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Nanocatalyst-induced hydroxyl radical (·OH) slurry for tungsten CMP for next-generation semiconductor processing

Journal of materials science, 2020-03, Vol.55 (8), p.3450-3461

2020

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Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review

International Journal of Precision Engineering and Manufacturing-Green Technology, 2022, 9(1), , pp.349-367

2022

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The CMP inverse for rectangular matrices

Aequationes mathematicae, 2018-08, Vol.92 (4), p.649-659

Mosić, Dijana

2018

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Novel polyelectrolyte–Al2O3/SiO2 composite nanoabrasives for improved chemical mechanical polishing (CMP) of sapphire

Journal of materials research, 2019-03, Vol.34 (6), p.1073-1082

2019

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Slurry components in metal chemical mechanical planarization (CMP) process: A review

International journal of precision engineering and manufacturing, 2016-12, Vol.17 (12), p.1751-1762

2016

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Preparation of SiC/SiO2 Hard Core–Soft Shell Abrasive and Its CMP Behavior on Sapphire Substrate

Journal of electronic materials, 2020-02, Vol.49 (2), p.1301-1307

2020

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The influence of pH and H2O2 on surface quality and material removal rate during W-CMP

International journal of advanced manufacturing technology, 2023-08, Vol.127 (9-10), p.4097-4110

2023

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Effect of DL-alanine as an auxiliary complexing agent in TSV copper film CMP

Journal of materials research, 2023-06, Vol.38 (12), p.3172-3186

2023

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A Half-Century of CMP

Communications in mathematical physics, 2016-10, Vol.347 (1), p.1-2

Yau, Horng-Tzer

2016

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Characterization and dressing effect of CMP diamond disc conditioner with ordered abrasive distribution

International journal of advanced manufacturing technology, 2023-09, Vol.128 (3-4), p.1029-1048

2023

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Mathematical modeling of material removal rate in roll-type linear CMP (roll-CMP) process: Effect of polishing pad

International journal of precision engineering and manufacturing, 2016-04, Vol.17 (4), p.495-501

Lee, Hyunseop

2016

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Novel polyelectrolyte–Al 2 O 3 /SiO 2 composite nanoabrasives for improved chemical mechanical polishing (CMP) of sapphire

Journal of materials research, 2019-03, Vol.34 (6), p.1073-1082

2019

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Computational aided design of a halotolerant CMP kinase for enzymatic synthesis of cytidine triphosphate

Bioprocess and biosystems engineering, 2023-04, Vol.46 (4), p.499-505

2023

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Pasteurella multocida CMP-sialic acid synthetase and mutants of Neisseria meningitidis CMP-sialic acid synthetase with improved substrate promiscuity

Applied microbiology and biotechnology, 2012-03, Vol.93 (6), p.2411-2423

2012

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Modeling of step height reduction with temperature function in copper CMP

Journal of Mechanical Science and Technology, 2023, 37(12), , pp.6213-6220

2023

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The Effect of Cu2+ Ions and Glycine Complex on Chemical Mechanical Polishing (CMP) Performance of SiC Substrates

Tribology letters, 2021-09, Vol.69 (3), Article 94

2021

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Re-engineering the ant colony optimization for CMP architectures

The Journal of supercomputing, 2020-06, Vol.76 (6), p.4581-4602

2020

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New Feature for CMP: Noted Author’s Question Period

Culture, medicine and psychiatry, 2018-03, Vol.42 (1), p.1-1

Gaines, Atwood D.

2018

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Weighted CMP inverse of an operator between Hilbert spaces

Revista de la Real Academia de Ciencias Exactas, Físicas y Naturales. Serie A, Matemáticas, 2019-07, Vol.113 (3), p.2155-2173

2019

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Properties of the CMP inverse and its computation

Computational & applied mathematics, 2022-06, Vol.41 (4), Article 131

2022

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Scratch formation and its mechanism in chemical mechanical planarization (CMP)

Friction, 2013-12, Vol.1 (4), p.279-305

2013

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Bacterial CMP-sialic acid synthetases: production, properties, and applications

Applied microbiology and biotechnology, 2008-10, Vol.80 (5), p.757-765, Article 757

2008

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Perturbation bounds for DMP and CMP inverses of tensors via Einstein product

Computational & applied mathematics, 2020-03, Vol.39 (1), Article 28

2020

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Weighted quaternion core-EP, DMP, MPD, and CMP inverses and their determinantal representations

Revista de la Real Academia de Ciencias Exactas, Físicas y Naturales. Serie A, Matemáticas, 2020-10, Vol.114 (4), Article 198

Kyrchei, Ivan

2020

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Effect of glycine on copper CMP

International Journal of Precision Engineering and Manufacturing-Green Technology, 2016, 3(2), , pp.155-159

2016

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Nanocatalyst-induced hydroxyl radical (·OH) slurry for tungsten CMP for next-generation semiconductor processing

Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review

The CMP inverse for rectangular matrices

Novel polyelectrolyte–Al2O3/SiO2 composite nanoabrasives for improved chemical mechanical polishing (CMP) of sapphire

Slurry components in metal chemical mechanical planarization (CMP) process: A review

Preparation of SiC/SiO2 Hard Core–Soft Shell Abrasive and Its CMP Behavior on Sapphire Substrate

The influence of pH and H2O2 on surface quality and material removal rate during W-CMP

Effect of DL-alanine as an auxiliary complexing agent in TSV copper film CMP

A Half-Century of CMP

Characterization and dressing effect of CMP diamond disc conditioner with ordered abrasive distribution

Mathematical modeling of material removal rate in roll-type linear CMP (roll-CMP) process: Effect of polishing pad

Novel polyelectrolyte–Al 2 O 3 /SiO 2 composite nanoabrasives for improved chemical mechanical polishing (CMP) of sapphire

Computational aided design of a halotolerant CMP kinase for enzymatic synthesis of cytidine triphosphate

Pasteurella multocida CMP-sialic acid synthetase and mutants of Neisseria meningitidis CMP-sialic acid synthetase with improved substrate promiscuity

Modeling of step height reduction with temperature function in copper CMP

The Effect of Cu2+ Ions and Glycine Complex on Chemical Mechanical Polishing (CMP) Performance of SiC Substrates

Re-engineering the ant colony optimization for CMP architectures

New Feature for CMP: Noted Author’s Question Period

Weighted CMP inverse of an operator between Hilbert spaces

Properties of the CMP inverse and its computation

Scratch formation and its mechanism in chemical mechanical planarization (CMP)

Bacterial CMP-sialic acid synthetases: production, properties, and applications

Perturbation bounds for DMP and CMP inverses of tensors via Einstein product

Weighted quaternion core-EP, DMP, MPD, and CMP inverses and their determinantal representations

Effect of glycine on copper CMP

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