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A critical review on performance, microstructure and corrosion resistance of Pb-free solders

Measurement : journal of the International Measurement Confederation, 2019-02, Vol.134, p.897-907

2019

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Distribution and Microstructure Analysis of Ceramic Particles in the Lead‐Free Solder Matrix

Crystal research and technology (1979), 2020-12, Vol.55 (12), p.n/a

2020

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Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module

International journal of solids and structures, 2017-02, Vol.106-107, p.1-12

2017

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Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2017-01, Vol.684, p.697-705

2017

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Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2006-05, Vol.423 (1), p.166-169

2006

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Nonlinear finite element simulations on the mechanical response of the isothermally aged lead-free solders

Proceedings of the Institution of Mechanical Engineers. Part L, Journal of materials, design and applications, 2023-11, Vol.237 (11), p.2421-2431

Gharaibeh, Mohammad A

2023

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Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy

Materials letters, 2019-01, Vol.235, p.180-183

2019

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Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates

Journal of alloys and compounds, 2017-04, Vol.701, p.533-541

2017

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Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

Journal of electronic materials, 2017-10, Vol.46 (10), p.5503-5518

2017

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Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Fatigue & fracture of engineering materials & structures, 2020-12, Vol.43 (12), p.2883-2891

2020

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Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni

Journal of alloys and compounds, 2017-02, Vol.694, p.892-904

2017

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Effect of Ag, Ni and Bi Additions on Solderability of Lead-Free Solders

Journal of electronic materials, 2017-07, Vol.46 (7), p.4076-4084

2017

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Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

JOM (1989), 2009-06, Vol.61 (6), p.45-51

2009

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Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

Journal of electronic materials, 2016-01, Vol.45 (1), p.88-97

2016

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Interfacial IMC growth of SAC305/Cu joint with a novel dual-layer of Ni(P)/Cu plating during solid-state aging

Microelectronic engineering, 2018-11, Vol.199, p.69-79

2018

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Crystal Plasticity Finite-Element Analysis of Deformation Behavior in Multiple-Grained Lead-Free Solder Joints

Journal of electronic materials, 2013-02, Vol.42 (2), p.201-214

2013

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Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints

Engineering fracture mechanics, 2018-08, Vol.199, p.730-738

2018

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Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures

Acta materialia, 2013-07, Vol.61 (12), p.4581-4590

2013

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Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy

Advances in colloid and interface science, 2011-08, Vol.166 (1), p.87-118

2011

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Effects of Silver and Antimony Content in Lead-Free High-Temperature Solders of Bi-Ag and Bi-Sb on Copper Substrate

Journal of electronic materials, 2014-02, Vol.43 (2), p.579-585

2014

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Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

Journal of electronic materials, 2013-06, Vol.42 (6), p.1260-1267

2013

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Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock

Journal of electronic materials, 2016-12, Vol.45 (12), p.6086-6094

2016

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Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy

Journal of electronic materials, 2008-07, Vol.37 (7), p.982-991

2008

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Study of the Si-containing amorphous layer by electrical discharge coating: Wettability and Erosion Resistance of the Si-containing amorphous layer for Lead-free solder

Journal of the Japan Society for Precision Engineering, 2012/11/05, Vol.78(11), pp.970-974

2012

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Effects of Minute Addition of Ni on Microstructure and Mechanical Properties of Sn-Zn Eutectic Alloy

Journal of electronic materials, 2016-10, Vol.45 (10), p.5468-5477

2016

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A critical review on performance, microstructure and corrosion resistance of Pb-free solders

Distribution and Microstructure Analysis of Ceramic Particles in the Lead‐Free Solder Matrix

Modeling of intergranular thermal fatigue cracking of a lead-free solder joint in a power electronic module

Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures

Improving the performance of lead-free solder reinforced with multi-walled carbon nanotubes

Nonlinear finite element simulations on the mechanical response of the isothermally aged lead-free solders

Enhancement of the mechanical strength of Sn-3.0Ag-0.5Cu/Ni joints via doping minor Ni into solder alloy

Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates

Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging

Temperature‐dependent fatigue modelling of a novel Ni, Bi and Sb containing Sn‐3.8Ag‐0.7Cu lead‐free solder alloy

Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni

Effect of Ag, Ni and Bi Additions on Solderability of Lead-Free Solders

Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates

Microstructural Evolution of Lead-Free Solder Joints in Ultrasonic-Assisted Soldering

Interfacial IMC growth of SAC305/Cu joint with a novel dual-layer of Ni(P)/Cu plating during solid-state aging

Crystal Plasticity Finite-Element Analysis of Deformation Behavior in Multiple-Grained Lead-Free Solder Joints

Effect of temperature on the fracture behavior of Cu/SAC305/Cu solder joints

Interfacial reaction between Sn–Ag–Cu solder and Co–P films with various microstructures

Reactive wetting, evolution of interfacial and bulk IMCs and their effect on mechanical properties of eutectic Sn–Cu solder alloy

Effects of Silver and Antimony Content in Lead-Free High-Temperature Solders of Bi-Ag and Bi-Sb on Copper Substrate

Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste

Study on Subgrain Rotation Behavior at Different Interfaces of a Solder Joint During Thermal Shock

Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy

Study of the Si-containing amorphous layer by electrical discharge coating: Wettability and Erosion Resistance of the Si-containing amorphous layer for Lead-free solder

Effects of Minute Addition of Ni on Microstructure and Mechanical Properties of Sn-Zn Eutectic Alloy

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