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Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates

Journal of alloys and compounds, 2017-04, Vol.701, p.533-541

2017

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Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy

Materials letters, 2019-01, Vol.235, p.180-183

2019

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A critical review on performance, microstructure and corrosion resistance of Pb-free solders

Measurement : journal of the International Measurement Confederation, 2019-02, Vol.134, p.897-907

2019

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Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Fatigue & fracture of engineering materials & structures, 2020-12, Vol.43 (12), p.2883-2891

2020

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Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures

Acta materialia, 2013-07, Vol.61 (12), p.4581-4590

2013

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Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni

Journal of alloys and compounds, 2017-02, Vol.694, p.892-904

2017

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Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module

International journal of solids and structures, 2017-02, Vol.106-107, p.1-12

2017

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Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy

Advances in colloid and interface science, 2011-08, Vol.166 (1), p.87-118

2011

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Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints

Engineering fracture mechanics, 2018-08, Vol.199, p.730-738

2018

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Distribution and Microstructure Analysis of Ceramic Particles in the Lead‐Free Solder Matrix

Crystal research and technology (1979), 2020-12, Vol.55 (12), p.n/a

2020

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Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2006-05, Vol.423 (1), p.166-169

2006

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Interfacial IMC growth of SAC305/Cu joint with a novel dual-layer of Ni(P)/Cu plating during solid-state aging

Microelectronic engineering, 2018-11, Vol.199, p.69-79

2018

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Effect of Sb content on properties of Sn—Bi solders

Transactions of Nonferrous Metals Society of China, 2014-01, Vol.24 (1), p.184-191

2014

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Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2017-01, Vol.684, p.697-705

2017

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Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock

Journal of electronic materials, 2016-12, Vol.45 (12), p.6086-6094

2016

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Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

Journal of electronic materials, 2013-06, Vol.42 (6), p.1260-1267

2013

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Obtaining and Characterization of New Materials

Sandu, Andrei Victor

2022

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Study of the Si-containing amorphous layer by electrical discharge coating: Wettability and Erosion Resistance of the Si-containing amorphous layer for Lead-free solder

Journal of the Japan Society for Precision Engineering, 2012/11/05, Vol.78(11), pp.970-974

2012

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Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy

Journal of electronic materials, 2014-01, Vol.43 (1), p.33-42

2014

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Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2010-07, Vol.527 (20), p.5212-5219

2010

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Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for SAC-R after Sustained Exposure to 50°C

2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.719-728

2021

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IEEE_Xplore

Effect of Ag, Ni and Bi Additions on Solderability of Lead-Free Solders

Journal of electronic materials, 2017-07, Vol.46 (7), p.4076-4084

2017

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Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

Journal of electronic materials, 2017-10, Vol.46 (10), p.5503-5518

2017

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Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation

Journal of electronic materials, 2013-06, Vol.42 (6), p.1085-1091

2013

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Effects of Sulfur on the Properties of Sn-9Zn as Lead-Free Solder

Journal of electronic materials, 2017-02, Vol.46 (2), p.1067-1071

2017

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Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates

Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy

A critical review on performance, microstructure and corrosion resistance of Pb-free solders

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures

Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni

Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module

Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy

Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints

Distribution and Microstructure Analysis of Ceramic Particles in the Lead‐Free Solder Matrix

Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes

Interfacial IMC growth of SAC305/Cu joint with a novel dual-layer of Ni(P)/Cu plating during solid-state aging

Effect of Sb content on properties of Sn—Bi solders

Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures

Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock

Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

Obtaining and Characterization of New Materials

Study of the Si-containing amorphous layer by electrical discharge coating: Wettability and Erosion Resistance of the Si-containing amorphous layer for Lead-free solder

Electromigration Damage Characterization in Sn-3.9Ag-0.7Cu and Sn-3.9Ag-0.7Cu-0.5Ce Solder Joints by Three-Dimensional X-ray Tomography and Scanning Electron Microscopy

Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn–9Zn lead-free solders

Evolution of High-Temperature and Low-Temperature High Strain Rate Properties for SAC-R after Sustained Exposure to 50°C

Effect of Ag, Ni and Bi Additions on Solderability of Lead-Free Solders

Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

Mechanical Characterization of Lead-Free Sn-Ag-Cu Solder Joints by High-Temperature Nanoindentation

Effects of Sulfur on the Properties of Sn-9Zn as Lead-Free Solder

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