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Chemical analysis of semiconductor devices using TEM energy-dispersive X-ray spectroscopy (EDS) and electron energy-loss spectroscopy (EELS)

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2016, p.86-93

2016

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Reproducibility of implanted dosage measurement with CAMECA Wf

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2017, p.1-3

2017

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Investigation of Cs+ bombardment effects in ultra-thin oxynitride gate dielectrics characterization by DSIMS

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2017, p.1-3

2017

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Si(004) measurements of wafer curvature due to the stress introduced by PECVD/HDP SiN films in wafer fabrication

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2017, p.1-4

2017

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Measuring of phosphorous in silicon wafers by VPD-ICPMS

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2016, p.178-179

2016

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4-Point-bending characterization of interfacial adhesion strength of SiN/Cu film stack

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2017, p.1-4

2017

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Crystal thickness and extinction distance measurements by convergent beam electron diffraction fitting and application in quantitative TEM holography analysis on p-n junctions

Journal of vacuum science and technology. B, Nanotechnology & microelectronics, 2015-09, Vol.33 (5)

2015

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Study on copper diffusion barrier materials by Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS)

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2016, p.140-143

2016

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Time-of-Flight Secondary Ion Mass Spectrometry profiling for arsenic in silicon dioxide matrix

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2016, p.109-111

2016

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SIMS characterization of isotope antimony implant for buried implant

2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2015, p.175-177

2015

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Application of SLAT methodology in bond pad process evaluation for sidewall polymer removal

2016 IEEE 23rd International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2016, p.332-334

2016

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Evaporation method to eliminate Si-Matrix interferences for thick oxide wafers VPD-ICPMS analysis

2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2015, p.173-174

2015

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Feasibility study of TOF-SIMS surface measurement for Aluminum bond pad fluorine contamination

2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2015, p.61-63

2015

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Failure analysis on non-visible front-end defects in deep NWELL implantation related process

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2013, p.177-181

2013

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Wing patterning genes of Nilaparvata lugens identification by transcriptome analysis, and their differential expression profile in wing pads between brachypterous and macropterous morphs

Journal of Integrative Agriculture, 2015-09, Vol.14 (9), p.1796-1807

2015

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The Possible Mechanism of a Type of Vortex Heavy Rainfall during the Pre-Rainy Season in South China

Atmospheric and oceanic science letters = Daqi-he-haiyang-kexue-kuaibao, 2011, Vol.4 (5), p.247-252

2011

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Non-Destructive High-Resolution Tomographic Cross-Sectional Imaging on Suspended Structures Inside a Mems Package

2021 China Semiconductor Technology International Conference (CSTIC), 2021, p.1-3

2021

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A SEM Based Technique To Detect Pin-holes In As-Deposited/As-Grown Dielectrics

2006 IEEE International Conference on Semiconductor Electronics, 2006, p.713-716

2006

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A Study Of Yield Loss In Copper Back-End Process Due To Stress And Poor Adhesion Of The Thin Films

2006 IEEE International Conference on Semiconductor Electronics, 2006, p.717-724

2006

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Report of Incidence and Mortality in China Cancer Registries, 2008

Chinese journal of cancer research, 2012-09, Vol.24 (3), p.171-180

2012

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Advanced TEM sample preparation and imaging techniques in semiconductor devices

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2017, p.1-6

2017

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Murine calcium-activated chloride channel family member 3 induces asthmatic airway inflammation independently of allergen exposure

Chinese medical journal, 2013, Vol.126 (17), p.3283-3288

2013

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A study of coating techniques for ultra-thin film X-TEM sample preparation

2017 IEEE 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2017, p.1-4

2017

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Simultaneous Detection of 13 Key Bacterial Respiratory Pathogens by Combination of Multiplex PCR and Capillary Electrophoresis

Biomedical and environmental sciences, 2017-08, Vol.30 (8), p.549-561

2017

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Cancer Incidence And Mortality in China,2006

Chinese journal of cancer research, 2011-03, Vol.23 (1), p.3-9

2011

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Chemical analysis of semiconductor devices using TEM energy-dispersive X-ray spectroscopy (EDS) and electron energy-loss spectroscopy (EELS)

Reproducibility of implanted dosage measurement with CAMECA Wf

Investigation of Cs+ bombardment effects in ultra-thin oxynitride gate dielectrics characterization by DSIMS

Si(004) measurements of wafer curvature due to the stress introduced by PECVD/HDP SiN films in wafer fabrication

Measuring of phosphorous in silicon wafers by VPD-ICPMS

4-Point-bending characterization of interfacial adhesion strength of SiN/Cu film stack

Crystal thickness and extinction distance measurements by convergent beam electron diffraction fitting and application in quantitative TEM holography analysis on p-n junctions

Study on copper diffusion barrier materials by Time-of-Flight Secondary Ion Mass Spectrometry (ToF-SIMS)

Time-of-Flight Secondary Ion Mass Spectrometry profiling for arsenic in silicon dioxide matrix

SIMS characterization of isotope antimony implant for buried implant

Application of SLAT methodology in bond pad process evaluation for sidewall polymer removal

Evaporation method to eliminate Si-Matrix interferences for thick oxide wafers VPD-ICPMS analysis

Feasibility study of TOF-SIMS surface measurement for Aluminum bond pad fluorine contamination

Failure analysis on non-visible front-end defects in deep NWELL implantation related process

Wing patterning genes of Nilaparvata lugens identification by transcriptome analysis, and their differential expression profile in wing pads between brachypterous and macropterous morphs

The Possible Mechanism of a Type of Vortex Heavy Rainfall during the Pre-Rainy Season in South China

Non-Destructive High-Resolution Tomographic Cross-Sectional Imaging on Suspended Structures Inside a Mems Package

A SEM Based Technique To Detect Pin-holes In As-Deposited/As-Grown Dielectrics

A Study Of Yield Loss In Copper Back-End Process Due To Stress And Poor Adhesion Of The Thin Films

Report of Incidence and Mortality in China Cancer Registries, 2008

Advanced TEM sample preparation and imaging techniques in semiconductor devices

Murine calcium-activated chloride channel family member 3 induces asthmatic airway inflammation independently of allergen exposure

A study of coating techniques for ultra-thin film X-TEM sample preparation

Simultaneous Detection of 13 Key Bacterial Respiratory Pathogens by Combination of Multiplex PCR and Capillary Electrophoresis

Cancer Incidence And Mortality in China,2006

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