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The study of compressive and tensile stress on MOSFET's I-V, C-V characteristics and it's impacts on hot carrier injection and negative bias temperature instability

2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual, 2003, p.612-613

2003

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Real case study for isothermal EM test as a process control methodology

2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167), 2001, p.184-188

2001

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Novel ESD protection structure with embedded SCR LDMOS for smart power technology

2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320), 2002, p.156-161

2002

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Hot-carrier-reliability design rules for translating device degradation to CMOS digital circuit degradation

IEEE transactions on electron devices, 1994-05, Vol.41 (5), p.681-691

1994

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Hot-carrier-induced off-state current leakage in submicrometer PMOSFET devices

IEEE electron device letters, 1994-11, Vol.15 (11), p.463-465

1994

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N-FET HCI reliability improvement by nitrogen interstitialization and its mechanism

2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320), 2002, p.272-277

2002

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Applying dynamic voltage stressing to reduce early failure rate

2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167), 2001, p.37-41

2001

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Sulfated Proteoglycans in the Lamina Cribrosa of Normal Monkey Eyes and Monkey Eyes with Laser-induced Glaucoma

Experimental eye research, 1994-02, Vol.58 (2), p.231-244

1994

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Analysis of new hot carrier degradation phenomena: 'W' or 'S' shape evolution of LDD NMOSFET

2001 IEEE International Reliability Physics Symposium Proceedings. 39th Annual (Cat. No.00CH37167), 2001, p.406-411

2001

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The Isothermal Wafer Level Test for VLSl Interconnect Evaluation

International Report on Wafer Level Reliability Workshop, 1992, p.186-198

1992

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Circuit hot carrier reliability simulation in advanced CMOS technology process development

Proceedings of 4th International Conference on Solid-State and IC Technology, 1995, p.413-415

1995

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Circuit hot carrier reliability simulation in advanced CMOS process technology development

Proceedings of 1994 IEEE International Integrated Reliability Workshop (IRWS), 1994, p.73-78

1994

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The effect of concentration and temperature gradients on solute redistribution

Journal of crystal growth, 1972-05, Vol.13-14, p.797-803

1972

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Electromigration performance of laser planarized aluminum alloy films

Seventh International IEEE Conference on VLSI Multilevel Interconnection, 1990, p.365-367

1990

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A comparison of inverter-type circuit lifetime and quasi-static analysis of NMOSFET lifetime

29th Annual Proceedings Reliability Physics 1991, 1991, p.112-117

1991

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Influence of gravity-free solidification on solute microsegregation

Journal of crystal growth, 1975-01, Vol.29 (3), p.329-341

1975

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Stress Induced Voids in Aluminum Interconnects During IC Processing

23rd International Reliability Physics Symposium, 1985, p.126-137

1985

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Simulations of CMOS circuit degradation due to hot-carrier effects

30th Annual Proceedings Reliability Physics 1992, 1992, p.16-23

1992

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The effect of CF/sub 4/ plasma on the device parameters and reliability properties of 0.18 /spl mu/m MOSFETs

Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614), 2002, p.23-26

2002

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Impact of Ceramic Packaging Anneal on the Reliability of Al Interconnects

24th International Reliability Physics Symposium, 1986, p.164-171

1986

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Expression of modified low-density lipoprotein receptors by trabecular meshwork cells

Current eye research, 1991, Vol.10 (12), p.1101-1112

1991

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The changing role and future challenges of quality and reliability in the foundry industry

Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614), 2002, p.1-4

2002

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Diagnostics of plasma process induced failure on analog device's mismatch characteristics

7th International Symposium on Plasma- and Process-Induced Damage, 2002, p.64-67

2002

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A via failure mode in electromigration of multilevel interconnect

Seventh International IEEE Conference on VLSI Multilevel Interconnection, 1990, p.142-148

1990

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A method to project hot carrier induced punch through voltage reduction for deep submicron LDD PMOS FETs at room and elevated temperatures

30th Annual Proceedings Reliability Physics 1992, 1992, p.131-135

1992

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The study of compressive and tensile stress on MOSFET's I-V, C-V characteristics and it's impacts on hot carrier injection and negative bias temperature instability

Real case study for isothermal EM test as a process control methodology

Novel ESD protection structure with embedded SCR LDMOS for smart power technology

Hot-carrier-reliability design rules for translating device degradation to CMOS digital circuit degradation

Hot-carrier-induced off-state current leakage in submicrometer PMOSFET devices

N-FET HCI reliability improvement by nitrogen interstitialization and its mechanism

Applying dynamic voltage stressing to reduce early failure rate

Sulfated Proteoglycans in the Lamina Cribrosa of Normal Monkey Eyes and Monkey Eyes with Laser-induced Glaucoma

Analysis of new hot carrier degradation phenomena: 'W' or 'S' shape evolution of LDD NMOSFET

The Isothermal Wafer Level Test for VLSl Interconnect Evaluation

Circuit hot carrier reliability simulation in advanced CMOS technology process development

Circuit hot carrier reliability simulation in advanced CMOS process technology development

The effect of concentration and temperature gradients on solute redistribution

Electromigration performance of laser planarized aluminum alloy films

A comparison of inverter-type circuit lifetime and quasi-static analysis of NMOSFET lifetime

Influence of gravity-free solidification on solute microsegregation

Stress Induced Voids in Aluminum Interconnects During IC Processing

Simulations of CMOS circuit degradation due to hot-carrier effects

The effect of CF/sub 4/ plasma on the device parameters and reliability properties of 0.18 /spl mu/m MOSFETs

Impact of Ceramic Packaging Anneal on the Reliability of Al Interconnects

Expression of modified low-density lipoprotein receptors by trabecular meshwork cells

The changing role and future challenges of quality and reliability in the foundry industry

Diagnostics of plasma process induced failure on analog device's mismatch characteristics

A via failure mode in electromigration of multilevel interconnect

A method to project hot carrier induced punch through voltage reduction for deep submicron LDD PMOS FETs at room and elevated temperatures

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