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Potential of low-resistivity Cu2Mg for highly scaled interconnects and its challenges

Applied surface science, 2021-01, Vol.537, p.148035, Article 148035

2021

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New Associate Editor

IEEE journal of solid-state circuits, 2023-09, Vol.58 (9), p.2403-2403

Sylvester, Dennis

2023

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Evaluating Modern GPU Interconnect: PCIe, NVLink, NV-SLI, NVSwitch and GPUDirect

IEEE transactions on parallel and distributed systems, 2020-01, Vol.31 (1), p.94-110

2020

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Self-organized 3D integrated optical interconnects

Yoshimura, Tetsuzo

1st, 2021

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Dynamic oxidation of (Mn,Co)3O4-Coated interconnects for solid oxide electrolysis cells

International journal of hydrogen energy, 2023-05, Vol.48 (86)

2023

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Performance analysis of mixed CNT bundle interconnects at 10 nm technology

IET circuits, devices & systems, 2020-10, Vol.14 (7), p.1049-1057

2020

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Lab-on-a-chip devices: How to close and plug the lab?

Microelectronic engineering, 2015-01, Vol.132, p.156-175

2015

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Non-diffracting and self-accelerating Bessel beams with on-demand tailored intensity profiles along arbitrary trajectories

Optics letters, 2021-04, Vol.46 (7), p.1494-1497

2021

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Frequency response and bandwidth analysis of multi-layer graphene nanoribbon and multi-walled carbon nanotube interconnects

Micro & nano letters, 2014-09, Vol.9 (9), p.557-560

2014

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III-V/silicon photonics for on-chip and intra-chip optical interconnects

Laser & photonics reviews, 2010-11, Vol.4 (6), p.751-779

2010

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Reduced Coating Diameter Fibers for High Density Optical Interconnects

Journal of lightwave technology, 2023-02, Vol.41 (3), p.1-11

2023

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The suitability performance of Sr2Fe1.5Mo0.5O6-δ-coated SUS430 for SOFC interconnect application

Chemical physics letters, 2022-11, Vol.807, p.140082, Article 140082

2022

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Inside Cover: Reactive Superhydrophobic Surfaces for Interlayer Electrical Connectivity in Three‐dimensional Electronics (Angew. Chem. Int. Ed. 30/2023)

Angewandte Chemie International Edition, 2023-07, Vol.62 (30), p.n/a

2023

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Multimode Optical Interconnects on Silicon Interposer Enable Confidential Hardware-to-Hardware Communication

Sensors (Basel, Switzerland), 2023-07, Vol.23 (13), p.6076

2023

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Transient liquid phase bonding (TLPB) of Cu to Cu using Sn interconnect solder reinforced by submicron Al particles

Journal of materials processing technology, 2022-09, Vol.307, p.117686, Article 117686

2022

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Printed Flexible Strain Sensor Array for Bendable Interactive Surface

Advanced functional materials, 2020-08, Vol.30 (34), p.n/a

2020

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Compact, Scalable, Fast‐Response Multimode 2 × 2 Optical Switch Based on Inverse Design

Laser & photonics reviews, 2024-10, Vol.18 (10), p.n/a

2024

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Investigation of a Metallic Interconnect Extracted from an SOFC Stack after 40,000 h of Operation

Energies (Basel), 2022-05, Vol.15 (10), p.3548

2022

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Polynomial-Based Surrogate Modeling of RF and Microwave Circuits in Frequency Domain Exploiting the Multinomial Theorem

IEEE transactions on microwave theory and techniques, 2016-12, Vol.64 (12), p.4371-4381

2016

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Advanced RF/baseband interconnect schemes for inter- and intra-ULSI communications

IEEE transactions on electron devices, 2005-07, Vol.52 (7), p.1271-1285

2005

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Security of Distance-Bounding: A Survey

ACM computing surveys, 2019-09, Vol.51 (5), p.1-33, Article 94

2019

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200-Gb/s Direct Modulation of a 50-GHz Class Laser With Advanced Digital Modulations

Journal of lightwave technology, 2021-02, Vol.39 (3), p.845-852

2021

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Real-Time Demonstration of Homodyne Coherent Bidirectional Transmission for Next-Generation Data Center Interconnects

Journal of lightwave technology, 2021-02, Vol.39 (4), p.1231-1238

2021

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Debating big data: A literature review on realizing value from big data

The journal of strategic information systems, 2017-09, Vol.26 (3), p.191-209

2017

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Performance and signal integrity analysis of intercalation-doped MLVGNR interconnects

IET circuits, devices & systems, 2020-03, Vol.14 (2), p.192-199

2020

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Potential of low-resistivity Cu2Mg for highly scaled interconnects and its challenges

New Associate Editor

Evaluating Modern GPU Interconnect: PCIe, NVLink, NV-SLI, NVSwitch and GPUDirect

Self-organized 3D integrated optical interconnects

Dynamic oxidation of (Mn,Co)3O4-Coated interconnects for solid oxide electrolysis cells

Performance analysis of mixed CNT bundle interconnects at 10 nm technology

Lab-on-a-chip devices: How to close and plug the lab?

Non-diffracting and self-accelerating Bessel beams with on-demand tailored intensity profiles along arbitrary trajectories

Frequency response and bandwidth analysis of multi-layer graphene nanoribbon and multi-walled carbon nanotube interconnects

III-V/silicon photonics for on-chip and intra-chip optical interconnects

Reduced Coating Diameter Fibers for High Density Optical Interconnects

The suitability performance of Sr2Fe1.5Mo0.5O6-δ-coated SUS430 for SOFC interconnect application

Inside Cover: Reactive Superhydrophobic Surfaces for Interlayer Electrical Connectivity in Three‐dimensional Electronics (Angew. Chem. Int. Ed. 30/2023)

Multimode Optical Interconnects on Silicon Interposer Enable Confidential Hardware-to-Hardware Communication

Transient liquid phase bonding (TLPB) of Cu to Cu using Sn interconnect solder reinforced by submicron Al particles

Printed Flexible Strain Sensor Array for Bendable Interactive Surface

Compact, Scalable, Fast‐Response Multimode 2 × 2 Optical Switch Based on Inverse Design

Investigation of a Metallic Interconnect Extracted from an SOFC Stack after 40,000 h of Operation

Polynomial-Based Surrogate Modeling of RF and Microwave Circuits in Frequency Domain Exploiting the Multinomial Theorem

Advanced RF/baseband interconnect schemes for inter- and intra-ULSI communications

Security of Distance-Bounding: A Survey

200-Gb/s Direct Modulation of a 50-GHz Class Laser With Advanced Digital Modulations

Real-Time Demonstration of Homodyne Coherent Bidirectional Transmission for Next-Generation Data Center Interconnects

Debating big data: A literature review on realizing value from big data

Performance and signal integrity analysis of intercalation-doped MLVGNR interconnects

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