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Ultra-high thermal conductive epoxy-based copper/graphite nanoplatelets materials for heat management application

Composites science and technology, 2022-06, Vol.224, p.109454, Article 109454

2022

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Effect of graphite flakes particle sizes on the microstructure and properties of graphite flakes/copper composites

Journal of alloys and compounds, 2018-10, Vol.766, p.382-390

2018

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In Situ Regeneration of Oxidized Copper Flakes Forming Nanosatellite Particles for Non‐Oxidized Highly Conductive Copper Nanocomposites

Advanced functional materials, 2023-12, Vol.33 (50), p.n/a

2023

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Performance of a solid state hydrogen storage device with finned tube heat exchanger

International journal of hydrogen energy, 2017-10, Vol.42 (43), p.26855-26871

2017

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Copper flake-coated cellulose scaffold to construct segregated network for enhancing thermal conductivity of epoxy composites

Composites. Part B, Engineering, 2019-05, Vol.165, p.772-778

2019

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Cu-based composite inks of a self-reductive Cu complex with Cu flakes for the production of conductive Cu films on cellulose paper

Materials chemistry and physics, 2017-08, Vol.197, p.87-93

2017

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Surface Modification of Copper-Based Flakes for Conductive Polymer Composites

Polymers, 2024-06, Vol.16 (12), p.1620

2024

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The microstructures and properties of graphite flake/copper composites with high volume fractions of graphite flake

New carbon materials, 2020-02, Vol.35 (1), p.58-65

2020

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Equipment-friendly encapsulation structure of SiO2/Cu for efficient infrared shield

Materials & design, 2022-02, Vol.214, p.110414, Article 110414

2022

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Delicate control of graphite flakes alignment in the copper matrices via powder selections and filling processes

Materials research express, 2024-01, Vol.11 (1), p.16517

2024

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Thin Copper Flakes for Conductive Inks Prepared by Decomposition of Copper Formate and Ultrafine Wet Milling

Advanced materials technologies, 2019-01, Vol.4 (1), p.n/a

2019

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Deposition of hermetic silver shells onto copper flakes

Journal of colloid and interface science, 2017-02, Vol.488, p.72-78

2017

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Controlling the Amount of Copper Formate Shells Surrounding Cu Flakes via Wet Method and Thermo-Compression Sinter Bonding between Cu Finishes in Air Using Flakes

Metals (Basel ), 2023-09, Vol.13 (9), p.1516

2023

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Preparation and characterization of micro-copper flakes /nano-TiO2 composite particles

Ceramics international, 2015-04, Vol.41 (3), p.3365-3370

2015

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Reliability of Copper Sintered Interconnects under Extreme Thermal Shock Conditions

IMAPSource Proceedings, 2024-03, Vol.2023 (EMPC)

2024

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Highly Conductive and Reliable Copper-Filled Isotropically Conductive Adhesives Using Organic Acids for Oxidation Prevention

Journal of electronic materials, 2015-07, Vol.44 (7), p.2479-2487

2015

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Synergistic enhancing effect of tungsten-copper coated graphite flakes and aluminum nitride nanoparticles on microstructure, mechanical and thermal properties of copper matrix composites

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2022-11, Vol.857, p.143987, Article 143987

2022

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Effect of Copper-Plated Graphite Content on the Microstructure and Properties of Copper-Graphite Composites Prepared by Spark Plasma Sintering

Journal of materials engineering and performance, 2024-01

2024

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Boosting Copper Biocidal Activity by Silver Decoration and Few‐Layer Graphene in Coatings on Textile Fibers

Global challenges, 2023-10, Vol.7 (10), p.2300113-2300113

2023

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Reliability of Copper Sintered Interconnects Under Extreme Thermal Shock Conditions

2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC), 2023, p.1-5

2023

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Precursor Dependent Structural Phase Evolution in Hydrothermally Prepared Cu2O Octahedrons and Cu Micro-Flakes and Their Structural and Optical Properties

Transactions of the Indian Institute of Metals, 2018-05, Vol.71 (5), p.1185-1191

2018

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Highly densed-MH electrode using flaky nickel powder and gas-atomized hydrogen storage alloy powder

Journal of alloys and compounds, 2002-01, Vol.330, p.846-850

2002

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Isotropically conductive adhesives filled with copper nanoparticles and micron-sized flakes

2014 15th International Conference on Electronic Packaging Technology, 2014, p.280-283

2014

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Metal hydride electrodes with lamellar-type network structure

Journal of alloys and compounds, 1997-05, Vol.253, p.665-667

1997

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Highly densed-MH electrode using flaky metal powder and gas-atomized hydrogen absorbing alloy powder

Journal of the Japan Society of Powder and Powder Metallurgy, 2001, Vol.48 (3), p.260-266

2001

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Ultra-high thermal conductive epoxy-based copper/graphite nanoplatelets materials for heat management application

Effect of graphite flakes particle sizes on the microstructure and properties of graphite flakes/copper composites

In Situ Regeneration of Oxidized Copper Flakes Forming Nanosatellite Particles for Non‐Oxidized Highly Conductive Copper Nanocomposites

Performance of a solid state hydrogen storage device with finned tube heat exchanger

Copper flake-coated cellulose scaffold to construct segregated network for enhancing thermal conductivity of epoxy composites

Cu-based composite inks of a self-reductive Cu complex with Cu flakes for the production of conductive Cu films on cellulose paper

Surface Modification of Copper-Based Flakes for Conductive Polymer Composites

The microstructures and properties of graphite flake/copper composites with high volume fractions of graphite flake

Equipment-friendly encapsulation structure of SiO2/Cu for efficient infrared shield

Delicate control of graphite flakes alignment in the copper matrices via powder selections and filling processes

Thin Copper Flakes for Conductive Inks Prepared by Decomposition of Copper Formate and Ultrafine Wet Milling

Deposition of hermetic silver shells onto copper flakes

Controlling the Amount of Copper Formate Shells Surrounding Cu Flakes via Wet Method and Thermo-Compression Sinter Bonding between Cu Finishes in Air Using Flakes

Preparation and characterization of micro-copper flakes /nano-TiO2 composite particles

Reliability of Copper Sintered Interconnects under Extreme Thermal Shock Conditions

Highly Conductive and Reliable Copper-Filled Isotropically Conductive Adhesives Using Organic Acids for Oxidation Prevention

Synergistic enhancing effect of tungsten-copper coated graphite flakes and aluminum nitride nanoparticles on microstructure, mechanical and thermal properties of copper matrix composites

Effect of Copper-Plated Graphite Content on the Microstructure and Properties of Copper-Graphite Composites Prepared by Spark Plasma Sintering

Boosting Copper Biocidal Activity by Silver Decoration and Few‐Layer Graphene in Coatings on Textile Fibers

Reliability of Copper Sintered Interconnects Under Extreme Thermal Shock Conditions

Precursor Dependent Structural Phase Evolution in Hydrothermally Prepared Cu2O Octahedrons and Cu Micro-Flakes and Their Structural and Optical Properties

Highly densed-MH electrode using flaky nickel powder and gas-atomized hydrogen storage alloy powder

Isotropically conductive adhesives filled with copper nanoparticles and micron-sized flakes

Metal hydride electrodes with lamellar-type network structure

Highly densed-MH electrode using flaky metal powder and gas-atomized hydrogen absorbing alloy powder

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