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0.015 Degree-Per-Hour Honeycomb Disk Resonator Gyroscope

IEEE sensors journal, 2021-03, Vol.21 (6), p.7326-7338

2021

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A 0.02mm2Sub-Sampling PLL with Spur Reduction Technique in 90nm CMOS Technology

2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT), 2023, p.1-4

2023

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A 0.034mm2, 725fs RMS jitter, 1.8%/V frequency-pushing, 10.8-19.3GHz transformer-based fractional-N all-digital PLL in 10nm FinFET CMOS

2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits), 2016, p.1-2

2016

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0.04 degree-per-hour MEMS disk resonator gyroscope with high-quality factor (510 k) and long decaying time constant (74.9 s)

Microsystems & nanoengineering, 2018-11, Vol.4 (1), p.32-11, Article 32

2018

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0.1°C accuracy ICO temperature sensor with segmentation algorithm

Electronics letters, 2018-05, Vol.54 (11), p.686-687

2018

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A 0.13 μm CMOS transmitter with 72-dB RF gain control for mobile WiMAX/WiBro applications

2008 IEEE Radio Frequency Integrated Circuits Symposium, 2008, p.105-108

2008

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A 0.18-/spl mu/m CMOS LNAs with sub-2 dB NF and low power for Bluetooth applications

ASICON 2001. 2001 4th International Conference on ASIC Proceedings (Cat. No.01TH8549), 2001, p.815-817

2001

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A 0.18μm CMOS single-inductor single-stage quadrature frontend for GNSS receiver

半导体学报, 2011, Vol.32 (9), p.99-105

李兵庄奕琪韩业奇邢晓岭李振荣龙强

2011

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A 0.27mm2 13.5dBm 2.4GHz all-digital polar transmitter using 34%-efficiency Class-D DPA in 40nm CMOS

2013 IEEE International Solid-State Circuits Conference Digest of Technical Papers, 2013, p.342-343

2013

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A 0.296pJ/bit 17.9Tb/s/mm2 Die-to-Die Link in 5nm/6nm FinFET on a 9μm-Pitch 3D Package Achieving 10.24Tb/s Bandwidth at 16Gb/s PAM-4

2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2024, p.1-2

2024

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0.3 THz Channel Measurement and Analysis in an L-shaped Indoor Hallway

ICC 2022 - IEEE International Conference on Communications, 2022, p.2870-2875

2022

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0.3 VT/1.1 kV AlGaN/GaN lateral power diode with MIS-gated hybrid anode on silicon substrate

2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT), 2016, p.1041-1043

2016

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0.36BiScO 3 -0.64PbTiO 3 /Epoxy 1-3-2 High-Temperature Composite Ultrasonic Transducer for Non-destructive Testing Applications

IEEE transactions on ultrasonics, ferroelectrics, and frequency control, 2024-04, Vol.PP

2024

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0.36BiScO 3 -0.64PbTiO 3 /Epoxy 1-3-2 High- Temperature Composite Ultrasonic Transducer for Nondestructive Testing Applications

IEEE transactions on ultrasonics, ferroelectrics, and frequency control, 2024-06, Vol.71 (6), p.638-647

2024

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0.36BiScO^sub 3^-0.64PbTiO^sub 3^ piezoelectric ceramics for high temperature ultrasonic transducer applications

Journal of alloys and compounds, 2018-04, Vol.743, p.365

2018

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0.36BiScO3-0.64PbTiO3/Epoxy 1-3-2 High- Temperature Composite Ultrasonic Transducer for Nondestructive Testing Applications

IEEE transactions on ultrasonics, ferroelectrics, and frequency control, 2024-06, Vol.71 (6), p.638-647

2024

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0.36BiScO3-0.64PbTiO3 piezoelectric ceramics for high temperature ultrasonic transducer applications

Journal of alloys and compounds, 2018-04, Vol.743, p.365-371

2018

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A 0.39-mm 2 Stacked Standard-CMOS Humidity Sensor Using a Charge-Redistribution Correlated Level Shifting Floating Inverter Amplifier and a VCO-Based Zoom CDC

IEEE journal of solid-state circuits, 2024-02, Vol.59 (2), p.435-448

2024

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A 0.39-mm ^ Stacked Standard-CMOS Humidity Sensor Using a Charge-Redistribution Correlated Level Shifting Floating Inverter Amplifier and a VCO-Based Zoom CDC

IEEE journal of solid-state circuits, 2024-02, p.1-14

2024

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A 0.39-mm2 Stacked Standard-CMOS Humidity Sensor Using a Charge-Redistribution Correlated Level Shifting Floating Inverter Amplifier and a VCO-Based Zoom CDC

IEEE journal of solid-state circuits, 2024-02, Vol.59 (2), p.435

2024

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0—3及4—6周龄肉仔鸡日粮能量及蛋白质沉积效率参数研究

Chung-kuo nung yeh kʿo hsüeh, 2010, Vol.43 (17), p.3624-3632

李勇蔡辉益刘国华杨志刚常文环张妹

2010

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A 0.5 nJ/Pixel 4 K H.265/HEVC Codec LSI for Multi-Format Smartphone Applications

IEEE journal of solid-state circuits, 2016-01, Vol.51 (1), p.56-67

2016

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A 0.5-V 3.69-nW Complementary Source-Follower-C Based Low-Pass Filter for Wearable Biomedical Applications

IEEE transactions on circuits and systems. I, Regular papers, 2020-12, Vol.67 (12), p.4370-4381

2020

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A 0.5-V Ultra-Low-Power Low-Pass Filter with a Bulk-Feedback Technique

2019 IEEE International Symposium on Circuits and Systems (ISCAS), 2019, p.1-5

2019

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In 0.52 Al 0.48 As Based Single Photon Avalanche Diodes With Stepped E-Field in Multiplication Layers and High Efficiency Beyond 60

IEEE journal of selected topics in quantum electronics, 2022-03, Vol.28 (2: Optical Detectors), p.1-7

2022

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0.015 Degree-Per-Hour Honeycomb Disk Resonator Gyroscope

A 0.02mm2Sub-Sampling PLL with Spur Reduction Technique in 90nm CMOS Technology

A 0.034mm2, 725fs RMS jitter, 1.8%/V frequency-pushing, 10.8-19.3GHz transformer-based fractional-N all-digital PLL in 10nm FinFET CMOS

0.04 degree-per-hour MEMS disk resonator gyroscope with high-quality factor (510 k) and long decaying time constant (74.9 s)

0.1°C accuracy ICO temperature sensor with segmentation algorithm

A 0.13 μm CMOS transmitter with 72-dB RF gain control for mobile WiMAX/WiBro applications

A 0.18-/spl mu/m CMOS LNAs with sub-2 dB NF and low power for Bluetooth applications

A 0.18μm CMOS single-inductor single-stage quadrature frontend for GNSS receiver

A 0.27mm2 13.5dBm 2.4GHz all-digital polar transmitter using 34%-efficiency Class-D DPA in 40nm CMOS

A 0.296pJ/bit 17.9Tb/s/mm2 Die-to-Die Link in 5nm/6nm FinFET on a 9μm-Pitch 3D Package Achieving 10.24Tb/s Bandwidth at 16Gb/s PAM-4

0.3 THz Channel Measurement and Analysis in an L-shaped Indoor Hallway

0.3 VT/1.1 kV AlGaN/GaN lateral power diode with MIS-gated hybrid anode on silicon substrate

0.36BiScO 3 -0.64PbTiO 3 /Epoxy 1-3-2 High-Temperature Composite Ultrasonic Transducer for Non-destructive Testing Applications

0.36BiScO 3 -0.64PbTiO 3 /Epoxy 1-3-2 High- Temperature Composite Ultrasonic Transducer for Nondestructive Testing Applications

0.36BiScO^sub 3^-0.64PbTiO^sub 3^ piezoelectric ceramics for high temperature ultrasonic transducer applications

0.36BiScO3-0.64PbTiO3/Epoxy 1-3-2 High- Temperature Composite Ultrasonic Transducer for Nondestructive Testing Applications

0.36BiScO3-0.64PbTiO3 piezoelectric ceramics for high temperature ultrasonic transducer applications

A 0.39-mm 2 Stacked Standard-CMOS Humidity Sensor Using a Charge-Redistribution Correlated Level Shifting Floating Inverter Amplifier and a VCO-Based Zoom CDC

A 0.39-mm ^ Stacked Standard-CMOS Humidity Sensor Using a Charge-Redistribution Correlated Level Shifting Floating Inverter Amplifier and a VCO-Based Zoom CDC

A 0.39-mm2 Stacked Standard-CMOS Humidity Sensor Using a Charge-Redistribution Correlated Level Shifting Floating Inverter Amplifier and a VCO-Based Zoom CDC

0—3及4—6周龄肉仔鸡日粮能量及蛋白质沉积效率参数研究

A 0.5 nJ/Pixel 4 K H.265/HEVC Codec LSI for Multi-Format Smartphone Applications

A 0.5-V 3.69-nW Complementary Source-Follower-C Based Low-Pass Filter for Wearable Biomedical Applications

A 0.5-V Ultra-Low-Power Low-Pass Filter with a Bulk-Feedback Technique

In 0.52 Al 0.48 As Based Single Photon Avalanche Diodes With Stepped E-Field in Multiplication Layers and High Efficiency Beyond 60

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