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A 2.5D Multichip SiC MOSFET Power Module With Low Parasitic Inductance and High Dynamic Current Sharing Performance

IEEE transactions on power electronics, 2024-09, p.1-11

2024

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Multi-die packaging and thermal superposition modeling

2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM), 2018, p.21-25

2018

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Negative-Tone Photosensitive Polymeric Bonding Material to Enable Room Temperature Pre-Bond for Cu/Polymer Hybrid Bonding

IEEE transactions on components, packaging, and manufacturing technology (2011), 2023-08, p.1-1

2023

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Far Back End of Line Aluminum Stress Reduction Methods for Two-Dimensional/2.5D Fine Pitch Assemblies

Journal of electronic packaging, 2017-09, Vol.139 (3)

2017

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Failure Mechanisms Investigation of Through Glass via (TGV) Under Thermal Annealing and Shock

2024 25th International Conference on Electronic Packaging Technology (ICEPT), 2024, p.1-6

2024

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Multi-scale Finite Element Simulation of 2.5D Advanced Packaging for Integrated Circuits during Manufacturing Process

2024 25th International Conference on Electronic Packaging Technology (ICEPT), 2024, p.1-5

2024

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Thermal Implications in Scaling High-Performance Server 3D Chiplet-Based 2.5D SoC from FinFET to Nanosheet

2024 IEEE Computer Society Annual Symposium on VLSI (ISVLSI), 2024, p.45-50

2024

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Development of Dielectric Material Enabling Low Insertion Loss of Organic Substrates at Various Operational Temperatures

International Symposium on Microelectronics, 2020-10, Vol.2020 (1), p.211-216

2020

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Thermal Performance of 2.5D Packaging with the Through Glass Via (TGV) Interposer

2023 24th International Conference on Electronic Packaging Technology (ICEPT), 2023, p.1-4

2023

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Systematic Design Considerations for Test Vehicle of TSV Ground Shielding Array

2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022, p.1-6

2022

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Reliable Solder Columns to Replace Solder Balls in Large 2.5D Heterogeneous Packages

IMAPSource Proceedings, 2024-02, Vol.2023 (Symposium)

Hart, Martin

2024

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Development of Highly Reliable Crack Resistive Build-up Dielectric Material with Low Df Characteristic for Next-Gen 2.5D Packages

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.570-576

2021

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Effects of 2.5D/3D Stacking Structure on Signal Integrity of Chiplet Interconnection

2024 25th International Conference on Electronic Packaging Technology (ICEPT), 2024, p.1-5

2024

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Heterogeneous Integration of Diamond-on-Chip-on-Interposer for High-Performance Thermal Management in Supercomputing 2.5D Chiplets Packaging

2024 25th International Conference on Electronic Packaging Technology (ICEPT), 2024, p.1-4

2024

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A Novel and Efficient Non-Destructive Fault Isolation Methodology for Package-on-Package Module Based on Electromagnetic/Circuit Co-Simulation

2024 25th International Conference on Electronic Packaging Technology (ICEPT), 2024, p.1-6

2024

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Design and optimization of the 10Tbps optical transmission system

2018 IEEE 20th Electronics Packaging Technology Conference (EPTC), 2018, p.669-673

2018

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Through Oxide Via (TOV) Induced Fabrication Stress on Directional Couplers in a Si Photonic Interposer

2019 IEEE Albany Nanotechnology Symposium (ANS), 2019, p.1-4

2019

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Electrical Analysis of EMIB Packages

2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2018, p.7-9

2018

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Effect of Processing Variables on the Mechanical Reliability of Copper Pillar SnAg Solder Joints

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.423-428

2017

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Study on Opto-Mechatronic Hybrid Integration Technology Based on 2.5D Advanced Packaging

2024 25th International Conference on Electronic Packaging Technology (ICEPT), 2024, p.1-4

2024

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Stress reduction methods within the Far Back End of Line (FBEOL) for fine pitch and 2.5D/3D packaging configurations

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016, p.43-50

2016

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Numerical Simulation of Cu/Polymer-Dielectric Hybrid Bonding Process using Finite Element Analysis

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.1695-1703

2022

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Reliability Assessment and Microstructure Characterization of Cu Pillars Assembled on Si and Glass Substrates

2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016, p.1141-1147

2016

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TiN Guard Ring Around TSV for Cross-Talk Suppression of Parallel Networking of Data Center

2019 International 3D Systems Integration Conference (3DIC), 2019, p.1-4

2019

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Passivation Materials for a Reliable Fine Pitch RDL

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.1583-1592

2018

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A 2.5D Multichip SiC MOSFET Power Module With Low Parasitic Inductance and High Dynamic Current Sharing Performance

Multi-die packaging and thermal superposition modeling

Negative-Tone Photosensitive Polymeric Bonding Material to Enable Room Temperature Pre-Bond for Cu/Polymer Hybrid Bonding

Far Back End of Line Aluminum Stress Reduction Methods for Two-Dimensional/2.5D Fine Pitch Assemblies

Failure Mechanisms Investigation of Through Glass via (TGV) Under Thermal Annealing and Shock

Multi-scale Finite Element Simulation of 2.5D Advanced Packaging for Integrated Circuits during Manufacturing Process

Thermal Implications in Scaling High-Performance Server 3D Chiplet-Based 2.5D SoC from FinFET to Nanosheet

Development of Dielectric Material Enabling Low Insertion Loss of Organic Substrates at Various Operational Temperatures

Thermal Performance of 2.5D Packaging with the Through Glass Via (TGV) Interposer

Systematic Design Considerations for Test Vehicle of TSV Ground Shielding Array

Reliable Solder Columns to Replace Solder Balls in Large 2.5D Heterogeneous Packages

Development of Highly Reliable Crack Resistive Build-up Dielectric Material with Low Df Characteristic for Next-Gen 2.5D Packages

Effects of 2.5D/3D Stacking Structure on Signal Integrity of Chiplet Interconnection

Heterogeneous Integration of Diamond-on-Chip-on-Interposer for High-Performance Thermal Management in Supercomputing 2.5D Chiplets Packaging

A Novel and Efficient Non-Destructive Fault Isolation Methodology for Package-on-Package Module Based on Electromagnetic/Circuit Co-Simulation

Design and optimization of the 10Tbps optical transmission system

Through Oxide Via (TOV) Induced Fabrication Stress on Directional Couplers in a Si Photonic Interposer

Electrical Analysis of EMIB Packages

Effect of Processing Variables on the Mechanical Reliability of Copper Pillar SnAg Solder Joints

Study on Opto-Mechatronic Hybrid Integration Technology Based on 2.5D Advanced Packaging

Stress reduction methods within the Far Back End of Line (FBEOL) for fine pitch and 2.5D/3D packaging configurations

Numerical Simulation of Cu/Polymer-Dielectric Hybrid Bonding Process using Finite Element Analysis

Reliability Assessment and Microstructure Characterization of Cu Pillars Assembled on Si and Glass Substrates

TiN Guard Ring Around TSV for Cross-Talk Suppression of Parallel Networking of Data Center

Passivation Materials for a Reliable Fine Pitch RDL

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