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Piezoresistive Characteristics of MOSFET Channels Determined With Indentation

IEEE transactions on electron devices, 2021-04, Vol.68 (4), p.1483-1488

2021

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A laboratory X-ray microscopy study of cracks in on-chip interconnect stacks of integrated circuits

Applied physics letters, 2018-08, Vol.113 (9)

2018

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Multi-modal porous microstructure for high temperature fuel cell application

Journal of power sources, 2018-01, Vol.373, p.85-94

2018

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Porous sandwich ceramic of layered silicon nitride-zirconia composite with various multilayered graphene content

Journal of alloys and compounds, 2020-08, Vol.832, p.154984, Article 154984

2020

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Quantitative analysis of backscattered electron (BSE) contrast using low voltage scanning electron microscopy (LVSEM) and its application to Al0.22Ga0.78N/GaN layers

Ultramicroscopy, 2018-12, Vol.195, p.47-52

2018

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Si amorphization by focused ion beam milling: Point defect model with dynamic BCA simulation and experimental validation

Ultramicroscopy, 2018-01, Vol.184 (Pt B), p.52-56

2018

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Shear stress effects on the device characteristics determined with indentation testing : Student paper

2021 IEEE International Integrated Reliability Workshop (IIRW), 2021, p.1-6

2021

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Towards monitored tomographic reconstruction: algorithm-dependence and convergence

Kompʹûternaâ optika, 2023-08, Vol.47 (4), p.658-667

2023

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Imaging of microcrack propagation in 3D nanostructures applying laboratory nano-XCT

Praktische Metallographie, 2024-10, Vol.61 (11), p.829-847

2024

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Applying x-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias

Journal of applied physics, 2011-09, Vol.110 (5), p.053502-053502-7

2011

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Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects

2021 IEEE International Reliability Physics Symposium (IRPS), 2021, p.1-5

2021

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Impact of Mechanical Strain on 22 nm FDSOI Device Performance using Nanoindentation

2019 IEEE International Integrated Reliability Workshop (IIRW), 2019, p.1-4

2019

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Nanoindentation to investigate IC stability using ring oscillator circuits as a CPI sensor

2020 IEEE International Reliability Physics Symposium (IRPS), 2020, p.1-6

2020

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Mechanical characterization of porous nano-thin films by use of atomic force acoustic microscopy

Ultramicroscopy, 2016-03, Vol.162 (C), p.82-90

2016

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In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures

Microelectronic engineering, 2002-10, Vol.64 (1), p.375-382

2002

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Mechanical characterization of nanoporous materials by use of atomic force acoustic microscopy methods

Nanotechnology, 2013-09, Vol.24 (35), p.355703-355703

2013

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Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration

Microelectronics and reliability, 2014-09, Vol.54 (9-10), p.1959-1962

2014

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Challenges to quantitative energy-dispersive X-ray spectrometry and its application to graded embedded silicon–germanium for high-performance complementary metal oxide semiconductor devices

Thin solid films, 2010-10, Vol.519 (1), p.203-209

2010

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Novel SThM nanoprobe for thermal properties investigation of micro- and nanoelectronic devices

Microelectronic engineering, 2010-05, Vol.87 (5), p.1370-1374

2010

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Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects

2013 IEEE International Reliability Physics Symposium (IRPS), 2013, p.2C.1.1-2C.1.6

2013

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Microstructure effect on EM-induced copper interconnect degradation: Experiment and simulation

Microelectronic engineering, 2005-12, Vol.82 (3), p.629-638

2005

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Structure and thermal stability of graded Ta-TaN diffusion barriers between Cu and SiO2

Thin solid films, 2003-08, Vol.437 (1-2), p.248-256

2003

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Effect of nitrogen content on the degradation mechanisms of thin Ta–Si–N diffusion barriers for Cu metallization

Thin solid films, 2006-04, Vol.500 (1), p.259-267

2006

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Study of artificial aging in AlMgSi (6061) and AlMgSiCu (6013) alloys by Positron Annihilation

Journal of materials science, 2006-02, Vol.41 (4), p.1059-1066

2006

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Electron and X-ray Tomography of Iron/Iron Oxide Redox Reactions for Large-Scale Hydrogen Storage

Microscopy and microanalysis, 2013-08, Vol.19 (S2), p.578-579

2013

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Piezoresistive Characteristics of MOSFET Channels Determined With Indentation

A laboratory X-ray microscopy study of cracks in on-chip interconnect stacks of integrated circuits

Multi-modal porous microstructure for high temperature fuel cell application

Porous sandwich ceramic of layered silicon nitride-zirconia composite with various multilayered graphene content

Quantitative analysis of backscattered electron (BSE) contrast using low voltage scanning electron microscopy (LVSEM) and its application to Al0.22Ga0.78N/GaN layers

Si amorphization by focused ion beam milling: Point defect model with dynamic BCA simulation and experimental validation

Shear stress effects on the device characteristics determined with indentation testing : Student paper

Towards monitored tomographic reconstruction: algorithm-dependence and convergence

Imaging of microcrack propagation in 3D nanostructures applying laboratory nano-XCT

Applying x-ray microscopy and finite element modeling to identify the mechanism of stress-assisted void growth in through-silicon vias

Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects

Impact of Mechanical Strain on 22 nm FDSOI Device Performance using Nanoindentation

Nanoindentation to investigate IC stability using ring oscillator circuits as a CPI sensor

Mechanical characterization of porous nano-thin films by use of atomic force acoustic microscopy

In situ SEM observation of electromigration phenomena in fully embedded copper interconnect structures

Mechanical characterization of nanoporous materials by use of atomic force acoustic microscopy methods

Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration

Challenges to quantitative energy-dispersive X-ray spectrometry and its application to graded embedded silicon–germanium for high-performance complementary metal oxide semiconductor devices

Novel SThM nanoprobe for thermal properties investigation of micro- and nanoelectronic devices

Electromigration early failure void nucleation and growth phenomena in Cu and Cu(Mn) interconnects

Microstructure effect on EM-induced copper interconnect degradation: Experiment and simulation

Structure and thermal stability of graded Ta-TaN diffusion barriers between Cu and SiO2

Effect of nitrogen content on the degradation mechanisms of thin Ta–Si–N diffusion barriers for Cu metallization

Study of artificial aging in AlMgSi (6061) and AlMgSiCu (6013) alloys by Positron Annihilation

Electron and X-ray Tomography of Iron/Iron Oxide Redox Reactions for Large-Scale Hydrogen Storage

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