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In-situ measurement of thermal expansion in Cu/SiO2 hybrid structures using atomic force microscopy at elevated temperatures

Applied surface science, 2024-07, Vol.662, p.160103, Article 160103

2024

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Area-Selective Electroless Deposition of Cu for Hybrid Bonding

IEEE electron device letters, 2021-12, Vol.42 (12), p.1826-1829

2021

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Periodic reverse electrodeposition of (111)-oriented nanotwinned Cu in small damascene SiO2 vias

Journal of electroanalytical chemistry (Lausanne, Switzerland), 2023-04, Vol.935, p.117328, Article 117328

2023

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Hybrid Bonding for Ultra-High-Density Interconnect

Journal of electronic packaging, 2024-09, Vol.146 (3)

Lu, Mei-Chien

2024

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Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces

Materials, 2022-03, Vol.15 (5), p.1888

2022

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Surface co-hydrophilization via ammonia inorganic strategy for low-temperature Cu/SiO2 hybrid bonding

Journal of materials science & technology, 2023-06, Vol.149, p.161-166

2023

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In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration

Microelectronic engineering, 2022-05, Vol.261, p.111809, Article 111809

2022

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Potassium hydroxide surface modification for low temperature Cu/SiO2 hybrid bonding

Surfaces and interfaces, 2023-08, Vol.40, p.103076, Article 103076

2023

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Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints

Nanomaterials (Basel, Switzerland), 2023-08, Vol.13 (17), p.2448

2023

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Semiconductor Advanced Packaging

Lau, John H

1st Edition 2021, 2021

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Development of low temperature CuCu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)

Microelectronics and reliability, 2021-12, Vol.127, Article 114412

2021

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Low temperature Cu/SiO2 hybrid bonding via 〈111〉-oriented nanotwinned Cu with Ar plasma surface modification

Applied surface science, 2023-11, Vol.636, Article 157854

2023

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Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)

Microelectronics and reliability, 2021-12, Vol.127, p.114412, Article 114412

2021

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Prediction and fitting of weld morphology of Al alloy-CFRP welding-rivet hybrid bonding joint based on GA-BP neural network

Journal of manufacturing processes, 2021-03, Vol.63, p.109-120

2021

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Chemical mechanical planarization of nanotwinned copper/polyimide for low temperature hybrid bonding

Journal of electroanalytical chemistry (Lausanne, Switzerland), 2024-09, Vol.969, p.118544, Article 118544

2024

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Low temperature Cu/SiO2 hybrid bonding via 〈1 1 1〉-oriented nanotwinned Cu with Ar plasma surface modification

Applied surface science, 2023-11, Vol.636, p.157854, Article 157854

2023

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A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications

IEEE electron device letters, 2024-03, Vol.45 (3), p.452-455

2024

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TSV Integration with Chip Level TSV-to-Pad Cu/SiO2 Hybrid Bonding for DRAM Multiple Layer Stacking

IEEE electron device letters, 2023-07, Vol.44 (7), p.1-1

2023

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Multi-tier die stacking through collective die-to-wafer hybrid bonding

2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.637-642

2024

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Investigation of the influence of aluminum surficial water on aluminum-plastic hybrids through a combined experimental and simulation approach

Applied surface science, 2024-05, Vol.656, p.159694, Article 159694

2024

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Negative-Tone Photosensitive Polymeric Bonding Material to Enable Room Temperature Pre-Bond for Cu/Polymer Hybrid Bonding

IEEE transactions on components, packaging, and manufacturing technology (2011), 2023-08, p.1-1

2023

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Low-temperature Cu/SiO2 hybrid bonding based on Ar/H2 plasma and citric acid cooperative activation for multi-functional chip integration

Applied surface science, 2024-03, Vol.648, p.159074, Article 159074

2024

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Enhanced thermal expansion with nanocrystalline Cu in SiO2 vias for hybrid bonding

Applied surface science, 2024-11, Vol.672, p.160784, Article 160784

2024

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High-Performance 3-D Placement Engine With Physical-Aware Incremental Partitioning

IEEE transactions on circuits and systems. II, Express briefs, 2024-03, Vol.71 (3), p.1151-1155

2024

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Recent Advances and Trends in Cu-Cu Hybrid Bonding

IEEE transactions on components, packaging, and manufacturing technology (2011), 2023-03, Vol.13 (3), p.399-425

Lau, John H.

2023

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In-situ measurement of thermal expansion in Cu/SiO2 hybrid structures using atomic force microscopy at elevated temperatures

Area-Selective Electroless Deposition of Cu for Hybrid Bonding

Periodic reverse electrodeposition of (111)-oriented nanotwinned Cu in small damascene SiO2 vias

Hybrid Bonding for Ultra-High-Density Interconnect

Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces

Surface co-hydrophilization via ammonia inorganic strategy for low-temperature Cu/SiO2 hybrid bonding

In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration

Potassium hydroxide surface modification for low temperature Cu/SiO2 hybrid bonding

Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints

Semiconductor Advanced Packaging

Development of low temperature CuCu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)

Low temperature Cu/SiO2 hybrid bonding via 〈111〉-oriented nanotwinned Cu with Ar plasma surface modification

Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)

Prediction and fitting of weld morphology of Al alloy-CFRP welding-rivet hybrid bonding joint based on GA-BP neural network

Chemical mechanical planarization of nanotwinned copper/polyimide for low temperature hybrid bonding

Low temperature Cu/SiO2 hybrid bonding via 〈1 1 1〉-oriented nanotwinned Cu with Ar plasma surface modification

A Novel Low-Warpage Hyper RDL (HRDL) Interposer Enabled by Low Temperature Hybrid Bonding for Advanced Packaging Applications

TSV Integration with Chip Level TSV-to-Pad Cu/SiO2 Hybrid Bonding for DRAM Multiple Layer Stacking

Multi-tier die stacking through collective die-to-wafer hybrid bonding

Investigation of the influence of aluminum surficial water on aluminum-plastic hybrids through a combined experimental and simulation approach

Negative-Tone Photosensitive Polymeric Bonding Material to Enable Room Temperature Pre-Bond for Cu/Polymer Hybrid Bonding

Low-temperature Cu/SiO2 hybrid bonding based on Ar/H2 plasma and citric acid cooperative activation for multi-functional chip integration

Enhanced thermal expansion with nanocrystalline Cu in SiO2 vias for hybrid bonding

High-Performance 3-D Placement Engine With Physical-Aware Incremental Partitioning

Recent Advances and Trends in Cu-Cu Hybrid Bonding

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