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Wetting process and interfacial characteristic of Sn–3.0Ag–0.5Cu on different substrates at temperatures ranging from 503 K to 673 K

Applied surface science, 2011-03, Vol.257 (11), p.4877-4884

2011

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Facile one-pot electropolymerization of novel Cu complexed conducting polymer for Resistive Random Access Memory

Chemical physics letters, 2023-11, Vol.830, p.140791, Article 140791

2023

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Reactive Wetting Processes and Triple-Line Configuration of Sn-3.5Ag on Cu Substrates at Elevated Temperatures

Journal of electronic materials, 2012-08, Vol.41 (8), p.2051-2056

2012

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Electrochemical preparation of polypyrrole-Ag nanoparticles composite film and its resistive switching properties

Journal of alloys and compounds, 2022-12, Vol.927, p.167117, Article 167117

2022

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Enhanced Electrocatalytic Performance of the FePt/PPy‑C Composite toward Methanol Oxidation

ACS applied materials & interfaces, 2024-08, Vol.16 (34), p.44718-44727

2024

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Practical Research on Course Ideology and Politics of Chemistry and Society Oriented by "Three All-Round Education"

Daxue huaxue, 2022, p.202208146

2022

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Wettability of molten Sn–Bi–Cu solder on Cu substrate

Materials letters, 2009-09, Vol.63 (23), p.2067-2069

2009

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Dissolution mechanisms of steelmaking slags in sea water

Institution of Mining and Metallurgy. Transactions. Section C: Mineral processing and extractive metallurgy, 2017-04, Vol.126 (1-2), p.11-21

2017

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Spreading process and interfacial characteristic of Sn–17Bi–0.5Cu/Ni at temperatures ranging from 523K to 673K

Colloids and surfaces. A, Physicochemical and engineering aspects, 2012-11, Vol.414, p.57-65

2012

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Spreading process and interfacial characteristic of Sn–17Bi–0.5Cu/Ni at temperatures ranging from 523 K to 673 K

Colloids and surfaces. A, Physicochemical and engineering aspects, 2012-11, Vol.414, p.57-65

2012

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Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates

Microgravity science and technology, 2016-05, Vol.28 (2), p.115-122

2016

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Wetting process and interfacial characteristic of Sn–3.0Ag–0.5Cu on different substrates at temperatures ranging from 503K to 673K

Applied surface science, 2011-03, Vol.257 (11), p.4877-4884

2011

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Effect of Ce addition on macroscopic core-shell structure of Cu–Sn–Bi immiscible alloy

Materials letters, 2010-04, Vol.64 (7), p.814-816

2010

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Discussion on the Teaching Methods of General Chemistry with Reduced Lecture Hour

Daxue huaxue, 2018, Vol.33 (4), p.7-10

2018

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Wetting Behavior and Interfacial Characteristic of the Sn-3.5Ag Alloy on Ni Substrates

Advanced materials research, 2014, Vol.834-836, p.335-339

2014

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Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate

Chinese science bulletin, 2010-03, Vol.55 (9), p.797-801

2010

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A new Cu/Ni/Ag preform solder for die attachment of power electronics

2022 23rd International Conference on Electronic Packaging Technology (ICEPT), 2022, p.1-5

2022

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Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate

Chinese science bulletin, 2012-02, Vol.57 (6), p.682-686

2012

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Wettability and Interfacial Characteristic of Sn-Ag-Cu Solder on Ni Substrates at Elevated Temperatures

Advanced materials research, 2012, Vol.554-556, p.703-708

2012

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Wetting Behavior and Interfacial Characteristics of High Temperature Melts Under Microgravity

Physical Science Under Microgravity: Experiments on Board the SJ-10 Recoverable Satellite, 2019, p.361-394

2019

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Dissolution Mechanisms of Nutrient Elements from Steelmaking Slag into Seawater

Advances in Molten Slags, Fluxes, and Salts: Proceedings of the 10th International Conference on Molten Slags, Fluxes and Salts 2016, 2016, p.829-836

2016

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Dissolution Mechanisms of Nutrient Elements from Steelmaking Slag into Seawater

Advances in Molten Slags, Fluxes, and Salts, 2016, p.827-836

2016

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MicroRNA‐766 promotes cancer progression by targeting NR3C2 in hepatocellular carcinoma

The FASEB journal, 2019-01, Vol.33 (1), p.1456-1467

2019

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High atmospheric oxidation capacity drives wintertime nitrate pollution in the eastern Yangtze River Delta of China

Atmospheric chemistry and physics, 2022-04, Vol.22 (7), p.4355-4374

2022

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X-inactive-specific transcript of peripheral blood cells is regulated by exosomal Jpx and acts as a biomarker for female patients with hepatocellular carcinoma

Therapeutic advances in medical oncology, 2017-11, Vol.9 (11), p.665-677

2017

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Wetting process and interfacial characteristic of Sn–3.0Ag–0.5Cu on different substrates at temperatures ranging from 503 K to 673 K

Facile one-pot electropolymerization of novel Cu complexed conducting polymer for Resistive Random Access Memory

Reactive Wetting Processes and Triple-Line Configuration of Sn-3.5Ag on Cu Substrates at Elevated Temperatures

Electrochemical preparation of polypyrrole-Ag nanoparticles composite film and its resistive switching properties

Enhanced Electrocatalytic Performance of the FePt/PPy‑C Composite toward Methanol Oxidation

Practical Research on Course Ideology and Politics of Chemistry and Society Oriented by "Three All-Round Education"

Wettability of molten Sn–Bi–Cu solder on Cu substrate

Dissolution mechanisms of steelmaking slags in sea water

Spreading process and interfacial characteristic of Sn–17Bi–0.5Cu/Ni at temperatures ranging from 523K to 673K

Spreading process and interfacial characteristic of Sn–17Bi–0.5Cu/Ni at temperatures ranging from 523 K to 673 K

Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates

Wetting process and interfacial characteristic of Sn–3.0Ag–0.5Cu on different substrates at temperatures ranging from 503K to 673K

Effect of Ce addition on macroscopic core-shell structure of Cu–Sn–Bi immiscible alloy

Discussion on the Teaching Methods of General Chemistry with Reduced Lecture Hour

Wetting Behavior and Interfacial Characteristic of the Sn-3.5Ag Alloy on Ni Substrates

Wetting behavior and interfacial characteristic of Sn-Ag-Cu solder alloy on Cu substrate

A new Cu/Ni/Ag preform solder for die attachment of power electronics

Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate

Wettability and Interfacial Characteristic of Sn-Ag-Cu Solder on Ni Substrates at Elevated Temperatures

Wetting Behavior and Interfacial Characteristics of High Temperature Melts Under Microgravity

Dissolution Mechanisms of Nutrient Elements from Steelmaking Slag into Seawater

Dissolution Mechanisms of Nutrient Elements from Steelmaking Slag into Seawater

MicroRNA‐766 promotes cancer progression by targeting NR3C2 in hepatocellular carcinoma

High atmospheric oxidation capacity drives wintertime nitrate pollution in the eastern Yangtze River Delta of China

X-inactive-specific transcript of peripheral blood cells is regulated by exosomal Jpx and acts as a biomarker for female patients with hepatocellular carcinoma

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