UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

A Review of Low-temperature Sealing Technologies using Metal Thin Films and Solders for Sensors and MEMS

IEEJ transactions on sensors and micromachines, 2016-06, Vol.136 (6), p.266-273

2016

Volltextzugriff (PDF)

Low-Temperature Bonding of Nanolayered InGaP/SiO2Waveguides for Spontaneous-Parametric Down Conversion

ACS applied nano materials, 2022-02, Vol.5 (2), p.2550

2022

Volltextzugriff (PDF)

Review of Low-Temperature Bonding Technologies and Their Application in Optoelectronic Devices

Electronics and communications in Japan, 2016-03, Vol.99 (3), p.63-71

2016

Volltextzugriff (PDF)

Investigation of bonding mechanism for low-temperature CuCu bonding with passivation layer

Applied surface science, 2022-08, Vol.592, Article 153243

2022

Volltextzugriff (PDF)

Interconnection Technology Based on InSn Solder for Flexible Display Applications

ETRI Journal, 2015, 37(2), , pp.387-394

2015

Volltextzugriff (PDF)

Materials, processing and reliability of low temperature bonding in 3D chip stacking

Journal of alloys and compounds, 2018-06, Vol.750, p.980-995

2018

Volltextzugriff (PDF)

Development of low temperature CuCu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)

Microelectronics and reliability, 2021-12, Vol.127, Article 114412

2021

Volltextzugriff (PDF)

Low temperature Cu/SiO2 hybrid bonding via 〈111〉-oriented nanotwinned Cu with Ar plasma surface modification

Applied surface science, 2023-11, Vol.636, Article 157854

2023

Volltextzugriff (PDF)

Influence of (111) texture on bonding strength in low-temperature bonding of nanotwinned Ag films: Experimental insights and void closure modeling

Materials & design, 2024-04, Vol.240, p.112839, Article 112839

2024

Volltextzugriff (PDF)

Highly Conductive Cu–Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles

ACS applied materials & interfaces, 2016-12, Vol.8 (48), p.33289-33298

2016

Volltextzugriff (PDF)

Highly reliable CuCu low temperature bonding using SAC305 solder with rGO interlayer

Microelectronics and reliability, 2022-02, Vol.129, Article 114483

2022

Volltextzugriff (PDF)

Low-temperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integration

Applied surface science, 2023-02, Vol.610, p.155470, Article 155470

2023

Volltextzugriff (PDF)

Characterization of Cu-Cu direct bonding in ambient atmosphere enabled using (111)-oriented nanotwinned-copper

Materials chemistry and physics, 2023-09, Vol.306, p.128089, Article 128089

2023

Volltextzugriff (PDF)

Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)

Microelectronics and reliability, 2021-12, Vol.127, p.114412, Article 114412

2021

Volltextzugriff (PDF)

Vertical Interconnections by Electroless Pd Atoms on Immersion Au Surface for Heterogeneous Integration

Journal of the Electrochemical Society, 2024-07, Vol.171 (7), p.72502

2024

Volltextzugriff (PDF)

Highly uniform microfluidic electroless interconnections for chip stacking applications

Electrochimica acta, 2021-04, Vol.376, p.138032, Article 138032

2021

Volltextzugriff (PDF)

The formation of Cu-Cu joints by low temperature sintering Cu NPs with copper formate layer and its oxidation enhancement

Materials letters, 2023-05, Vol.339, p.134087, Article 134087

2023

Volltextzugriff (PDF)

Direct bonding of silicon and quartz glass using VUV/O3 activation and a multistep low-temperature annealing process

Applied surface science, 2018-09, Vol.453, p.416-422

2018

Volltextzugriff (PDF)

Novel Cu-Ag composite nanoparticle paste for low temperature bonding

Materials letters, 2019-08, Vol.248, p.78-81

2019

Volltextzugriff (PDF)

Interfacial void ripening in CuCu joints

Materials characterization, 2021-11, Vol.181, Article 111459

2021

Volltextzugriff (PDF)

Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces

Materials, 2022-03, Vol.15 (5), p.1888

2022

Volltextzugriff (PDF)

Low temperature Cu/SiO2 hybrid bonding via 〈1 1 1〉-oriented nanotwinned Cu with Ar plasma surface modification

Applied surface science, 2023-11, Vol.636, p.157854, Article 157854

2023

Volltextzugriff (PDF)

Einkleben von Gewindestangen in Laubholz bei niedrigen Temperaturen

Die Bautechnik, 2020-11, Vol.97 (S2), p.86-96

2020

Volltextzugriff (PDF)

Low-Temperature Direct Bonding of Sputtered Nanocrystalline Ag Film for Power Electronic Packaging: Bonding Mechanism, Thermal Characteristics, and Reliability

IEEE transactions on power electronics, 2024-05, Vol.39 (5), p.6040-6051

2024

Volltextzugriff (PDF)

Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management

IEEE electron device letters, 2024-03, Vol.45 (3), p.448-451

2024

Volltextzugriff (PDF)

1 – 25 von 2.336

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(1.768)
Mit Volltextzugriff
(1.906)

Publikationsform

1 weiteren anzeigen...

Weniger anzeigen...

Sprache

Englisch
(2.303)
Japanisch
(49)
Chinesisch
(12)
Deutsch
(1)

Erscheinungsjahr

n.n

Thema

Science & Technology
(1.811)
Low Temperature
(1.790)
Technology
(1.255)
Physical Sciences
(1.075)
Materials Science
(821)
Bonding Strength
(778)
Bonding
(742)
Materials Science, Multidisciplinary
(676)
Engineering
(659)
Physics
(624)
Chemistry
(594)
Engineering, Electrical & Electronic
(498)
Physics, Applied
(457)
Hydrogen Bonding
(456)
Temperature
(378)
Copper
(335)
Substrates
(275)
High Temperature
(270)
Chemical Bonds
(263)
Chemistry, Physical
(251)

15 weitere anzeigen...

Weniger anzeigen...

Neu hinzugefügt

Menü

Weitere Dienste

Einstellungen

A Review of Low-temperature Sealing Technologies using Metal Thin Films and Solders for Sensors and MEMS

Low-Temperature Bonding of Nanolayered InGaP/SiO2Waveguides for Spontaneous-Parametric Down Conversion

Review of Low-Temperature Bonding Technologies and Their Application in Optoelectronic Devices

Investigation of bonding mechanism for low-temperature CuCu bonding with passivation layer

Interconnection Technology Based on InSn Solder for Flexible Display Applications

Materials, processing and reliability of low temperature bonding in 3D chip stacking

Development of low temperature CuCu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)

Low temperature Cu/SiO2 hybrid bonding via 〈111〉-oriented nanotwinned Cu with Ar plasma surface modification

Influence of (111) texture on bonding strength in low-temperature bonding of nanotwinned Ag films: Experimental insights and void closure modeling

Highly Conductive Cu–Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles

Highly reliable CuCu low temperature bonding using SAC305 solder with rGO interlayer

Low-temperature hybrid bonding with high electromigration resistance scheme for application on heterogeneous integration

Characterization of Cu-Cu direct bonding in ambient atmosphere enabled using (111)-oriented nanotwinned-copper

Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)

Vertical Interconnections by Electroless Pd Atoms on Immersion Au Surface for Heterogeneous Integration

Highly uniform microfluidic electroless interconnections for chip stacking applications

The formation of Cu-Cu joints by low temperature sintering Cu NPs with copper formate layer and its oxidation enhancement

Direct bonding of silicon and quartz glass using VUV/O3 activation and a multistep low-temperature annealing process

Novel Cu-Ag composite nanoparticle paste for low temperature bonding

Interfacial void ripening in CuCu joints

Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces

Low temperature Cu/SiO2 hybrid bonding via 〈1 1 1〉-oriented nanotwinned Cu with Ar plasma surface modification

Einkleben von Gewindestangen in Laubholz bei niedrigen Temperaturen

Low-Temperature Direct Bonding of Sputtered Nanocrystalline Ag Film for Power Electronic Packaging: Bonding Mechanism, Thermal Characteristics, and Reliability

Heterogeneous Integration of Diamond-on-Chip-on-Glass Interposer for Efficient Thermal Management

Suchergebnisse filtern