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Wafer Bumping, Assembly, and Reliability of Fine-Pitch Lead-Free Micro Solder Joints for 3-D IC Integration
IEEE transactions on components, packaging, and manufacturing technology (2011), 2012-08, Vol.2 (8), p.1229-1238
2012
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Process integration and 3D chip stacking for low cost backside illuminated CMOS image sensor
2015 International Symposium on VLSI Technology, Systems and Applications, 2015, p.1-2
2015
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Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2011, p.1468-1474
2011
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Low-cost TSH (through-silicon hole) interposers for 3D IC integration
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, p.290-296
2014
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Process integration of 3D stacking for backside illuminated image sensor
2014 International Conference on Electronics Packaging (ICEP), 2014, p.82-85
2014
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Electrical investigation and reliability of 3D integration platform using Cu TSVs and micro-bumps with Cu/Sn-BCB hybrid bonding
2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.64-70
2013
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A novel 3D IC assembly process for ultra-thin chip stacking
2014 International Conference on Electronics Packaging (ICEP), 2014, p.470-474
2014
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Wafer bumping, assembly, and reliability assessment of μbumps with 5μm pads on 10μm pitch for 3D IC integration
2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.636-640
2012
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Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology
2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2015, p.834-837
2015
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Flexible and ultra-thin embedded chip package
2009 59th Electronic Components and Technology Conference, 2009, p.1749-1753
2009
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Manufacturing and stacking of ultra-thin film packages
2009 59th Electronic Components and Technology Conference, 2009, p.1440-1446
2009
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Stretchable circuit with elastic bumps
2008 2nd Electronics System-Integration Technology Conference, 2008, p.1381-1386
2008
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Wafer-level 3D integration using hybrid bonding
2010 IEEE International 3D Systems Integration Conference (3DIC), 2010, p.1-4
2010
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Wafer-to-wafer hybrid bonding technology for 3D IC
3rd Electronics System Integration Technology Conference ESTC, 2010, p.1-5
2010
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Low temperature micro-bumping assembly technology for 3D integration
2012 4th Electronic System-Integration Technology Conference, 2012, p.1-5
2012
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Process and characterization of ultra-thin film packages
2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference, 2010, p.1-4
2010
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A Wafer-Level Three-Dimensional Integration Scheme With Cu TSVs Based on Microbump/Adhesive Hybrid Bonding for Three-Dimensional Memory Application
IEEE transactions on device and materials reliability, 2012-06, Vol.12 (2), p.209-216
2012
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A Novel 3D Integration Scheme for Backside Illuminated CMOS Image Sensor Devices
IEEE transactions on device and materials reliability, 2014-06, Vol.14 (2), p.715-720
2014
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Propagation of solitary waves over a bottom-mounted barrier
Coastal engineering (Amsterdam), 2012-04, Vol.62, p.31-47
2012
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Co-modification of WO3 nanoplates with β-FeOOH/carbon quantum dots combined with plasma treatment enables high-efficiency photoelectrochemical characteristics
Journal of materials chemistry. A, Materials for energy and sustainability, 2024-07, Vol.12 (30), p.19277-19287
2024
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Suggestions on Relieving Physical Anxiety of Medical Workers and Improving Physical and Mental Health Under the COVID-19 Epidemic—A Case Study of Meizhou City
Frontiers in public health, 2022-06, Vol.10, p.919049-919049
2022
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Turbulence and energy dissipations of surf-zone spilling breakers
Coastal engineering (Amsterdam), 2009-07, Vol.56 (7), p.733-746
2009
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Characteristics of Flexible Thin-Film Transistors With ZnO Channels
IEEE sensors journal, 2013-12, Vol.13 (12), p.4940-4943
2013
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Laboratory observation of boundary layer flow under spilling breakers in surf zone using particle image velocimetry
Coastal engineering (Amsterdam), 2010-03, Vol.57 (3), p.343-357
2010
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Co-modification of WO 3 nanoplates with β-FeOOH/carbon quantum dots combined with plasma treatment enables high-efficiency photoelectrochemical characteristics
Journal of materials chemistry. A, Materials for energy and sustainability, 2024-07, Vol.12 (30), p.19277-19287
2024
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