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Tailored thermal expansion alloys

Acta materialia, 2016-01, Vol.102, p.333-341

2016

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High-accuracy thermal expansion coefficient measurement based on fiber-optic EFPIs with automatic temperature compensation

IEEE sensors journal, 2023-09, Vol.23 (17), p.1-1

2023

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Three-dimensional braided composites with zero, negative and isotropic thermal expansion behavior

Journal of composite materials, 2020-06, Vol.54 (13), p.1761-1781

2020

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Thermal properties of graphene/metal composites with aligned graphene

Materials & design, 2018-02, Vol.140, p.85-94

2018

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Tailored thermal expansion alloys

Acta materialia, 2015-10, Vol.102 (C)

2015

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Thermomechanical properties of copper–carbon nanofibre composites prepared by spark plasma sintering and hot pressing

Composites science and technology, 2010-12, Vol.70 (16), p.2263-2268

2010

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Promoting nanoprecipitates via prefabricated defects to pin dislocations and grain boundaries for trading off high-strength and low-thermal-expansion of invar alloys

Journal of alloys and compounds, 2024-08, Vol.994, Article 174770

2024

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Multifunctional performance of carbon nanotubes and graphene nanoplatelets reinforced PEEK composites enabled via FFF additive manufacturing

Composites. Part B, Engineering, 2020-03, Vol.184, p.107625, Article 107625

2020

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高温下における炭素繊維強化ポリアミド樹脂の繊維樹脂界面せん断強度に及ぼす樹脂へのシリカ添加の影響

材料, 2022/06/15, Vol.71(6), pp.501-507

2022

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Material characterization of geopolymer mortar for its beneficial use in composite construction

RILEM Technical Letters, 2021-02, Vol.5, p.174-185

2021

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Colorless polyimides derived from 1S,2S,4R,5R-cyclohexanetetracarboxylic dianhydride, self-orientation behavior during solution casting, and their optoelectronic applications

Polymer (Guilford), 2014-09, Vol.55 (18), p.4693-4708

2014

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Synthetic strategies for highly transparent and colorless polyimide film

Journal of applied polymer science, 2022-07, Vol.139 (28), p.n/a

2022

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Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix: Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation

ACS applied materials & interfaces, 2013-08, Vol.5 (15), p.7633-7640

2013

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Drastic tailorable thermal expansion chiral planar and cylindrical shell structures explored with finite element simulation

Composite structures, 2019-02, Vol.210, p.327-338

2019

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Synthesis of colorless transparent poly(amide-imide) with high modulus and low thermal expansion coefficient and its performance study

Polymer (Guilford), 2024-02, Vol.293, p.126691, Article 126691

2024

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Synthesis of highly thermoplastic polyamide-imides with high transparency and low coefficient of thermal expansion

Polymer (Guilford), 2023-08, Vol.282, p.126093, Article 126093

2023

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A review on thermomechanical properties of polymers and fibers reinforced polymer composites

Journal of Industrial and Engineering Chemistry, 2018, 67(0), , pp.1-11

2018

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Quench sensitivity of the extruded Mg-6Zn-0.2Zr/Mg2Si composite: Position dependence and role of dislocation density

Journal of alloys and compounds, 2024-06, Vol.988, Article 174290

2024

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Growth and characterization of thermal properties of single crystals of solid solutions MnxFe1-xIn2S4

Journal of crystal growth, 2024-08, Vol.640, Article 127763

2024

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Phase transformations and thermal expansion coefficients of unirradiated U-X wt.% Zr (X = 6, 10, 20, 30) measured via neutron diffraction

Journal of nuclear materials, 2023-03, Vol.579 (-)

2023

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Low-κ, low CTE, high-temperature epoxy resin with high storage modulus based on spirobisindane for high-frequency electronic circuit field

European polymer journal, 2024-06, Vol.214, Article 113136

2024

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Synthesis and properties of novel poly(ester-amide-imide)s containing pendant phthalimide substituents

High performance polymers, 2024-05, Vol.36 (4), p.242-255

2024

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High-temperature digital image correlation method for full-field deformation measurement at 1200 °C

Measurement science & technology, 2011, Vol.22 (1), p.015701

2011

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High performance epoxy resin with ultralow coefficient of thermal expansion cured by conformation-switchable multi-functional agent

Chemical engineering journal (Lausanne, Switzerland : 1996), 2022-12, Vol.450, p.138295, Article 138295

2022

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Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

Microelectronic engineering, 2015-04, Vol.137, p.101-104

2015

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Tailored thermal expansion alloys

High-accuracy thermal expansion coefficient measurement based on fiber-optic EFPIs with automatic temperature compensation

Three-dimensional braided composites with zero, negative and isotropic thermal expansion behavior

Thermal properties of graphene/metal composites with aligned graphene

Tailored thermal expansion alloys

Thermomechanical properties of copper–carbon nanofibre composites prepared by spark plasma sintering and hot pressing

Promoting nanoprecipitates via prefabricated defects to pin dislocations and grain boundaries for trading off high-strength and low-thermal-expansion of invar alloys

Multifunctional performance of carbon nanotubes and graphene nanoplatelets reinforced PEEK composites enabled via FFF additive manufacturing

高温下における炭素繊維強化ポリアミド樹脂の繊維樹脂界面せん断強度に及ぼす樹脂へのシリカ添加の影響

Material characterization of geopolymer mortar for its beneficial use in composite construction

Colorless polyimides derived from 1S,2S,4R,5R-cyclohexanetetracarboxylic dianhydride, self-orientation behavior during solution casting, and their optoelectronic applications

Synthetic strategies for highly transparent and colorless polyimide film

Magnetic Alignment of Hexagonal Boron Nitride Platelets in Polymer Matrix: Toward High Performance Anisotropic Polymer Composites for Electronic Encapsulation

Drastic tailorable thermal expansion chiral planar and cylindrical shell structures explored with finite element simulation

Synthesis of colorless transparent poly(amide-imide) with high modulus and low thermal expansion coefficient and its performance study

Synthesis of highly thermoplastic polyamide-imides with high transparency and low coefficient of thermal expansion

A review on thermomechanical properties of polymers and fibers reinforced polymer composites

Quench sensitivity of the extruded Mg-6Zn-0.2Zr/Mg2Si composite: Position dependence and role of dislocation density

Growth and characterization of thermal properties of single crystals of solid solutions MnxFe1-xIn2S4

Phase transformations and thermal expansion coefficients of unirradiated U-X wt.% Zr (X = 6, 10, 20, 30) measured via neutron diffraction

Low-κ, low CTE, high-temperature epoxy resin with high storage modulus based on spirobisindane for high-frequency electronic circuit field

Synthesis and properties of novel poly(ester-amide-imide)s containing pendant phthalimide substituents

High-temperature digital image correlation method for full-field deformation measurement at 1200 °C

High performance epoxy resin with ultralow coefficient of thermal expansion cured by conformation-switchable multi-functional agent

Thermo-mechanical characterization of copper through-silicon vias (Cu-TSVs) using micro-Raman spectroscopy and atomic force microscopy

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