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APEC '99. Fourteenth Annual Applied Power Electronics Conference and Exposition. 1999 Conference Proceedings (Cat. No.99CH36285), 1999, Vol.2, p.664-669 vol.2

1999

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IEEE_Xplore

A Systematic Hard- and Soft-Switching Performances Evaluation of 1200V Punchthrough IGBT Structures

IEEE transactions on power electronics, 2004-01, Vol.19 (1), p.231-241

2004

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Influence of the thermo-mechanical residual state on the power assembly modellization

Microelectronics and reliability, 2004-09, Vol.44 (9), p.1331-1335

2004

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Evaluation of lead-free soldering for automotive applications

Microelectronics and reliability, 2002-09, Vol.42 (9), p.1555-1558

2002

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Thermal transient characterization of electronic assemblies by infrared thermography and Delta Vbemeter methods

Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 1995, p.87-91

1995

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IEEE_Xplore

Methodology to evaluate the correspondence between real conditions and accelerated tests of a thyristor system used in a power plant

Microelectronics and reliability, 2003-09, Vol.43 (9), p.1853-1858

2003

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Reliability study of the assembly of a large EGA on a build up board using thermo-mechanical simulations

Microelectronics and reliability, 2002-09, Vol.42 (9), p.1529-1533

2002

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Reliability analysis of lead-free BGA assemblies linking FE simulations and experimental results

EuroSimE 2005. Proceedings of the 6th International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005, 2005, p.259-262

2005

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IEEE_Xplore

Thermal fatigue resistance evaluation of solder joints in IGBT power modules for traction applications

2000 IEEE 31st Annual Power Electronics Specialists Conference. Conference Proceedings (Cat. No.00CH37018), 2000, Vol.3, p.1285-1290 vol.3

2000

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IEEE_Xplore

Extensive fatigue investigation of solder joints in IGBT high power modules

2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000, p.1436-1442

2000

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IEEE_Xplore

Study of ultracapacitors dynamic behaviour using impedance frequency analysis on a specific test bench

2004 IEEE International Symposium on Industrial Electronics, 2004, Vol.2, p.839-844 vol. 2

2004

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IEEE_Xplore

An assessment of the connection between the working, operations of a thyristor system used in a power plant and accelerated ageing tests

2004 IEEE International Symposium on Industrial Electronics, 2004, Vol.2, p.803-807 vol. 2

2004

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IEEE_Xplore

Ultracapacitors modeling improvement using an experimental characterization based on step and frequency responses

2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551), 2004, Vol.1, p.131-134 Vol.1

2004

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IEEE_Xplore

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Assessing the role of primary tumour resection in patients with synchronous unresectable liver metastases from pancreatic neuroendocrine tumour of the body and tail. A propensity score survival evaluation

OC.06.7 RISK OF MISDIAGNOSIS AND OVERTREATMENT IN PATIENTS WITH MAIN PANCREATIC DUCT DILATATION AND SUSPECTED COMBINED/MAIN-DUCT IPMNS

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Strategy for designing accelerated aging tests to evaluate IGBT power modules lifetime in real operation mode

A systematic hard- and soft-switching performances evaluation of 1200 V punchthrough IGBT structures

Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability

Real-time quantification of different types of bcr-abl transcript in chronic myeloid leukemia

First step in the reliability assessment of ultracapacitors used as power source in hybrid electric vehicles

Non-destructive extraction of technological parameters for numerical simulation of conventional planar punch-through IGBT

IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power?

Local lifetime control IGBT structures: turn-off performances comparison for hard- and soft-switching between 1200V trench and new planar PT-IGBTs

Performances and potentialities of a very simple self-compensated pressure sensor demonstrator

A study of 600V punch-through IGBT dynamics under unclamped inductive switching

A Systematic Hard- and Soft-Switching Performances Evaluation of 1200V Punchthrough IGBT Structures

Influence of the thermo-mechanical residual state on the power assembly modellization

Evaluation of lead-free soldering for automotive applications

Thermal transient characterization of electronic assemblies by infrared thermography and Delta Vbemeter methods

Methodology to evaluate the correspondence between real conditions and accelerated tests of a thyristor system used in a power plant

Reliability study of the assembly of a large EGA on a build up board using thermo-mechanical simulations

Reliability analysis of lead-free BGA assemblies linking FE simulations and experimental results

Thermal fatigue resistance evaluation of solder joints in IGBT power modules for traction applications

Extensive fatigue investigation of solder joints in IGBT high power modules

Study of ultracapacitors dynamic behaviour using impedance frequency analysis on a specific test bench

An assessment of the connection between the working, operations of a thyristor system used in a power plant and accelerated ageing tests

Ultracapacitors modeling improvement using an experimental characterization based on step and frequency responses

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