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Glass forming region and bonding mechanism of low‐melting V2O5–TeO2–Bi2O3 glass applied in vacuum glazing sealing

Journal of the American Ceramic Society, 2021-10, Vol.104 (10), p.5050-5066

2021

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Study on triple-stack anodic bonding using two electrodes

Sensors and actuators. A. Physical., 2010, Vol.157 (1), p.168-172

2010

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Modeling of anodic bonding with SiO2 dielectric as interlayer

Journal of micromechanics and microengineering, 2020-10, Vol.30 (10)

2020

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Fabrication of 32\times32 2D CMUT Arrays on a Borosilicate Glass Substrate With Silicon-Through-Wafer Interconnects Using Non-Aligned and Aligned Anodic Bonding

Journal of microelectromechanical systems, 2024-08, p.1-10

2024

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Research on the interfacial microstructure and mechanical properties of glass/Mg joint prepared by anodic bonding and vacuum diffusion bonding

Journal of manufacturing processes, 2024-06, Vol.120, p.449-459

2024

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Thermal expansion coefficient tailoring of LAS glass-ceramic for anodic bondable low temperature co-fired ceramic application

Ceramics international, 2020-03, Vol.46 (4), p.4771-4777

2020

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Wafer level hermetic sealing of MEMS devices with vertical feedthroughs using anodic bonding

Sensors and actuators. A. Physical., 2015-04, Vol.224, p.169-176

2015

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Towards low-temperature anodic bonding for RbN3-filled MEMS atomic vapor cells and defect inspection by OCT

Sensors and actuators. A. Physical., 2024-06, Vol.371, p.115305, Article 115305

2024

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Single-Crystalline 3C-SiC anodically Bonded onto Glass: An Excellent Platform for High-Temperature Electronics and Bioapplications

ACS applied materials & interfaces, 2017-08, Vol.9 (33), p.27365-27371

2017

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Triboelectric nanogenerator-based anodic bonding of silicon to glass with an intermediate aluminum layer

Sensors and actuators. A. Physical., 2021-11, Vol.331, p.112950, Article 112950

2021

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Study on the mechanism of glass-SiC-glass anodic bonding process

Journal of micromechanics and microengineering, 2024-04, Vol.34 (4), p.45010

2024

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Anodic bondable Li-Na-Al-B-Si-O glass-ceramics for Si - ULTCC heterogeneous integration

Journal of the European Ceramic Society, 2019-07, Vol.39 (7), p.2419-2426

2019

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A novel combined anodic-adhesive bonding technique for joining glass to metal for micro device applications

International journal of adhesion and adhesives, 2022-09, Vol.117, p.103175, Article 103175

2022

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Development of MEMS Acoustic Sensor With Microtunnel for High SPL Measurement

IEEE transactions on industrial electronics (1982), 2022-03, Vol.69 (3), p.3142-3150

2022

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Anodic bonding of titanium alloy with bioactive glass

Journal of non-crystalline solids, 2017-09, Vol.471, p.19-27

2017

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Microfabrication of cesium vapor cells with buffer gas for MEMS atomic clocks

Sensors and actuators. A. Physical., 2011-06, Vol.167 (2), p.594-601

2011

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Glass-Based Micro-Hotplate With Low Power Consumption and TGV Structure Through Anodic Bonding and Glass Thermal Reflow

Journal of microelectromechanical systems, 2024-07, p.1-10

2024

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Glass-Cu joining by anodic bonding and soldering with eutectic Sn-9Zn solder

Journal of alloys and compounds, 2019-06, Vol.789, p.558-566

2019

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Composites of Li-Al-B-Si-O glass and β-Al2O3 for LTCC-silicon heterogeneous integration applications

Ceramics international, 2018-11, Vol.44, p.S141-S144

2018

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電圧印加によるガラス内へのき裂形成及び金移動現象

精密工学会誌, 2022/01/05, Vol.88(1), pp.108-116

2022

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High-Efficiency Plasma Source Using a Magnetic Mirror Trap for Miniature-Ion Pumps

Sensors (Basel, Switzerland), 2023-01, Vol.23 (2), p.1040

2023

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Theoretical Derivation of the Effect of Bonding Current on the Bonding Interface during Anodic Bonding of PEG-Based Encapsulation Materials and Aluminum

Polymers, 2023-02, Vol.15 (4), p.913

2023

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The MEMS-Based Electrochemical Seismic Sensor With Integrated Sensitive Electrodes by Adopting Anodic Bonding Technology

IEEE sensors journal, 2021-09, Vol.21 (18), p.19833-19839

2021

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Design and Fabrication of Wideband Air-Coupled Capacitive Micromachined Ultrasonic Transducers With Varying Width Annular-Ring and Spiral Cell Structures

IEEE transactions on ultrasonics, ferroelectrics, and frequency control, 2021-08, Vol.68 (8), p.2749-2759

2021

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Plasma-activated high-strength non-isothermal anodic bonding for efficient fabrication of the micro atomic vapor cells

Journal of materials research and technology, 2023-11, Vol.27, p.1046-1057

2023

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Glass forming region and bonding mechanism of low‐melting V2O5–TeO2–Bi2O3 glass applied in vacuum glazing sealing

Study on triple-stack anodic bonding using two electrodes

Modeling of anodic bonding with SiO2 dielectric as interlayer

Fabrication of 32\times32 2D CMUT Arrays on a Borosilicate Glass Substrate With Silicon-Through-Wafer Interconnects Using Non-Aligned and Aligned Anodic Bonding

Research on the interfacial microstructure and mechanical properties of glass/Mg joint prepared by anodic bonding and vacuum diffusion bonding

Thermal expansion coefficient tailoring of LAS glass-ceramic for anodic bondable low temperature co-fired ceramic application

Wafer level hermetic sealing of MEMS devices with vertical feedthroughs using anodic bonding

Towards low-temperature anodic bonding for RbN3-filled MEMS atomic vapor cells and defect inspection by OCT

Single-Crystalline 3C-SiC anodically Bonded onto Glass: An Excellent Platform for High-Temperature Electronics and Bioapplications

Triboelectric nanogenerator-based anodic bonding of silicon to glass with an intermediate aluminum layer

Study on the mechanism of glass-SiC-glass anodic bonding process

Anodic bondable Li-Na-Al-B-Si-O glass-ceramics for Si - ULTCC heterogeneous integration

A novel combined anodic-adhesive bonding technique for joining glass to metal for micro device applications

Development of MEMS Acoustic Sensor With Microtunnel for High SPL Measurement

Anodic bonding of titanium alloy with bioactive glass

Microfabrication of cesium vapor cells with buffer gas for MEMS atomic clocks

Glass-Based Micro-Hotplate With Low Power Consumption and TGV Structure Through Anodic Bonding and Glass Thermal Reflow

Glass-Cu joining by anodic bonding and soldering with eutectic Sn-9Zn solder

Composites of Li-Al-B-Si-O glass and β-Al2O3 for LTCC-silicon heterogeneous integration applications

電圧印加によるガラス内へのき裂形成及び金移動現象

High-Efficiency Plasma Source Using a Magnetic Mirror Trap for Miniature-Ion Pumps

Theoretical Derivation of the Effect of Bonding Current on the Bonding Interface during Anodic Bonding of PEG-Based Encapsulation Materials and Aluminum

The MEMS-Based Electrochemical Seismic Sensor With Integrated Sensitive Electrodes by Adopting Anodic Bonding Technology

Design and Fabrication of Wideband Air-Coupled Capacitive Micromachined Ultrasonic Transducers With Varying Width Annular-Ring and Spiral Cell Structures

Plasma-activated high-strength non-isothermal anodic bonding for efficient fabrication of the micro atomic vapor cells

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