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Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages

IEEE transactions on microwave theory and techniques, 2008-09, Vol.56 (9), p.2118-2128

2008

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Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz

IEEE transactions on microwave theory and techniques, 2009-08, Vol.57 (8), p.2072-2083

2009

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Far-Field Prediction Using Only Magnetic Near-Field Scanning for EMI Test

IEEE transactions on electromagnetic compatibility, 2014-12, Vol.56 (6), p.1335-1343

2014

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Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures

IEEE transactions on microwave theory and techniques, 2009-07, Vol.57 (7), p.1724-1733

2009

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A Hybrid Method for Signal Integrity Analysis of Traces and Vias in an Infinitely Large Plate Pair

IEEE transactions on electromagnetic compatibility, 2015-08, Vol.57 (4), p.885-893

2015

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Extraction of Via-Plate Capacitance of an Eccentric Via by an Integral Approximation Method

IEEE microwave and wireless components letters, 2009-05, Vol.19 (5), p.275-277

2009

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Radio-frequency interference estimation by reciprocity theorem with noise source characterized by Huygens's equivalent model

2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2016, p.358-363

2016

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Far-field radiation estimation from near-field measurements and image theory

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2014, p.609-614

2014

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Measurement validation for radio-frequency interference estimation by reciprocity theorem

2015 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2015, p.154-159

2015

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Complex Permittivity and Permeability Measurements and Finite-Difference Time-Domain Simulation of Ferrite Materials

IEEE transactions on electromagnetic compatibility, 2010-11, Vol.52 (4), p.878-887

2010

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A method to quantify the coupling between DVI and HDMI connectors

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2014, p.289-294

2014

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Cascaded Microwave Network Approach for Power and Signal Integrity Analysis of Multilayer Electronic Packages

IEEE transactions on components, packaging, and manufacturing technology (2011), 2011-09, Vol.1 (9), p.1428-1437

2011

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Conducted-emission modeling for a high-speed ECL clock buffer

2014 IEEE International Symposium on Electromagnetic Compatibility (EMC), 2014, p.594-599

2014

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Measurement validation of the dipole-moment model for IC radiated emissions

2013 IEEE International Symposium on Electromagnetic Compatibility, 2013, p.666-670

2013

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On the possibility to detect and visualize electromagnetic coupling paths

2011 IEEE International Symposium on Electromagnetic Compatibility, 2011, p.559-563

2011

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Coplanar Intermodulation Reference Generator Using Substrate Integrated Waveguide With Integrated Artificial Nonlinear Dipole

IEEE transactions on electromagnetic compatibility, 2019-06, Vol.61 (3), p.969-972

2019

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Near-field H to E transformation using plane wave spectrum theory

2011 IEEE International Symposium on Electromagnetic Compatibility, 2011, p.542-546

2011

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Modeling of ferrite-based materials for shielding enclosures

Journal of magnetism and magnetic materials, 2009-04, Vol.321 (7), p.730-733

2009

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Radiation physics from two-wire transmission lines

2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, 2015, p.160-164

2015

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Impedance of an infinitely large parallel-plane pair and its applications in engineering modeling

2009 IEEE International Symposium on Electromagnetic Compatibility, 2009, p.78-82

2009

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Statistical Passive Intermodulation Behavior on Coaxial Connector

2018 IEEE Holm Conference on Electrical Contacts, 2018, p.347-352

2018

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Return via connections for extending signal link path bandwidth of via transitions

2008 International Symposium on Electromagnetic Compatibility - EMC Europe, 2008, p.1-6

2008

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Efficient prediction of RF interference in a shielding enclosure with PCBs using a general segmentation method

2008 International Symposium on Electromagnetic Compatibility - EMC Europe, 2008, p.1-4

2008

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Near-field coupling estimation by source reconstruction and Huygens's equivalence principle

2015 IEEE Symposium on Electromagnetic Compatibility and Signal Integrity, 2015, p.324-329

2015

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Noise coupling between power/ground nets due to differential vias transitions in a multilayer PCB

2008 IEEE International Symposium on Electromagnetic Compatibility, 2008, p.1-6

2008

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Analytical Evaluation of Via-Plate Capacitance for Multilayer Printed Circuit Boards and Packages

Physics-Based Via and Trace Models for Efficient Link Simulation on Multilayer Structures Up to 40 GHz

Far-Field Prediction Using Only Magnetic Near-Field Scanning for EMI Test

Novel Methods for Modeling of Multiple Vias in Multilayered Parallel-Plate Structures

A Hybrid Method for Signal Integrity Analysis of Traces and Vias in an Infinitely Large Plate Pair

Extraction of Via-Plate Capacitance of an Eccentric Via by an Integral Approximation Method

Radio-frequency interference estimation by reciprocity theorem with noise source characterized by Huygens's equivalent model

Far-field radiation estimation from near-field measurements and image theory

Measurement validation for radio-frequency interference estimation by reciprocity theorem

Complex Permittivity and Permeability Measurements and Finite-Difference Time-Domain Simulation of Ferrite Materials

A method to quantify the coupling between DVI and HDMI connectors

Cascaded Microwave Network Approach for Power and Signal Integrity Analysis of Multilayer Electronic Packages

Conducted-emission modeling for a high-speed ECL clock buffer

Measurement validation of the dipole-moment model for IC radiated emissions

On the possibility to detect and visualize electromagnetic coupling paths

Coplanar Intermodulation Reference Generator Using Substrate Integrated Waveguide With Integrated Artificial Nonlinear Dipole

Near-field H to E transformation using plane wave spectrum theory

Modeling of ferrite-based materials for shielding enclosures

Radiation physics from two-wire transmission lines

Impedance of an infinitely large parallel-plane pair and its applications in engineering modeling

Statistical Passive Intermodulation Behavior on Coaxial Connector

Return via connections for extending signal link path bandwidth of via transitions

Efficient prediction of RF interference in a shielding enclosure with PCBs using a general segmentation method

Near-field coupling estimation by source reconstruction and Huygens's equivalence principle

Noise coupling between power/ground nets due to differential vias transitions in a multilayer PCB

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