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Void-induced thermal impedance in power semiconductor modules: some transient temperature effects

IEEE transactions on industry applications, 2003-09, Vol.39 (5), p.1239-1246

2003

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IEEE_Xplore

Power electronic interconnects: skin- and Proximity-Effect-based frequency Selective-Multipath propagation

IEEE transactions on power electronics, 2005-05, Vol.20 (3), p.600-610

2005

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IEEE_Xplore

Internal Geometry Variation of LTCC Inductors to Improve Light-Load Efficiency of DC-DC Converters

IEEE transactions on components and packaging technologies, 2009-03, Vol.32 (1), p.3-11

2009

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IEEE_Xplore

Effects of Interactions Between Filter Parasitics and Power Interconnects on EMI Filter Performance

IEEE transactions on industrial electronics (1982), 2007-12, Vol.54 (6), p.3344-3352

2007

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IEEE_Xplore

Integrating active, passive and EMI-filter functions in power electronics systems:a case study of some technologies

IEEE transactions on power electronics, 2005-05, Vol.20 (3), p.523-536

2005

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IEEE_Xplore

Comparison of Different Designs of a 42-V/14-V DC/DC Converter Regarding Losses and Thermal Aspects

IEEE transactions on industry applications, 2007-03, Vol.43 (2), p.520-530

2007

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IEEE_Xplore

Double-Sided Liquid Cooling for Power Semiconductor Devices Using Embedded Power Packaging

IEEE transactions on industry applications, 2008-09, Vol.44 (5), p.1645-1655

2008

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IEEE_Xplore

Design of planar integrated passive module for zero-voltage-switched asymmetrical half-bridge PWM converter

IEEE transactions on industry applications, 2003-11, Vol.39 (6), p.1648-1655

2003

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IEEE_Xplore

Developing parasitic cancellation technologies to improve EMI filter performance for switching mode power supplies

IEEE transactions on electromagnetic compatibility, 2005-11, Vol.47 (4), p.921-929

2005

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IEEE_Xplore

The future of electronic power processing and conversion

IEEE transactions on industry applications, 2005-01, Vol.41 (1), p.3-8

2005

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IEEE_Xplore

Inductor winding capacitance cancellation using mutual capacitance concept for noise reduction application

IEEE transactions on electromagnetic compatibility, 2006-05, Vol.48 (2), p.311-318

2006

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IEEE_Xplore

Volumetric optimal design of passive integrated power electronics module (IPEM) for distributed power system (DPS) front-end DC/DC converter

IEEE transactions on industry applications, 2005-01, Vol.41 (1), p.9-17

2005

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IEEE_Xplore

Experimental and theoretical characterization of an antiferroelectric ceramic capacitor for power electronics

IEEE transactions on components and packaging technologies, 2002-06, Vol.25 (2), p.211-216

2002

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IEEE_Xplore

Frequency-domain modeling of integrated electromagnetic power passives by a generalized two-conductor transmission structure

IEEE transactions on circuits and systems. 1, Fundamental theory and applications, 2004-11, Vol.51 (11), p.2325-2337

2004

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IEEE_Xplore

Electromagnetic energy propagation in power electronic converters: toward future electromagnetic integration

Proceedings of the IEEE, 2001, Vol.89 (6), p.876-889

2001

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IEEE_Xplore

Comparison of Transient Thermal Parameters for Different Die-Connecting Approaches

IEEE transactions on industry applications, 2006-11, Vol.42 (6), p.1403-1411

2006

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IEEE_Xplore

Training and optimization of an artificial neural network controlling a hybrid power filter

IEEE transactions on industrial electronics (1982), 2003-06, Vol.50 (3), p.546-553

2003

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IEEE_Xplore

In-Circuit Loss Measurement of a High-Frequency Integrated Power Electronics Module

IEEE transactions on instrumentation and measurement, 2008-07, Vol.57 (7), p.1394-1402

2008

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IEEE_Xplore

A planar multicell structure for advanced integrated reactive power modules

IEEE transactions on industry applications, 2003-11, Vol.39 (6), p.1656-1664

2003

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IEEE_Xplore

A study of thermal stress and intrinsic residual stress in planar metallization for integrated power modules

IEEE transactions on industry applications, 2005-11, Vol.41 (6), p.1603-1611

2005

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IEEE_Xplore

The effect of signal measurement and processing delay on the compensation of harmonics by PWM converters

IEEE transactions on industrial electronics (1982), 2000-04, Vol.47 (2), p.297-304

2000

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IEEE_Xplore

A Study of Integration of Parasitic Cancellation Techniques for EMI Filter Design With Discrete Components

IEEE transactions on power electronics, 2008-11, Vol.23 (6), p.3094-3102

2008

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IEEE_Xplore

Modeling of distortion compensation ineffectivity in filters for nonactive power

IEEE transactions on industrial electronics (1982), 2001-02, Vol.48 (1), p.91-100

2001

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IEEE_Xplore

Some limits of integrated L-C-T modules for resonant converters at 1 MHz

IEEE transactions on industry applications, 2001-05, Vol.37 (3), p.820-828, Article 820

2001

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IEEE_Xplore

Low Profile Integratable Inductor Fabricated Based on LTCC Technology for Microprocessor Power Delivery Applications

IEEE transactions on components and packaging technologies, 2007-03, Vol.30 (1), p.170-177

2007

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IEEE_Xplore

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Void-induced thermal impedance in power semiconductor modules: some transient temperature effects

Power electronic interconnects: skin- and Proximity-Effect-based frequency Selective-Multipath propagation

Internal Geometry Variation of LTCC Inductors to Improve Light-Load Efficiency of DC-DC Converters

Effects of Interactions Between Filter Parasitics and Power Interconnects on EMI Filter Performance

Integrating active, passive and EMI-filter functions in power electronics systems:a case study of some technologies

Comparison of Different Designs of a 42-V/14-V DC/DC Converter Regarding Losses and Thermal Aspects

Double-Sided Liquid Cooling for Power Semiconductor Devices Using Embedded Power Packaging

Design of planar integrated passive module for zero-voltage-switched asymmetrical half-bridge PWM converter

Developing parasitic cancellation technologies to improve EMI filter performance for switching mode power supplies

The future of electronic power processing and conversion

Inductor winding capacitance cancellation using mutual capacitance concept for noise reduction application

Volumetric optimal design of passive integrated power electronics module (IPEM) for distributed power system (DPS) front-end DC/DC converter

Experimental and theoretical characterization of an antiferroelectric ceramic capacitor for power electronics

Frequency-domain modeling of integrated electromagnetic power passives by a generalized two-conductor transmission structure

Electromagnetic energy propagation in power electronic converters: toward future electromagnetic integration

Comparison of Transient Thermal Parameters for Different Die-Connecting Approaches

Training and optimization of an artificial neural network controlling a hybrid power filter

In-Circuit Loss Measurement of a High-Frequency Integrated Power Electronics Module

A planar multicell structure for advanced integrated reactive power modules

A study of thermal stress and intrinsic residual stress in planar metallization for integrated power modules

The effect of signal measurement and processing delay on the compensation of harmonics by PWM converters

A Study of Integration of Parasitic Cancellation Techniques for EMI Filter Design With Discrete Components

Modeling of distortion compensation ineffectivity in filters for nonactive power

Some limits of integrated L-C-T modules for resonant converters at 1 MHz

Low Profile Integratable Inductor Fabricated Based on LTCC Technology for Microprocessor Power Delivery Applications

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