UB Paderborn / Katalog / Suche / in CDI

Sortiert nach

Einfacher Volltextzugriff von (fast) überall

Installieren Sie die LibKey Nomad-Browsererweiterung und erhalten Sie von vielen Webseiten einfachen Zugriff auf lizenzierte Volltexte oder Open Access Publikationen. Mehr erfahren...

Climate-human-landscape interaction in the eastern foothills of Mt. Kilimanjaro (equatorial East Africa) during the last two millennia

Holocene (Sevenoaks), 2021-04, Vol.31 (4), p.556-569

2021

Volltextzugriff (PDF)

Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding

Journal of electronic packaging, 2017-03, Vol.139 (1)

2017

Volltextzugriff (PDF)

Modular sub-wavelength diffractive light modulator for high-definition holographic displays

Journal of physics. Conference series, 2013-02, Vol.415 (1), p.12057-7

2013

Volltextzugriff (PDF)

Factor Analysis of Plasma-Induced Damage in Bulk FinFET Technology

IEEE electron device letters, 2018-07, Vol.39 (7), p.927-930

2018

Volltextzugriff (PDF)

A 150 MS/s 133 μW 7 bit ADC in 90 nm Digital CMOS

IEEE journal of solid-state circuits, 2008-12, Vol.43 (12), p.2631-2640

2008

Volltextzugriff (PDF)

On the thermal stability of physically-vapor-deposited diffusion barriers in 3D Through-Silicon Vias during IC processing

Microelectronic engineering, 2013-06, Vol.106, p.155-159

2013

Volltextzugriff (PDF)

Architectural Exploration and Design of Time-Interleaved SAR Arrays for Low-Power and High Speed A/D Converters

IEICE transactions on electronics, 2009, Vol.E92-C (6), p.843-851

2009

Volltextzugriff (PDF)

Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications

IEEE transactions on components, packaging, and manufacturing technology (2011), 2021-03, Vol.11 (3), p.415-425

2021

Volltextzugriff (PDF)

Effects of Nozzle Pitch Adaptation in Micro-Scale Liquid Jet Impingement

Fluids (Basel), 2024-03, Vol.9 (3), p.69

2024

Volltextzugriff (PDF)

A 0.65-to-1.4 nJ/Burst 3-to-10 GHz UWB All-Digital TX in 90 nm CMOS for IEEE 802.15.4a

IEEE journal of solid-state circuits, 2007-12, Vol.42 (12), p.2860-2869

2007

Volltextzugriff (PDF)

A CMOS Ultra-Wideband Receiver for Low Data-Rate Communication

IEEE journal of solid-state circuits, 2007-11, Vol.42 (11), p.2515-2527

2007

Volltextzugriff (PDF)

A Low-Power Reduced Kick-Back Comparator with Improved Calibration for High-Speed Flash ADCs

IEICE transactions on electronics, 2009, Vol.E92-C (10), p.1328-1330

2009

Volltextzugriff (PDF)

Substrate Noise Coupling Mechanisms in Lightly Doped CMOS Transistors

IEEE transactions on instrumentation and measurement, 2010-06, Vol.59 (6), p.1727-1733

2010

Volltextzugriff (PDF)

Measurements and Analysis of Substrate Noise Coupling in TSV-Based 3-D Integrated Circuits

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-06, Vol.4 (6), p.1026-1037

2014

Volltextzugriff (PDF)

A 0.65-to-1.4nJ/burst 3-to-10GHz UWB Digital TX in 90nm CMOS for IEEE 802.15.4a

2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers, 2007, p.120-591

2007

Volltextzugriff (PDF)

Power Delivery Network (PDN) Modeling for Backside-PDN Configurations With Buried Power Rails and \mu TSVs

IEEE transactions on electron devices, 2020-01, Vol.67 (1), p.11-17

2020

Volltextzugriff (PDF)

A study on substrate noise coupling among TSVs in 3D chip stack

IEICE Electronics Express, 2018, Vol.15 (13), p.20180460-20180460

2018

Volltextzugriff (PDF)

A Single-Bit 500 kHz-10 MHz Multimode Power-Performance Scalable 83-to-67 dB DR CTΔΣ for SDR in 90 nm Digital CMOS

IEEE journal of solid-state circuits, 2010-06, Vol.45 (6), p.1159-1171

2010

Volltextzugriff (PDF)

Determinants of savanna-fire dynamics in the eastern Lake Victoria catchment (western Kenya) during the last 1200 years

Quaternary international, 2018-09, Vol.488, p.67-80

2018

Volltextzugriff (PDF)

Efficient Backside Power Delivery for High-Performance Computing Systems

IEEE transactions on very large scale integration (VLSI) systems, 2022-11, Vol.30 (11), p.1748-1756

2022

Volltextzugriff (PDF)

Entire Domain Basis Function Expansion of the Differential Surface Admittance for Efficient Broadband Characterization of Lossy Interconnects

IEEE transactions on microwave theory and techniques, 2020-04, Vol.68 (4), p.1217-1233

2020

Volltextzugriff (PDF)

Analysis and Application of a Surface Admittance Operator for Combined Magnetic and Dielectric Contrast in Emerging Interconnect Topologies

IEEE transactions on microwave theory and techniques, 2023-07, Vol.71 (7), p.2794-2806

2023

Volltextzugriff (PDF)

Modeling-Based Improvement of Microscale Liquid Jet Impingement Cooling

IEEE transactions on components, packaging, and manufacturing technology (2011), 2024-07, Vol.14 (7), p.1180-1188

2024

Volltextzugriff (PDF)

Full-Loop Equivalent Circuit Model for Plasma-Induced Damage Simulation

IEEE transactions on plasma science, 2018-10, Vol.46 (10), p.3677-3682

2018

Volltextzugriff (PDF)

84%-Efficiency Fully Integrated Voltage Regulator for Computing Systems Enabled by 2.5-D High-Density MIM Capacitor

IEEE transactions on very large scale integration (VLSI) systems, 2022-05, Vol.30 (5), p.661-665

2022

Volltextzugriff (PDF)

1 – 25 von 186

Suche als RSS-Feed

Suchergebnisse filtern

Filter anzeigen

Nur zeigen

Geprüft (Peer-Review)
(87)
Mit Volltextzugriff
(160)

Publikationsform

Sprache

Englisch
(186)
Japanisch
(22)

Erscheinungsjahr

n.n

Thema

Science & Technology
(115)
Technology
(101)
Engineering
(96)
Engineering, Electrical & Electronic
(95)
Integrated Circuits
(30)
Computer Science
(27)
Through-Silicon Vias
(25)
Circuits
(23)
Cmos Technology
(23)
Three-Dimensional Displays
(22)
Capacitance
(19)
Physical Sciences
(19)
Applied Sciences
(18)
Cmos
(18)
Computer Science, Hardware & Architecture
(18)
Electronics
(18)
Energy Consumption
(18)
Exact Sciences And Technology
(18)
Silicon
(18)
Radio Frequency
(17)

15 weitere anzeigen...

Weniger anzeigen...

Menü

Weitere Dienste

Einstellungen

Climate-human-landscape interaction in the eastern foothills of Mt. Kilimanjaro (equatorial East Africa) during the last two millennia

Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding

Modular sub-wavelength diffractive light modulator for high-definition holographic displays

Factor Analysis of Plasma-Induced Damage in Bulk FinFET Technology

A 150 MS/s 133 μW 7 bit ADC in 90 nm Digital CMOS

On the thermal stability of physically-vapor-deposited diffusion barriers in 3D Through-Silicon Vias during IC processing

Architectural Exploration and Design of Time-Interleaved SAR Arrays for Low-Power and High Speed A/D Converters

Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications

Effects of Nozzle Pitch Adaptation in Micro-Scale Liquid Jet Impingement

A 0.65-to-1.4 nJ/Burst 3-to-10 GHz UWB All-Digital TX in 90 nm CMOS for IEEE 802.15.4a

A CMOS Ultra-Wideband Receiver for Low Data-Rate Communication

A Low-Power Reduced Kick-Back Comparator with Improved Calibration for High-Speed Flash ADCs

Substrate Noise Coupling Mechanisms in Lightly Doped CMOS Transistors

Measurements and Analysis of Substrate Noise Coupling in TSV-Based 3-D Integrated Circuits

A 0.65-to-1.4nJ/burst 3-to-10GHz UWB Digital TX in 90nm CMOS for IEEE 802.15.4a

Power Delivery Network (PDN) Modeling for Backside-PDN Configurations With Buried Power Rails and \mu TSVs

A study on substrate noise coupling among TSVs in 3D chip stack

A Single-Bit 500 kHz-10 MHz Multimode Power-Performance Scalable 83-to-67 dB DR CTΔΣ for SDR in 90 nm Digital CMOS

Determinants of savanna-fire dynamics in the eastern Lake Victoria catchment (western Kenya) during the last 1200 years

Efficient Backside Power Delivery for High-Performance Computing Systems

Entire Domain Basis Function Expansion of the Differential Surface Admittance for Efficient Broadband Characterization of Lossy Interconnects

Analysis and Application of a Surface Admittance Operator for Combined Magnetic and Dielectric Contrast in Emerging Interconnect Topologies

Modeling-Based Improvement of Microscale Liquid Jet Impingement Cooling

Full-Loop Equivalent Circuit Model for Plasma-Induced Damage Simulation

84%-Efficiency Fully Integrated Voltage Regulator for Computing Systems Enabled by 2.5-D High-Density MIM Capacitor

Suchergebnisse filtern