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Journal of the European Ceramic Society, 2024-06, p.116671, Article 116671
2024
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Sensors (Basel, Switzerland), 2020-07, Vol.20 (15), p.4080
2020
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IEEE transactions on circuits and systems. I, Regular papers, 2020-04, Vol.67 (4), p.1319-1332
2020
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IEEE transactions on computer-aided design of integrated circuits and systems, 2016-09, Vol.35 (9), p.1546-1556
2016
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IET computers & digital techniques, 2018-05, Vol.12 (3), p.69-79
2018
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2019 IEEE International Symposium on Circuits and Systems (ISCAS), 2019, p.1-5
2019
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IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-09, Vol.11 (9), p.1435-1441
2021
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2022 7th International Conference on Integrated Circuits and Microsystems (ICICM), 2022, p.578-583
2022
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Soft computing (Berlin, Germany), 2023-11, Vol.27 (22), p.17043-17062
2023
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Engineering fracture mechanics, 2017-06, Vol.178, p.1-13
2017
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IEEE Custom Integrated Circuits Conference 2006, 2006, p.555-562
2006
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2019 IEEE 2nd International Conference on Electronics and Communication Engineering (ICECE), 2019, p.226-229
2019
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2016 International Conference on Electronics Packaging (ICEP), 2016, p.473-478
2016
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2017 32nd Symposium on Microelectronics Technology and Devices (SBMicro), 2017, p.1-4
2017
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2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018, p.367-371
2018
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2018 31st Symposium on Integrated Circuits and Systems Design (SBCCI), 2018, p.1-6
2018
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2019 Latin American Electron Devices Conference (LAEDC), 2019, Vol.1, p.1-4
2019
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2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016, p.847-856
2016
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2016 31st Symposium on Microelectronics Technology and Devices (SBMicro), 2016, p.1-4
2016
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2018 33rd Symposium on Microelectronics Technology and Devices (SBMicro), 2018, p.1-4
2018
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IEEE transactions on electronics packaging manufacturing, 2006-04, Vol.29 (2), p.119-133
2006
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2018 IEEE International Conference on Electron Devices and Solid State Circuits (EDSSC), 2018, p.1-2
2018
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