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Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals

Acta materialia, 2008-06, Vol.56 (11), p.2649-2662

2008

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Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2012, Vol.532, p.167-177

2012

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Drivability of Large Diameter Steel Cylinders During Hammer-Group Vibratory Installation for the Hong Kong–Zhuhai–Macao Bridge

Engineering (Beijing, China), 2023-01, Vol.20 (1), p.180-191

2023

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Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate

Journal of alloys and compounds, 2009-02, Vol.469 (1), p.207-214

2009

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Probabilistic modeling of offshore deep cement mixing improved ground

Computers and geotechnics, 2023-04, Vol.156, p.105266, Article 105266

2023

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An investigation and comparison of artificial neural network and time series models for Chinese food grain price forecasting

Neurocomputing (Amsterdam), 2007-10, Vol.70 (16), p.2913-2923

2007

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Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate

Scripta materialia, 2009-08, Vol.61 (3), p.308-311

2009

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Fatigue fracture mechanisms of Cu/lead-free solders interfaces

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2010-03, Vol.527 (6), p.1367-1376

2010

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Coarsening mechanisms, texture evolution and size distribution of Cu6Sn5 between Cu and Sn-based solders

Materials chemistry and physics, 2011-12, Vol.131 (1-2), p.190-198

2011

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Coarsening mechanisms, texture evolution and size distribution of Cu 6Sn 5 between Cu and Sn-based solders

Materials chemistry and physics, 2011, Vol.131 (1), p.190-198

2011

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Improved superconducting properties in Ti-doped MgB2 prepared by two-step reaction method and high-energy ball milling

Journal of alloys and compounds, 2015-02, Vol.622, p.714-718

2015

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Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn–3Cu/Cu single crystal joints

Microelectronic engineering, 2010-04, Vol.87 (4), p.601-609

2010

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Transition of Bi embrittlement of SnBi/Cu joint couples with reflow temperature

Journal of materials research, 2011-02, Vol.26 (3), p.449-454

2011

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Ductile-to-brittle transition induced by increasing strain rate in Sn–3Cu/Cu joints

Journal of materials research, 2008-06, Vol.23 (6), p.1614-1617

2008

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Affinity chromatography with immobilized DNA stationary phase for biological fingerprinting analysis of traditional Chinese medicines

Journal of Chromatography A, 2007-06, Vol.1154 (1), p.132-137

2007

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Morphologies, orientation relationships and evolution of Cu 6Sn 5 grains formed between molten Sn and Cu single crystals

Acta materialia, 2008, Vol.56 (11), p.2649-2662

2008

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Preferential growth and orientation relationship of Ag3Sn grains formed between molten Sn and (001) Ag single crystal

Journal of materials research, 2009-06, Vol.24 (6), p.2141-2144

2009

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Preferential growth and orientation relationship of Ag 3 Sn grains formed between molten Sn and (001) Ag single crystal

Journal of materials research, 2009-06, Vol.24 (6), p.2141-2144

2009

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Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates

Journal of electronic materials, 2008-08, Vol.37 (8), p.1119-1129

2008

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3.14 - Selective Enrichment of Phosphopeptides Using Nanomaterials and Monolithic Materials for the Analysis of Protein Phosphorylation

Comprehensive Sampling and Sample Preparation, 2012, p.291-306

2012

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Controlling the morphology and orientation of Cu6Sn5 through designing the orientations of Cu single crystals

2009 International Conference on Electronic Packaging Technology & High Density Packaging, 2009, p.1212-1215

2009

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Aerodynamic characteristics of a trailing rail vehicles on viaduct based on still wind tunnel experiments

Journal of wind engineering and industrial aerodynamics, 2014-12, Vol.135, p.22-33

2014

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Electrospun Li3.9Cr0.3Ti4.8O12 nanofibers as anode material for high-rate and low-temperature lithium-ion batteries

Journal of alloys and compounds, 2017-04, Vol.701, p.99-106

2017

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MoO2 nanoparticle-modified Li4Ti5O12 as high rate anode material for lithium ion batteries

Ceramics international, 2017-12, Vol.43 (17), p.15339-15344

2017

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Prediction of sensitivity to gefitinib/erlotinib for EGFR mutations in NSCLC based on structural interaction fingerprints and multilinear principal component analysis

BMC bioinformatics, 2018-03, Vol.19 (1), p.88-88, Article 88

2018

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Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals

Interfacial microstructure and mechanical properties of SnBi/Cu joints by alloying Cu substrate

Drivability of Large Diameter Steel Cylinders During Hammer-Group Vibratory Installation for the Hong Kong–Zhuhai–Macao Bridge

Solid-state and liquid-state interfacial reactions between Sn-based solders and single crystal Ag substrate

Probabilistic modeling of offshore deep cement mixing improved ground

An investigation and comparison of artificial neural network and time series models for Chinese food grain price forecasting

Eliminating interfacial segregation and embrittlement of bismuth in SnBi/Cu joint by alloying Cu substrate

Fatigue fracture mechanisms of Cu/lead-free solders interfaces

Coarsening mechanisms, texture evolution and size distribution of Cu6Sn5 between Cu and Sn-based solders

Coarsening mechanisms, texture evolution and size distribution of Cu 6Sn 5 between Cu and Sn-based solders

Improved superconducting properties in Ti-doped MgB2 prepared by two-step reaction method and high-energy ball milling

Effects of aging time, strain rate and solder thickness on interfacial fracture behaviors of Sn–3Cu/Cu single crystal joints

Transition of Bi embrittlement of SnBi/Cu joint couples with reflow temperature

Ductile-to-brittle transition induced by increasing strain rate in Sn–3Cu/Cu joints

Affinity chromatography with immobilized DNA stationary phase for biological fingerprinting analysis of traditional Chinese medicines

Morphologies, orientation relationships and evolution of Cu 6Sn 5 grains formed between molten Sn and Cu single crystals

Preferential growth and orientation relationship of Ag3Sn grains formed between molten Sn and (001) Ag single crystal

Preferential growth and orientation relationship of Ag 3 Sn grains formed between molten Sn and (001) Ag single crystal

Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates

3.14 - Selective Enrichment of Phosphopeptides Using Nanomaterials and Monolithic Materials for the Analysis of Protein Phosphorylation

Controlling the morphology and orientation of Cu6Sn5 through designing the orientations of Cu single crystals

Aerodynamic characteristics of a trailing rail vehicles on viaduct based on still wind tunnel experiments

Electrospun Li3.9Cr0.3Ti4.8O12 nanofibers as anode material for high-rate and low-temperature lithium-ion batteries

MoO2 nanoparticle-modified Li4Ti5O12 as high rate anode material for lithium ion batteries

Prediction of sensitivity to gefitinib/erlotinib for EGFR mutations in NSCLC based on structural interaction fingerprints and multilinear principal component analysis

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