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Wafer scale catalytic growth of graphene on nickel by solid carbon source

Carbon (New York), 2014-01, Vol.66, p.48-56

2014

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Porous ultra low k deposited by PECVD: From deposition to material properties

Surface & coatings technology, 2007-09, Vol.201 (22), p.9248-9251

2007

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Nanomechanical mapping of graphene layers and interfaces in suspended graphene nanostructures grown via carbon diffusion

Thin solid films, 2014-01, Vol.550, p.472-479

2014

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Comparison Between E-beam and Ultraviolet Curing to Perform Porous a-SiOC:H

Journal of the Electrochemical Society, 2007, Vol.154 (5), p.G103

2007

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Thermal furnace and Ultraviolet assisted curing impact on SiOCH spin-on ultra low dielectric constant materials

Thin solid films, 2008-01, Vol.516 (6), p.1097-1103

2008

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Surface and interfacial interactions of multilayer graphitic structures with local environment

Thin solid films, 2015-06, Vol.585, p.31-39

2015

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Plasma-enhanced-chemical-vapor-deposited ultralow k for a postintegration porogen removal approach

Applied physics letters, 2006-05, Vol.88 (18), p.182908-182908-3

2006

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Crosslinking impact of mesoporous MSQ films used in microelectronic interconnections on mechanical properties

Thin solid films, 2006-01, Vol.495 (1), p.124-129

2006

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Homo Creativus: The 7 C's of Human Creativity

1, 2022

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Relationship Between Baseline Rectal Tumor Length and Magnetic Resonance Tumor Regression Grade Response to Chemoradiotherapy: A Subanalysis of the TRIGGER Feasibility Study

Annals of surgical oncology, 2023-08, Vol.30 (8), p.4729-4735

2023

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Study of annealing temperature influence on the performance of top gated graphene/SiC transistors

Solid-state electronics, 2012-05, Vol.71, p.2-6

2012

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32 nm node BEOL integration with an extreme low- k porous SiOCH dielectric k = 2.3

Microelectronic engineering, 2010-03, Vol.87 (3), p.316-320

2010

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Porosity generation using hydrogen plasma assisted thermal curing for ultra low k material

Microelectronic engineering, 2008-10, Vol.85 (10), p.2102-2104

2008

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Investigation on the origin of dielectric constant evolution in films deposited from organosilicon molecules in microwave DECR plasma reactor

Surface & coatings technology, 2003-09, Vol.174, p.162-165

2003

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Microwave characterization of porous SiOCH permittivity after integration dedicated to the 32 nm node

Microelectronic engineering, 2010-03, Vol.87 (3), p.329-332

2010

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Characterization of SiOF Thin Films Deposited by PECVD from Hexamethyldisiloxane in Mixture with Oxygen and CF4

Materials science forum, 2009-01, Vol.609, p.59-62

2009

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Dielectric Constant of Porous Ultra Low-κ Thin Films

Journal of the Electrochemical Society, 2012, Vol.159 (5), p.G49-G55

2012

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Dielectric properties of SiOx like films deposited from TMS/O2 mixture in low pressure microwave plasma

Vacuum, 2014-09, Vol.107, p.264-268

2014

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Evaluation of ellipsometric porosimetry for in-line characterization of ultra low-κ dielectrics

Physica status solidi. C, 2008-05, Vol.5 (5), p.1278-1282

2008

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K value improvement of ULK dielectrics by wet activation

Microelectronic engineering, 2006-11, Vol.83 (11), p.2122-2125

2006

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Crosslinking of porous SiOCH films involving Si-O-C bonds:Impact of deposition and curing

Journal of applied physics, 2010-12, Vol.108 (12), p.124105-124105-9

2010

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La qualité de vie: Approches psychologiques

Bacro, Fabien

2014

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The role of ultraviolet radiation during ultralow k films curing: Strengthening mechanisms and sacrificial porogen removal

Journal of applied physics, 2007-11, Vol.102 (9), p.094107-094107-8

2007

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Dielectric properties of SiO sub(x) like films deposited from TMS/O sub(2) mixture in low pressure microwave plasma

Vacuum, 2014-09, Vol.107, p.264-268

2014

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Publisher's Note: Dielectric Constant of Porous Ultra Low-κ Thin Films [J. Electrochem. Soc., 159, G49 (2012)]

Journal of the Electrochemical Society, 2012, Vol.159 (5), p.S11-S11

2012

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Wafer scale catalytic growth of graphene on nickel by solid carbon source

Porous ultra low k deposited by PECVD: From deposition to material properties

Nanomechanical mapping of graphene layers and interfaces in suspended graphene nanostructures grown via carbon diffusion

Comparison Between E-beam and Ultraviolet Curing to Perform Porous a-SiOC:H

Thermal furnace and Ultraviolet assisted curing impact on SiOCH spin-on ultra low dielectric constant materials

Surface and interfacial interactions of multilayer graphitic structures with local environment

Plasma-enhanced-chemical-vapor-deposited ultralow k for a postintegration porogen removal approach

Crosslinking impact of mesoporous MSQ films used in microelectronic interconnections on mechanical properties

Homo Creativus: The 7 C's of Human Creativity

Relationship Between Baseline Rectal Tumor Length and Magnetic Resonance Tumor Regression Grade Response to Chemoradiotherapy: A Subanalysis of the TRIGGER Feasibility Study

Study of annealing temperature influence on the performance of top gated graphene/SiC transistors

32 nm node BEOL integration with an extreme low- k porous SiOCH dielectric k = 2.3

Porosity generation using hydrogen plasma assisted thermal curing for ultra low k material

Investigation on the origin of dielectric constant evolution in films deposited from organosilicon molecules in microwave DECR plasma reactor

Microwave characterization of porous SiOCH permittivity after integration dedicated to the 32 nm node

Characterization of SiOF Thin Films Deposited by PECVD from Hexamethyldisiloxane in Mixture with Oxygen and CF4

Dielectric Constant of Porous Ultra Low-κ Thin Films

Dielectric properties of SiOx like films deposited from TMS/O2 mixture in low pressure microwave plasma

Evaluation of ellipsometric porosimetry for in-line characterization of ultra low-κ dielectrics

K value improvement of ULK dielectrics by wet activation

Crosslinking of porous SiOCH films involving Si-O-C bonds:Impact of deposition and curing

La qualité de vie: Approches psychologiques

The role of ultraviolet radiation during ultralow k films curing: Strengthening mechanisms and sacrificial porogen removal

Dielectric properties of SiO sub(x) like films deposited from TMS/O sub(2) mixture in low pressure microwave plasma

Publisher's Note: Dielectric Constant of Porous Ultra Low-κ Thin Films [J. Electrochem. Soc., 159, G49 (2012)]

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