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Erratum to Interdiffusion Behavior of U^sub 3^Si^sub 2^ with FeCrAl via Diffusion Couple Studies J. Nucl. Mater. 502 (2018) 356–369

Journal of nuclear materials, 2018-08, Vol.507, p.403

2018

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Potential of low-resistivity Cu2Mg for highly scaled interconnects and its challenges

Applied surface science, 2021-01, Vol.537, p.148035, Article 148035

2021

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Impeding the γ′ depletion during the interdiffusion between bond coatings and superalloys via introduction of tantalum in bond coatings

Materials & design, 2023-03, Vol.227, p.111792, Article 111792

2023

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Impact of Inherent Design Limitations for Cu-Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

IEEE transactions on electron devices, 2023-01, Vol.70 (1), p.222-229

2023

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Exploiting Two‐Step Processed Mixed 2D/3D Perovskites for Bright Green Light Emitting Diodes

Advanced optical materials, 2019-08, Vol.7 (15), p.n/a

2019

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Toward Efficient Polymer Solar Cells Processed by a Solution‐Processed Layer‐By‐Layer Approach

Advanced materials (Weinheim), 2018-08, Vol.30 (34), p.e1802499-n/a

2018

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Multichannel Interdiffusion Driven FASnI3 Film Formation Using Aqueous Hybrid Salt/Polymer Solutions toward Flexible Lead‐Free Perovskite Solar Cells

Advanced materials (Weinheim), 2017-06, Vol.29 (23), p.n/a

2017

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Lead-Halide Perovskite Solar Cells by CH3NH3I Dripping on PbI2–CH3NH3I–DMSO Precursor Layer for Planar and Porous Structures Using CuSCN Hole-Transporting Material

The journal of physical chemistry letters, 2015-03, Vol.6 (5), p.881-886

2015

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Solid solution formation in Mg2(Si,Sn) and shape of the miscibility gap

Acta materialia, 2020-02, Vol.185, p.80-88

2020

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Entropy production during ion exchange of glass

Journal of the American Ceramic Society, 2024-02, Vol.107 (2), p.880-896

2024

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Understanding the effect of tantalum on diffusion kinetics of the BCC β-(Ti, Al) phase following pseudo-binary diffusion couple method

Scripta materialia, 2024-08, Vol.249, p.116171, Article 116171

2024

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Synergistic effect of Re-base diffusion barrier and Pt modification on the oxidation behaviour of NiCrAlY coatings

Corrosion science, 2022-01, Vol.194, p.109919, Article 109919

2022

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Microstructure evolution and phase transformation of heavy-ion irradiated U–Mo/Al fuels

Journal of nuclear materials, 2020-12, Vol.541, p.152399, Article 152399

2020

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Full intermetallic joints for chip stacking by using thermal gradient bonding

Acta materialia, 2016-07, Vol.113, p.90-97

2016

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Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Scripta materialia, 2023-01, Vol.222, p.114998, Article 114998

2023

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Realizing Reduced Imperfections via Quantum Dots Interdiffusion in High Efficiency Perovskite Solar Cells

Advanced materials (Weinheim), 2020-10, Vol.32 (40), p.e2003296-n/a

2020

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The effects of tensile stress on the microstructure evolution and elemental interdiffusion behavior of (Ni,Pt)Al coating and nickel-based superalloy at 1100 ℃ for 200 h

Journal of alloys and compounds, 2023-06, Vol.946, p.169422, Article 169422

2023

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Oxidation and interdiffusion behavior of Niobium substrate coated MoSi 2 coating prepared by spark plasma sintering

Applied surface science, 2014-11, Vol.320, p.791-797

2014

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Experimental kinetic study of interdiffusion behavior and intermetallic compound Zr(Fe,Cr)2 formation at the Cr/Zry4 interface under elevated temperatures

Journal of nuclear materials, 2023-10, Vol.584, p.154595, Article 154595

2023

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Efficient, high yield perovskite photovoltaic devices grown by interdiffusion of solution-processed precursor stacking layers

Energy & environmental science, 2014, Vol.7 (8), p.2619-2623

2014

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Ionic interdiffusion as interaction mechanism between Al and Si3N4

Journal of the American Ceramic Society, 2019-08, Vol.102 (8), p.4835-4847

2019

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Light‐Induced Dynamic Activation of Copper/Silicon Interface for Highly Selective Carbon Dioxide Reduction

Angewandte Chemie International Edition, 2024-08, Vol.63 (33), p.e202403333-n/a

International ed. in English, 2024

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Mg and Al-induced phase transformation and stabilization of Ga2O3-based γ-phase spinels

Applied physics letters, 2023-07, Vol.123 (1)

2023

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Physical modeling of simultaneous heat and mass transfer: species interdiffusion, Soret effect and Dufour effect

International journal of heat and mass transfer, 2020-08, Vol.156, p.119758-6, Article 119758

2020

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Restraining the Cr-Zr interdiffusion of Cr-coated Zr alloys in high temperature environment: A Cr/CrN/Cr coating approach

Corrosion science, 2023-04, Vol.214, p.111015, Article 111015

2023

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Erratum to Interdiffusion Behavior of U^sub 3^Si^sub 2^ with FeCrAl via Diffusion Couple Studies J. Nucl. Mater. 502 (2018) 356–369

Potential of low-resistivity Cu2Mg for highly scaled interconnects and its challenges

Impeding the γ′ depletion during the interdiffusion between bond coatings and superalloys via introduction of tantalum in bond coatings

Impact of Inherent Design Limitations for Cu-Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

Exploiting Two‐Step Processed Mixed 2D/3D Perovskites for Bright Green Light Emitting Diodes

Toward Efficient Polymer Solar Cells Processed by a Solution‐Processed Layer‐By‐Layer Approach

Multichannel Interdiffusion Driven FASnI3 Film Formation Using Aqueous Hybrid Salt/Polymer Solutions toward Flexible Lead‐Free Perovskite Solar Cells

Lead-Halide Perovskite Solar Cells by CH3NH3I Dripping on PbI2–CH3NH3I–DMSO Precursor Layer for Planar and Porous Structures Using CuSCN Hole-Transporting Material

Solid solution formation in Mg2(Si,Sn) and shape of the miscibility gap

Entropy production during ion exchange of glass

Understanding the effect of tantalum on diffusion kinetics of the BCC β-(Ti, Al) phase following pseudo-binary diffusion couple method

Synergistic effect of Re-base diffusion barrier and Pt modification on the oxidation behaviour of NiCrAlY coatings

Microstructure evolution and phase transformation of heavy-ion irradiated U–Mo/Al fuels

Full intermetallic joints for chip stacking by using thermal gradient bonding

Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C

Realizing Reduced Imperfections via Quantum Dots Interdiffusion in High Efficiency Perovskite Solar Cells

The effects of tensile stress on the microstructure evolution and elemental interdiffusion behavior of (Ni,Pt)Al coating and nickel-based superalloy at 1100 ℃ for 200 h

Oxidation and interdiffusion behavior of Niobium substrate coated MoSi 2 coating prepared by spark plasma sintering

Experimental kinetic study of interdiffusion behavior and intermetallic compound Zr(Fe,Cr)2 formation at the Cr/Zry4 interface under elevated temperatures

Efficient, high yield perovskite photovoltaic devices grown by interdiffusion of solution-processed precursor stacking layers

Ionic interdiffusion as interaction mechanism between Al and Si3N4

Light‐Induced Dynamic Activation of Copper/Silicon Interface for Highly Selective Carbon Dioxide Reduction

Mg and Al-induced phase transformation and stabilization of Ga2O3-based γ-phase spinels

Physical modeling of simultaneous heat and mass transfer: species interdiffusion, Soret effect and Dufour effect

Restraining the Cr-Zr interdiffusion of Cr-coated Zr alloys in high temperature environment: A Cr/CrN/Cr coating approach

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