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Mechanisms of multiple functional groups in post-CMP cleaning solutions for Co interconnects

Colloids and surfaces. A, Physicochemical and engineering aspects, 2025-01, Vol.705, p.135721, Article 135721

2025

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Study on particle removal during the Co post-CMP cleaning process

Colloids and surfaces. A, Physicochemical and engineering aspects, 2021-10, Vol.627, p.127189, Article 127189

2021

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Cleaning mechanisms during post chemical mechanical polishing (CMP) using particle removal of surfactants via a citric acid-based solution

Colloids and surfaces. A, Physicochemical and engineering aspects, 2024-09, Vol.697, p.134428, Article 134428

2024

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Effects of two mild amino acids on benzotriazole residue desorption during cobalt post-chemical mechanical polishing cleaning: Experimental and theoretical studies

Colloids and surfaces. A, Physicochemical and engineering aspects, 2024-02, Vol.683, p.133052, Article 133052

2024

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Effect of arginine-based cleaning solution on BTA residue removal after Cu-CMP

Colloids and surfaces. A, Physicochemical and engineering aspects, 2020-02, Vol.586, p.124286, Article 124286

2020

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Effect of EDTA-based alkaline cleaning solution on TAZ removal in post CMP cleaning of copper interconnection

Materials research bulletin, 2021-05, Vol.137, p.111202, Article 111202

2021

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Experimental validation and molecular dynamics simulation of removal of PO residue on Co surface by alkaline cleaning solution with different functional groups

Colloids and surfaces. A, Physicochemical and engineering aspects, 2021-02, Vol.610, p.125932, Article 125932

2021

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Synergistic effect of LABSA/JFCE combined surfactant system on the removal of particles on copper wafer surface

Materials chemistry and physics, 2021-01, Vol.257, p.123841, Article 123841

2021

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Investigation of the effect of different cleaning forces on Ce-O-Si bonding during oxide post-CMP cleaning

Applied surface science, 2021-04, Vol.545, p.149035, Article 149035

2021

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Effect of complexing agent on ceria particle removal in post-STI CMP cleaning process

Colloids and surfaces. A, Physicochemical and engineering aspects, 2023-02, Vol.658, p.130668, Article 130668

2023

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Investigations on the mechanism of silica particle removal during the Cu buff cleaning process

Colloids and surfaces. A, Physicochemical and engineering aspects, 2021-10, Vol.627, p.127156, Article 127156

2021

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Atomic-scale study on particle movement mechanism during silicon substrate cleaning using ReaxFF MD

Computational materials science, 2022-11, Vol.214, p.111751, Article 111751

2022

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Electrochemistry of copper post-CMP cleaning examined in combination with brush-scrubbing in a malonic acid solution

Journal of electroanalytical chemistry (Lausanne, Switzerland), 2024-01, Vol.953, p.118016, Article 118016

2024

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Application of an optimized alkaline cleaning solution for inhibitor removal during the post-CMP process: Performance evaluation and mechanism analysis

Journal of molecular liquids, 2023-01, Vol.369, p.120892, Article 120892

2023

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Synergistic effect of composite complex agent on BTA removal in post CMP cleaning of copper interconnection

Materials chemistry and physics, 2020-09, Vol.252, p.123230, Article 123230

2020

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Effect of a novel chelating agent on defect removal during post-CMP cleaning

Applied surface science, 2016-08, Vol.378, p.239-244

2016

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The compression deformation and particles removal of PVA brushes during the post-CMP cleaning process

Semiconductor science and technology, 2024-11, Vol.39 (11), p.115010

2024

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Composite complex agent based on organic amine alkali for BTA removal in post CMP cleaning of copper interconnection

Journal of electroanalytical chemistry (Lausanne, Switzerland), 2022-04, Vol.910, p.116187, Article 116187

2022

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Comparative evaluation of organic contamination sources from roller and pencil type PVA brushes during the Post-CMP cleaning process

Polymer testing, 2020-10, Vol.90, p.106669, Article 106669

2020

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Striking a balance: Role of supramolecular assemblies on the modulation of the chemical and mechanical contributions during Post-STI CMP cleaning

Materials chemistry and physics, 2021-02, Vol.259, p.124170, Article 124170

2021

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Development of a novel wet cleaning solution for Post-CMP SiO2 and Si3N4 films

Materials science in semiconductor processing, 2022-03, Vol.140, p.106353, Article 106353

2022

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Contamination Mechanism of Ceria Particles on the Oxide Surface after the CMP Process

ECS journal of solid state science and technology, 2020-12, Vol.9 (12), p.124004

2020

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Static and dynamic interaction between polyvinyl acetal brushes and flat surfaces—Measuring near-surface brush volume ratio and nodule volume change for moving brushes

Microelectronic engineering, 2022-02, Vol.256, p.111721, Article 111721

2022

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Study on possible root causes of contamination from an incoming PVA brush during post-CMP cleaning

Polymer testing, 2019-08, Vol.77, p.105921, Article 105921

2019

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Nodule contact path of polyvinyl acetal roller brushes on a rotating plate and its relation to cross contamination

Microelectronic engineering, 2023-01, Vol.269, p.111917, Article 111917

2023

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Mechanisms of multiple functional groups in post-CMP cleaning solutions for Co interconnects

Study on particle removal during the Co post-CMP cleaning process

Cleaning mechanisms during post chemical mechanical polishing (CMP) using particle removal of surfactants via a citric acid-based solution

Effects of two mild amino acids on benzotriazole residue desorption during cobalt post-chemical mechanical polishing cleaning: Experimental and theoretical studies

Effect of arginine-based cleaning solution on BTA residue removal after Cu-CMP

Effect of EDTA-based alkaline cleaning solution on TAZ removal in post CMP cleaning of copper interconnection

Experimental validation and molecular dynamics simulation of removal of PO residue on Co surface by alkaline cleaning solution with different functional groups

Synergistic effect of LABSA/JFCE combined surfactant system on the removal of particles on copper wafer surface

Investigation of the effect of different cleaning forces on Ce-O-Si bonding during oxide post-CMP cleaning

Effect of complexing agent on ceria particle removal in post-STI CMP cleaning process

Investigations on the mechanism of silica particle removal during the Cu buff cleaning process

Atomic-scale study on particle movement mechanism during silicon substrate cleaning using ReaxFF MD

Electrochemistry of copper post-CMP cleaning examined in combination with brush-scrubbing in a malonic acid solution

Application of an optimized alkaline cleaning solution for inhibitor removal during the post-CMP process: Performance evaluation and mechanism analysis

Synergistic effect of composite complex agent on BTA removal in post CMP cleaning of copper interconnection

Effect of a novel chelating agent on defect removal during post-CMP cleaning

The compression deformation and particles removal of PVA brushes during the post-CMP cleaning process

Composite complex agent based on organic amine alkali for BTA removal in post CMP cleaning of copper interconnection

Comparative evaluation of organic contamination sources from roller and pencil type PVA brushes during the Post-CMP cleaning process

Striking a balance: Role of supramolecular assemblies on the modulation of the chemical and mechanical contributions during Post-STI CMP cleaning

Development of a novel wet cleaning solution for Post-CMP SiO2 and Si3N4 films

Contamination Mechanism of Ceria Particles on the Oxide Surface after the CMP Process

Static and dynamic interaction between polyvinyl acetal brushes and flat surfaces—Measuring near-surface brush volume ratio and nodule volume change for moving brushes

Study on possible root causes of contamination from an incoming PVA brush during post-CMP cleaning

Nodule contact path of polyvinyl acetal roller brushes on a rotating plate and its relation to cross contamination

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