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Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing

Journal of alloys and compounds, 2014-05, Vol.595, p.92-102

2014

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Ink-jet printing and camera flash sintering of silver tracks on different substrates

Journal of materials processing technology, 2010-11, Vol.210 (15), p.2268-2272

2010

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Introduction to graphene electronics - a new era of digital transistors and devices

Contemporary physics, 2013-09, Vol.54 (5), p.233-251

2013

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Lumen Degradation Lifetime Prediction for High-Power White LEDs Based on the Gamma Process Model

IEEE photonics journal, 2019-12, Vol.11 (6), p.1-16

2019

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Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes

Laser & photonics reviews, 2020-12, Vol.14 (12), p.n/a

2020

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Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn―Ag―Cu solder on Au/Ni metallized Cu pads

Microelectronics and reliability, 2011-12, Vol.51 (12), p.2306-2313

2011

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Modeling Social Life Cycle Assessment framework for an electronic screen product – A case study of an integrated desktop computer

Journal of cleaner production, 2018-10, Vol.197, p.417-434

2018

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Relevance and feasibility of the existing social LCA methods and case studies from a decision-making perspective

Journal of cleaner production, 2018-01, Vol.171, p.690-703

2018

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The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads

Journal of alloys and compounds, 2010-09, Vol.506 (1), p.216-223

2010

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Fabrication and adhesion performance of gold conductive patterns on silicon substrate by laser sintering

Applied surface science, 2011-10, Vol.258 (1), p.478-481

2011

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Life cycle assessment study of an integrated desktop device -comparison of two information and communication technologies: Desktop computers versus all-in-ones

Journal of cleaner production, 2017-07, Vol.156, p.828-837

2017

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Size Control and Characterization of Sn-Ag-Cu Lead-Free Nanosolders by a Chemical Reduction Process

Journal of electronic materials, 2012-02, Vol.41 (2), p.313-321

2012

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Enhanced thermal conductivity of boron nitride epoxy-matrix composite through multi-modal particle size mixing

Journal of applied polymer science, 2007-12, Vol.106 (6), p.3587-3591

2007

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Effects of laser polishing on surface microstructure and corrosion resistance of additive manufactured CoCr alloys

Applied surface science, 2018-06, Vol.443, p.167-175

2018

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XPS investigation of the chemical characteristics of Kapton films ablated by a pulsed TEA CO2 laser

Surface & coatings technology, 2002-04, Vol.153 (2-3), p.210-216

2002

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Laser polishing of additive manufactured CoCr alloy components with complex surface geometry

Journal of materials processing technology, 2018-12, Vol.262, p.53-64

2018

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UV Nd:YAG laser ablation of copper: chemical states in both crater and halo studied by XPS

Applied surface science, 2003-07, Vol.217 (1), p.170-180

2003

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Rheological Characterization and Statistical Modeling of Resin Flow of No-flow Polyimide Prepreg in Rigid-Flex Printed Circuit Lamination

Journal of composite materials, 2011-01, Vol.45 (2), p.171-185

2011

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Preparation and properties of hollow glass microsphere-filled epoxy-matrix composites

Composites science and technology, 2009-02, Vol.69 (2), p.260-264

2009

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Laser polishing of additive manufactured CoCr components for controlling their wettability characteristics

Surface & coatings technology, 2018-10, Vol.351, p.89-98

2018

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Effect of graphene doping on microstructural and mechanical properties of Sn–8Zn–3Bi solder joints together with electromigration analysis

Journal of alloys and compounds, 2013-12, Vol.580, p.162-171

2013

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Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1wt% nano-ZrO2 composite solder on OSP-Cu pads

Journal of alloys and compounds, 2011-02, Vol.509 (7), p.3319-3325

2011

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A study of the heat-affected zone in the UV YAG laser drilling of GFRP materials

Journal of materials processing technology, 2002-03, Vol.122 (2), p.278-285

2002

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Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1wt% nano-TiO2 composite solder on flexible ball grid array substrates

Microelectronics and reliability, 2011-05, Vol.51 (5), p.975-984

2011

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Study on the properties of the epoxy-matrix composites filled with thermally conductive AlN and BN ceramic particles

Journal of applied polymer science, 2010-12, Vol.118 (5), p.2754-2764

2010

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Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing

Ink-jet printing and camera flash sintering of silver tracks on different substrates

Introduction to graphene electronics - a new era of digital transistors and devices

Lumen Degradation Lifetime Prediction for High-Power White LEDs Based on the Gamma Process Model

Machine Learning and Digital Twin Driven Diagnostics and Prognostics of Light‐Emitting Diodes

Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn―Ag―Cu solder on Au/Ni metallized Cu pads

Modeling Social Life Cycle Assessment framework for an electronic screen product – A case study of an integrated desktop computer

Relevance and feasibility of the existing social LCA methods and case studies from a decision-making perspective

The influence of addition of Al nano-particles on the microstructure and shear strength of eutectic Sn–Ag–Cu solder on Au/Ni metallized Cu pads

Fabrication and adhesion performance of gold conductive patterns on silicon substrate by laser sintering

Life cycle assessment study of an integrated desktop device -comparison of two information and communication technologies: Desktop computers versus all-in-ones

Size Control and Characterization of Sn-Ag-Cu Lead-Free Nanosolders by a Chemical Reduction Process

Enhanced thermal conductivity of boron nitride epoxy-matrix composite through multi-modal particle size mixing

Effects of laser polishing on surface microstructure and corrosion resistance of additive manufactured CoCr alloys

XPS investigation of the chemical characteristics of Kapton films ablated by a pulsed TEA CO2 laser

Laser polishing of additive manufactured CoCr alloy components with complex surface geometry

UV Nd:YAG laser ablation of copper: chemical states in both crater and halo studied by XPS

Rheological Characterization and Statistical Modeling of Resin Flow of No-flow Polyimide Prepreg in Rigid-Flex Printed Circuit Lamination

Preparation and properties of hollow glass microsphere-filled epoxy-matrix composites

Laser polishing of additive manufactured CoCr components for controlling their wettability characteristics

Effect of graphene doping on microstructural and mechanical properties of Sn–8Zn–3Bi solder joints together with electromigration analysis

Microstructure, kinetic analysis and hardness of Sn–Ag–Cu–1wt% nano-ZrO2 composite solder on OSP-Cu pads

A study of the heat-affected zone in the UV YAG laser drilling of GFRP materials

Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1wt% nano-TiO2 composite solder on flexible ball grid array substrates

Study on the properties of the epoxy-matrix composites filled with thermally conductive AlN and BN ceramic particles

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