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Analytical, Numerical-, and Measurement-Based Methods for Extracting the Electrical Parameters of Through Silicon Vias (TSVs)
IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-03, Vol.4 (3), p.504-515
2014
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A Versatile Timing Microsystem Based on Wafer-Level Packaged XTAL/BAW Resonators With Sub- \mu W RTC Mode and Programmable HF Clocks
IEEE journal of solid-state circuits, 2014-01, Vol.49 (1), p.212-222
2014
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Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies
IEEE transactions on advanced packaging, 2007-08, Vol.30 (3), p.359-368
2007
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3D silicon interposer for terabit/s transceivers based on high-speed TSVs
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1348-1352
2023
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Key Technologies and Design Aspects for Wafer Level Packaging of High Performance Computing Modules
2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 2024, p.433-440
2024
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Simulation and Fabrication of SU-8 Microfluidics Mixers capped by Wafer-to-Wafer Bonding
2023 IEEE BioSensors Conference (BioSensors), 2023, p.1-4
2023
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Wafer Level Capping Technology for Vacuum Packaging of Microbolometers
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1571-1578
2023
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High Density Thin Film Flex Technology for Advanced Packaging Applications
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.1010-1018
2022
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Technologies for Wafer Level MEMS Capping based on Permanent and Temporary Wafer Bonding
IMAPS other content, 2015-01, Vol.2015 (DPC), p.698-725
2015
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Evolution of structured adhesive wafer to wafer bonding enabled by laser direct patterning of polymer resins
2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 2016, p.223-228
2016
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3D Process Integration – Requirements and Challenges
MRS proceedings, 2008, Vol.1112 (1), Article 1112-E01-01
2008
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Flexible and Stretchable Systems for Healthcare and Mobility
Flexible, Wearable, and Stretchable Electronics, 2021, Vol.1, p.269-282
1, 2021
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Cap Fabrication and Transfer Bonding Technology for Hermetic and Quasi Hermetic Wafer Level MEMS Packaging
2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.432-438
2020
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High Density Flex and Thin Chip Embedding Technology for Polymeric Interposer and Sensor Packaging Applications
2019 International Wafer Level Packaging Conference (IWLPC), 2019, p.1-9
2019
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Stress-Compensating MEMS Sensor Assembly
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.932-936
2017
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Hermetic Wafer Level Packaging of LED Modules with Phosphor Ceramic Converter for White Light Applications based on TSV Technology
2018 7th Electronic System-Integration Technology Conference (ESTC), 2018, p.1-9
2018
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Fabrication of High Voltage Capable TSV Using Backside via Last Process and Laser Abblation of Dry Film BCB
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC), 2019, p.83-86
2019
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Temporary handling technology by polyimide based adhesive bonding and laser assisted de-bonding
2016 6th Electronic System-Integration Technology Conference (ESTC), 2016, p.1-6
2016
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Fabrication of a High Precision Magnetic Position Sensor Based on a Through Silicon Via First Approach
2018 International Wafer Level Packaging Conference (IWLPC), 2018, p.1-8
2018
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Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance
IMAPS other content, 2017-07, Vol.2017 (NOR), p.1-4
2017
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Development of a High Resolution Magnetic Field Position Sensor System Based on a Through Silicon Via First Integration Concept
2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.916-925
2018
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Effect of wafer-level silicon cap packaging on BiCMOS embedded RF-MEMS switch performance
2017 IMAPS Nordic Conference on Microelectronics Packaging (NordPac), 2017, p.31-34
2017
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Full wafer redistribution and wafer embedding as key technologies for a multi-scale neuromorphic hardware cluster
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 2017, p.1-8
2017
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Ultra Thin Force and Acceleration Sensor Embedded in Flexible Thin Film Substrates Using Thin Chip Handling, Bonding and Carrier Release Technologies
2019 12th International Conference on Developments in eSystems Engineering (DeSE), 2019, p.902-905
2019
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High-Density Flexible Substrate Technology with Thin Chip Embedding and Partial Carrier Release Option for IoT and Sensor Applications
2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, p.1475-1484
2019
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