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The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

Journal of electronic materials, 2012-02, Vol.41 (2), p.283-301

2012

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Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy

Journal of electronic materials, 2010-12, Vol.39 (12), p.2588-2597

2010

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Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface

Journal of electronic materials, 2010-12, Vol.39 (12), p.2669-2679

2010

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Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear

Journal of electronic materials, 2009-12, Vol.38 (12), p.2702-2711

2009

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Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

Journal of electronic materials, 2011-09, Vol.40 (9), p.1895-1902

2011

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Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages

Journal of electronic materials, 2015-03, Vol.44 (3), p.895-908

2015

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Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling

Journal of electronic materials, 2016-06, Vol.45 (6), p.3013-3024

2016

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Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD

Journal of electronic materials, 2013-02, Vol.42 (2), p.319-331

2013

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Multiscale Modeling of the Effect of Micro-alloying Mn and Sb on the Viscoplastic Response of SAC105 Solder

Journal of electronic materials, 2014-04, Vol.43 (4), p.1119-1130

2014

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Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

Journal of electronic materials, 2013, Vol.42 (2), p.319-331

2013

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Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation

Journal of electronic materials, 2012-02, Vol.41 (2), p.273-282

2012

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Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications

Journal of electronic materials, 2014, Vol.43 (1), p.57-68

2014

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Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

Journal of electronic materials, 2012, Vol.41 (2), p.273-282

2012

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The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance

Journal of electronic materials, 2013-02, Vol.42 (2), p.215-223

2013

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In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free

Journal of electronic materials, 2013-04, Vol.41 ((2) ; 02, 2012)

2013

Volltextzugriff (PDF)

The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

Journal of electronic materials, 2013, Vol.42 (2), p.215-223

2013

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The state of Pb-free solder - A joint reliability overview

2016 IEEE International Reliability Physics Symposium (IRPS), 2016, p.6B-6-1-6B-6-6

2016

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Effects of Crystal Orientation on Recrystallization and Damage in Lead-Free Solders during Thermal Cycling in Low and High Stress Package Designs

AIP conference proceedings, 2012-03

2012

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Solder joint height impact on temperature cycle reliability of BGA components with thermal enabling load

2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.684-689

2014

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Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects

Journal of electronic materials, 2011-09, Vol.40 (9), p.1967-1976

2011

Volltextzugriff (PDF)

In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders

Journal of electronic materials, 2012-02, Vol.41 (2), p.262-272

2012

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Impact of Isothermal Aging and Sn Grain Orientation on the Long-Term Reliability of Wafer-Level Chip-Scale Package Sn-Ag-Cu Solder Interconnects

IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-03, Vol.2 (3), p.496-501

2012

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Characterization of tin crystal orientation evolution during thermal cycling in lead-free solder joints

Zhou, Bite

2012

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In Situ Synchrotron Characterization of Melting, Dissolution and Resolidification in Lead-Free Solders: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

Journal of electronic materials, 2012, Vol.41 (2), p.262-272

2012

Volltextzugriff (PDF)

The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

Journal of electronic materials, 2012, Vol.41 (2), p.283-301

2012

Volltextzugriff (PDF)

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The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy

Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface

Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear

Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

Slip, Crystal Orientation, and Damage Evolution During Thermal Cycling in High-Strain Wafer-Level Chip-Scale Packages

Microstructural Evolution of SAC305 Solder Joints in Wafer Level Chip-Scale Packaging (WLCSP) with Continuous and Interrupted Accelerated Thermal Cycling

Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD

Multiscale Modeling of the Effect of Micro-alloying Mn and Sb on the Viscoplastic Response of SAC105 Solder

Characterization of Recrystallization and Microstructure Evolution in Lead-Free Solder Joints Using EBSD and 3D-XRD: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation

Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications

Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance

In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free

The Role of Pd in Sn-Ag-Cu Solder Interconnect Mechanical Shock Performance: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

The state of Pb-free solder - A joint reliability overview

Effects of Crystal Orientation on Recrystallization and Damage in Lead-Free Solders during Thermal Cycling in Low and High Stress Package Designs

Solder joint height impact on temperature cycle reliability of BGA components with thermal enabling load

Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects

In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders

Impact of Isothermal Aging and Sn Grain Orientation on the Long-Term Reliability of Wafer-Level Chip-Scale Package Sn-Ag-Cu Solder Interconnects

Characterization of tin crystal orientation evolution during thermal cycling in lead-free solder joints

In Situ Synchrotron Characterization of Melting, Dissolution and Resolidification in Lead-Free Solders: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints: Pb-free Solders and Materials for Emerging Interconnect and Packaging Technologies

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