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Surface & coatings technology, 2024-01, Vol.476, p.130240, Article 130240
2024
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Surfaces and interfaces, 2022-04, Vol.29, p.101778, Article 101778
2022
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2022 IEEE Sensors, 2022, p.1-4
2022
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Journal of semiconductors, 2016-08, Vol.37 (8)
2016
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International Journal of Precision Engineering and Manufacturing-Green Technology, 2016, 3(2), , pp.189-192
2016
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Thin solid films, 2012-11, Vol.522, p.318-323
2012
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Applied surface science, 2009-01, Vol.255 (7), p.4259-4266
2009
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Journal of semiconductors, 2016-08, Vol.37 (8), p.63-66
2016
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Dong nan da xue xue bao, 2012-09, Vol.28 (3), p.310-314
2012
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2024 Conference of Science and Technology for Integrated Circuits (CSTIC), 2024, p.1-3
2024
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Advanced materials research, 2012, Vol.476-478, p.2339-2343
2012
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2013 IEEE 5th International Nanoelectronics Conference (INEC), 2013, p.245-247
2013
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2013 IEEE 5th International Nanoelectronics Conference (INEC), 2013, p.483-485
2013
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International journal of advanced manufacturing technology, 2004-03, Vol.23 (5-6), p.444-450
2004
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2017 34th National Radio Science Conference (NRSC), 2017, p.407-414
2017
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JSME International Journal Series A Solid Mechanics and Material Engineering, 2006, Vol.49(2), pp.273-281
2006
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2014 International Conference on Information Science, Electronics and Electrical Engineering, 2014, Vol.3, p.2088-2091
2014
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2014 International Conference on Information Science, Electronics and Electrical Engineering, 2014, Vol.3, p.2084-2087
2014
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2013 Saudi International Electronics, Communications and Photonics Conference, 2013, p.1-6
2013
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Electroless copper and nickel–phosphorus plating, 2011, p.37-50
2011
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