophosphate (CMP)

Journal of colloid and interface science, 2015-10, Vol.456, p.132-137

2015

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Effect of photocatalytic oxidation technology on GaN CMP

Applied surface science, 2016-01, Vol.361, p.18-24

2016

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Expanding current applications and permitting the analysis of larger intact samples by means of a 7 mm CMP-NMR probe

Analyst (London), 2021-07, Vol.146 (14), p.4461-4472

2021

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Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers

Applied surface science, 2017-08, Vol.413, p.16-26

2017

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CMP Aerogels: Ultrahigh-Surface-Area Carbon-Based Monolithic Materials with Superb Sorption Performance

Radiosynthesis and evaluation of [11C]CMP, a high affinity GSK3 ligand

Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper

Chemoenzymatic synthesis of CMP–sialic acid derivatives by a one-pot two-enzyme system: comparison of substrate flexibility of three microbial CMP–sialic acid synthetases

XPS, UV–vis spectroscopy and AFM studies on removal mechanisms of Si-face SiC wafer chemical mechanical polishing (CMP)

Insights into triazole derivatives as potential corrosion inhibitors in CMP process: Experimental evaluation and theoretical analysis

Effect of arginine-based cleaning solution on BTA residue removal after Cu-CMP

Germanium electrochemical study and its CMP application

Corrosion control of copper wiring by barrier CMP slurry containing azole inhibitor: Combination of simulation and experiment

Influence mechanism of defects on the subsurface damage and structural evolution of diamond in CMP process

Fluorescent conjugated microporous polymer (CMP) derived sensor array for multiple Organic/Inorganic contaminants detection

Effect of ionic strength on ruthenium CMP in H2O2-based slurries

Study using ReaxFF-MD on the CMP process of fused glass in pure H2O/aqueous H2O2

Polishing Mechanism of CMP 4H-SiC Crystal Substrate (0001) Si Surface Based on an Alumina ( Al 2 O 3 ) Abrasive

Effect of a novel chelating agent on defect removal during post-CMP cleaning

Study on chemical effects of H2O2 and glycine in the Copper CMP process using ReaxFF MD

Effect of complexing agent on ceria particle removal in post-STI CMP cleaning process

Investigation of the effect of different cleaning forces on Ce-O-Si bonding during oxide post-CMP cleaning

Atomistic scale nanoscratching behavior of monocrystalline Cu influenced by water film in CMP process

Performance of colloidal silica and ceria based slurries on CMP of Si-face 6H-SiC substrates

Adsorption of nucleotides on biomimetic apatite: The case of cytidine 5′ monophosphate (CMP)

Effect of photocatalytic oxidation technology on GaN CMP

Expanding current applications and permitting the analysis of larger intact samples by means of a 7 mm CMP-NMR probe

Nd3+-doped colloidal SiO2 composite abrasives: Synthesis and the effects on chemical mechanical polishing (CMP) performances of sapphire wafers

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