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Review of life cycle assessment on consumer electronic products: Developments and the way ahead

Critical reviews in environmental science and technology, 2016-09, Vol.46 (18), p.1441-1497

2016

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Analysis of Manufacturing-Induced Defects and Structural Deformations in Lithium-Ion Batteries Using Computed Tomography

Energies (Basel), 2018-04, Vol.11 (4), p.925

2018

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Influence of small Sb nanoparticles additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy

Journal of materials science. Materials in electronics, 2012-07, Vol.23 (7), p.1427-1434

2012

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The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads

Journal of alloys and compounds, 2010-09, Vol.506 (1), p.216-223

2010

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Eye-friendly reduced graphene oxide circuits with nonlinear optical transparency on flexible poly(ethylene terephthalate) substrates

Journal of materials chemistry. C, Materials for optical and electronic devices, 2015-01, Vol.3 (43), p.11294-11299

2015

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Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes

Laser & photonics reviews, 2020-12, Vol.14 (12), p.n/a

2020

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Ultrasonic Health Monitoring of Lithium-Ion Batteries

Electronics (Basel), 2019-07, Vol.8 (7), p.751

2019

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Prognostics and health management for induction machines: a comprehensive review

Journal of intelligent manufacturing, 2024-03, Vol.35 (3), p.937-962

2024

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Bayesian based lifetime prediction for high-power white LEDs

Expert systems with applications, 2021-12, Vol.185, p.115627, Article 115627

2021

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Microstructure, kinetic analysis and hardness of Sn―Ag―Cu―1 wt% nano-ZrO2 composite solder on OSP-Cu pads

Journal of alloys and compounds, 2011-02, Vol.509 (7), p.3319-3325

2011

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Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn―Ag―Cu solder on Au/Ni metallized Cu pads

Microelectronics and reliability, 2011-12, Vol.51 (12), p.2306-2313

2011

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System level reliability assessment for high power light-emitting diode lamp based on a Bayesian network method

Measurement : journal of the International Measurement Confederation, 2021-05, Vol.176, p.109191, Article 109191

2021

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Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates

Microelectronics and reliability, 2011-05, Vol.51 (5), p.975-984

2011

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Additive and Photochemical Manufacturing of Copper

Scientific reports, 2016-12, Vol.6 (1), p.39584-39584, Article 39584

2016

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Lumen Degradation Lifetime Prediction for High-Power White LEDs Based on the Gamma Process Model

IEEE photonics journal, 2019-12, Vol.11 (6), p.1-16

2019

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A life-cycle assessment for eco-redesign of a consumer electronic product

Journal of engineering design, 2011-02, Vol.22 (2), p.69-85

2011

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Eco-redesign of a personal electronic product subject to the energy-using product directive

International journal of production research, 2012-03, Vol.50 (5), p.1411-1423

2012

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Photochemical Copper Coating on 3D Printed Thermoplastics

Scientific reports, 2016-08, Vol.6 (1), p.31188-31188, Article 31188

2016

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Nd:YAG laser drilling in epoxy resin/AlN composites material

Composites. Part A, Applied science and manufacturing, 2007-09, Vol.38 (9), p.2055-2064

2007

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Investigation of small Sn–3.5Ag–0.5Cu additions on the microstructure and properties of Sn–8Zn–3Bi solder on Au/Ni/Cu pads

Journal of alloys and compounds, 2010-01, Vol.489 (2), p.678-684

2010

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Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads

Microelectronics and reliability, 2010-12, Vol.50 (12), p.2051-2058

2010

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Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages

Microelectronics and reliability, 2009-07, Vol.49 (7), p.746-753

2009

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Effect of small Sn–3.5Ag–0.5Cu additions on the structure and properties of Sn–9Zn solder in ball grid array packages

Microelectronic engineering, 2009-11, Vol.86 (11), p.2347-2353

2009

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Studies on laser ablation of low temperature co-fired ceramics (LTCC)

International journal of advanced manufacturing technology, 2009-06, Vol.42 (7-8), p.696-702

2009

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Modeling Social Life Cycle Assessment framework for an electronic screen product – A case study of an integrated desktop computer

Journal of cleaner production, 2018-10, Vol.197, p.417-434

2018

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Review of life cycle assessment on consumer electronic products: Developments and the way ahead

Analysis of Manufacturing-Induced Defects and Structural Deformations in Lithium-Ion Batteries Using Computed Tomography

Influence of small Sb nanoparticles additions on the microstructure, hardness and tensile properties of Sn–9Zn binary eutectic solder alloy

The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads

Eye-friendly reduced graphene oxide circuits with nonlinear optical transparency on flexible poly(ethylene terephthalate) substrates

Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes

Ultrasonic Health Monitoring of Lithium-Ion Batteries

Prognostics and health management for induction machines: a comprehensive review

Bayesian based lifetime prediction for high-power white LEDs

Microstructure, kinetic analysis and hardness of Sn―Ag―Cu―1 wt% nano-ZrO2 composite solder on OSP-Cu pads

Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn―Ag―Cu solder on Au/Ni metallized Cu pads

System level reliability assessment for high power light-emitting diode lamp based on a Bayesian network method

Microstructure, thermal analysis and hardness of a Sn-Ag-Cu-1 wt% nano-TiO2 composite solder on flexible ball grid array substrates

Additive and Photochemical Manufacturing of Copper

Lumen Degradation Lifetime Prediction for High-Power White LEDs Based on the Gamma Process Model

A life-cycle assessment for eco-redesign of a consumer electronic product

Eco-redesign of a personal electronic product subject to the energy-using product directive

Photochemical Copper Coating on 3D Printed Thermoplastics

Nd:YAG laser drilling in epoxy resin/AlN composites material

Investigation of small Sn–3.5Ag–0.5Cu additions on the microstructure and properties of Sn–8Zn–3Bi solder on Au/Ni/Cu pads

Effect of nano Al2O3 additions on the microstructure, hardness and shear strength of eutectic Sn-9Zn solder on Au/Ni metallized Cu pads

Interfacial microstructure and shear strength of Ag nano particle doped Sn–9Zn solder in ball grid array packages

Effect of small Sn–3.5Ag–0.5Cu additions on the structure and properties of Sn–9Zn solder in ball grid array packages

Studies on laser ablation of low temperature co-fired ceramics (LTCC)

Modeling Social Life Cycle Assessment framework for an electronic screen product – A case study of an integrated desktop computer

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