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The Manufacture of Unbreakable Bionics via Multifunctional and Self‐Healing Silk–Graphene Hydrogels

Advanced materials (Weinheim), 2021-09, Vol.33 (35), p.e2100047-n/a

2021

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Genetic Algorithm Assisted Parametric Design of Splitting Inductance in High Frequency GaN-Based Dual Active Bridge Converter

IEEE transactions on industrial electronics (1982), 2023-01, Vol.70 (1), p.522-531

2023

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Pentacentra Transformer for Multiphase LLC Converter in High-Current Data Center Application

IEEE transactions on power electronics, 2024-01, Vol.39 (1), p.1150-1161

2024

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Review of High-Temperature Power Electronics Converters

IEEE transactions on power electronics, 2022-12, Vol.37 (12), p.14831-14849

2022

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Optimum Phase Shift in the Self-Oscillating Loop for Piezoelectric-Transformer-Based Power Converters

IEEE transactions on power electronics, 2018-09, Vol.33 (9), p.8101-8109

2018

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A Protein‐Based, Water‐Insoluble, and Bendable Polymer with Ionic Conductivity: A Roadmap for Flexible and Green Electronics

Advanced science, 2019-03, Vol.6 (5), p.1801241-n/a

2019

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Soft Electronic Materials with Combinatorial Properties Generated via Mussel-Inspired Chemistry and Halloysite Nanotube Reinforcement

ACS nano, 2021-06, Vol.15 (6), p.9531-9549

2021

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Design Automation Using Exclusion-Based Hierarchical Computation for Power Electronics Converters in Harsh Environments

IEEE open journal of power electronics, 2024, Vol.5, p.1172-1181

2024

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The Manufacture of Unbreakable Bionics via Multifunctional and Self‐Healing Silk–Graphene Hydrogels (Adv. Mater. 35/2021)

Advanced materials (Weinheim), 2021-09, Vol.33 (35), p.n/a

2021

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Flexible and Green Electronics Manufactured by Origami Folding of Nanosilicate-Reinforced Cellulose Paper

ACS applied materials & interfaces, 2020-10, Vol.12 (42), p.48027-48039

2020

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Conductive compliant mechanisms: Geometric tuning of 3D printed flexural sensors

Additive manufacturing letters, 2022-12, Vol.3, p.100088, Article 100088

2022

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Fabrication of conductive structures in volumetric additive manufacturing through embedded 3-D printing for electronic applications

Additive manufacturing letters, 2023-12, Vol.7, p.100178, Article 100178

2023

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La0.6Sr0.4Fe0.8Ni0.2O3-δ perovskite with in-situ exsolved Ni-Fe nanoparticles as high activity catalyst for symmetric solid oxide electrolysis cells

Materials research bulletin, 2022-12, Vol.156, p.111984, Article 111984

2022

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ZVS Design in Full-SiC Three-Level Neutral-Point-Clamped DC–DC Converter Considering Quasi-Linear Output Capacitance [Formula Omitted]

IEEE transactions on industrial electronics (1982), 2023-01, Vol.70 (9), p.8970

2023

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AI-Based Design With Data Trimming for Hybrid Phase Shift Modulation for Minimum-Current-Stress Dual Active Bridge Converter

IEEE journal of emerging and selected topics in power electronics, 2024-04, Vol.12 (2), p.2268-2280

2024

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Flexible Electronics: A Protein‐Based, Water‐Insoluble, and Bendable Polymer with Ionic Conductivity: A Roadmap for Flexible and Green Electronics (Adv. Sci. 5/2019)

Advanced science, 2019-03, Vol.6 (5), p.n/a

2019

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Resonant full-bridge synchronous rectifier utilizing 15 V GaN transistors for wireless power transfer applications following AirFuel standard operating at 6.78 MHz

2018 IEEE Applied Power Electronics Conference and Exposition (APEC), 2018, p.3131-3137

2018

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Gallium-Nitride Field Effect Transistors in Extreme Temperature Conditions

Journal of microelectronics and electronic packaging, 2021-10, Vol.18 (4), p.168-176

2021

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Design Methodology of High-Power Density Converter with Wide Input Voltage Range

IEEE transactions on industrial electronics (1982), 2024-07, p.1-11

2024

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ZVS Design in Full-SiC Three-Level Neutral-Point-Clamped DC-DC Converter Considering Quasi-Linear Output Capacitance C

IEEE transactions on industrial electronics (1982), 2023-09, Vol.70 (9), p.8970-8978

2023

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Vertical LLC Converter for High-Current Datacenter Application

2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia), 2024, p.562-567

2024

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High Step-Down Single-Stage DC-DC Converter with Improved Planar Matrix Transformer for High-Current Data Center Application

2022 IEEE Applied Power Electronics Conference and Exposition (APEC), 2022, p.709-715

2022

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Utilizing Mutual Coupling to Eliminate Parasitic Inductance in EMI Filter Capacitors for Noise Reduction

IEEE transactions on industry applications, 2024-09, Vol.60 (5), p.7206-7215

2024

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Fringing Effect Analysis of Parallel Plate Capacitors for Capacitive Power Transfer Application

2019 IEEE 4th International Future Energy Electronics Conference (IFEEC), 2019, p.1-5

2019

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Exploring Force Sensing With 3-D Printing: A Study on Constriction Resistance and Contact Phenomena

IEEE sensors letters, 2023-05, Vol.7 (5), p.1-4

2023

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The Manufacture of Unbreakable Bionics via Multifunctional and Self‐Healing Silk–Graphene Hydrogels

Genetic Algorithm Assisted Parametric Design of Splitting Inductance in High Frequency GaN-Based Dual Active Bridge Converter

Pentacentra Transformer for Multiphase LLC Converter in High-Current Data Center Application

Review of High-Temperature Power Electronics Converters

Optimum Phase Shift in the Self-Oscillating Loop for Piezoelectric-Transformer-Based Power Converters

A Protein‐Based, Water‐Insoluble, and Bendable Polymer with Ionic Conductivity: A Roadmap for Flexible and Green Electronics

Soft Electronic Materials with Combinatorial Properties Generated via Mussel-Inspired Chemistry and Halloysite Nanotube Reinforcement

Design Automation Using Exclusion-Based Hierarchical Computation for Power Electronics Converters in Harsh Environments

The Manufacture of Unbreakable Bionics via Multifunctional and Self‐Healing Silk–Graphene Hydrogels (Adv. Mater. 35/2021)

Flexible and Green Electronics Manufactured by Origami Folding of Nanosilicate-Reinforced Cellulose Paper

Conductive compliant mechanisms: Geometric tuning of 3D printed flexural sensors

Fabrication of conductive structures in volumetric additive manufacturing through embedded 3-D printing for electronic applications

La0.6Sr0.4Fe0.8Ni0.2O3-δ perovskite with in-situ exsolved Ni-Fe nanoparticles as high activity catalyst for symmetric solid oxide electrolysis cells

ZVS Design in Full-SiC Three-Level Neutral-Point-Clamped DC–DC Converter Considering Quasi-Linear Output Capacitance [Formula Omitted]

AI-Based Design With Data Trimming for Hybrid Phase Shift Modulation for Minimum-Current-Stress Dual Active Bridge Converter

Flexible Electronics: A Protein‐Based, Water‐Insoluble, and Bendable Polymer with Ionic Conductivity: A Roadmap for Flexible and Green Electronics (Adv. Sci. 5/2019)

Resonant full-bridge synchronous rectifier utilizing 15 V GaN transistors for wireless power transfer applications following AirFuel standard operating at 6.78 MHz

Gallium-Nitride Field Effect Transistors in Extreme Temperature Conditions

Design Methodology of High-Power Density Converter with Wide Input Voltage Range

ZVS Design in Full-SiC Three-Level Neutral-Point-Clamped DC-DC Converter Considering Quasi-Linear Output Capacitance C

Vertical LLC Converter for High-Current Datacenter Application

High Step-Down Single-Stage DC-DC Converter with Improved Planar Matrix Transformer for High-Current Data Center Application

Utilizing Mutual Coupling to Eliminate Parasitic Inductance in EMI Filter Capacitors for Noise Reduction

Fringing Effect Analysis of Parallel Plate Capacitors for Capacitive Power Transfer Application

Exploring Force Sensing With 3-D Printing: A Study on Constriction Resistance and Contact Phenomena

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