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An AI-Based Adaptive Surrogate Modeling Method for the In-Service Response of UVLED Modules

Electronics (Basel), 2022-09, Vol.11 (18), p.2861

Yuan, Cadmus

2022

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Nanowire-based gas sensors

Sensors and actuators. B, Chemical, 2013-02, Vol.177, p.178-195

2013

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Solder Joint Reliability Modeling by Sequential Artificial Neural Network for Glass Wafer Level Chip Scale Package

IEEE access, 2020-01, Vol.8, p.1-1

2020

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Solder Joint Reliability Risk Estimation by AI-Assisted Simulation Framework with Genetic Algorithm to Optimize the Initial Parameters for AI Models

Materials, 2021-08, Vol.14 (17), p.4835

2021

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Coefficient Extraction of SAC305 Solder Constitutive Equations Using Equation-Informed Neural Networks

Materials, 2023-07, Vol.16 (14), p.4922

2023

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The extended Beer–Lambert theory for ray tracing modeling of LED chip-scaled packaging application with multiple luminescence materials

Optical materials, 2015-12, Vol.50, p.193-198

Yuan, Cadmus C.A.

2015

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Deep machine learning of the spectral power distribution of the LED system with multiple degradation mechanisms

Journal of mechanics, 2021-01, Vol.37, p.172-183

2021

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Investigation of the mechanical characteristics of the Cu/low-k BEOL under wire bonding process loading

Journal of mechanics, 2022-11, Vol.38, p.539-551

2022

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Impact of the functional group on the working range of polyaniline as carbon dioxide sensors

Sensors and actuators. B, Chemical, 2012-12, Vol.175, p.15-21

2012

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The research on the dental bridge model-making process based on the curing shrinkage epoxy and residual stress reduction

Journal of mechanics, 2021-12, Vol.37, p.659-668

2021

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Biomechanical analysis of rigid and non-rigid connection with implant abutment designs for tooth-implant supported prosthesis: A finite element analysis

Journal of dental sciences, 2022-01, Vol.17 (1), p.490-499

2022

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Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate

Journal of electronic materials, 2015-07, Vol.44 (7), p.2450-2457

2015

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Molecular modeling of temperature dependence of solubility parameters for amorphous polymers

Journal of molecular modeling, 2012-06, Vol.18 (6), p.2333-2341

2012

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Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors

Sensors and actuators. B, Chemical, 2012-11, Vol.174, p.210-216

2012

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Molecular model for the charge carrier density dependence of conductivity of polyaniline as chemical sensing materials

Sensors and actuators. B, Chemical, 2013-02, Vol.177, p.856-861

2013

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Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging

Journal of materials science. Materials in electronics, 2014-11, Vol.25 (11), p.4954-4959

2014

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Thermal and mechanical effects of voids within flip chip soldering in LED packages

Microelectronics and reliability, 2014-09, Vol.54 (9-10), p.2028-2033

2014

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Simulation education utilizing phantom and angle reference guide in pulmonary nodule CT localization

Heliyon, 2023-07, Vol.9 (7), p.e18329-e18329, Article e18329

2023

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Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering

IEEE transactions on components, packaging, and manufacturing technology (2011), 2014-11, Vol.4 (11), p.1754-1759

2014

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Using a Flexible IoT Architecture and Sequential AI Model to Recognize and Predict the Production Activities in the Labor-Intensive Manufacturing Site

Electronics (Basel), 2021-10, Vol.10 (20), p.2540

2021

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Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes

Microelectronics and reliability, 2014-11, Vol.54 (11), p.2448-2455

2014

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Thermal analysis of chip-on-flexible LED packages with Cu heat sinks by SnBi soldering

Microelectronics international, 2016-01, Vol.33 (1), p.42-46

2016

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Establishment of the coarse grained parameters for epoxy-copper interfacial separation

Journal of applied physics, 2012-05, Vol.111 (9), p.094906-094906-7

2012

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Thermal simulation of flexible LED package enhanced with copper pillars

Journal of semiconductors, 2015-06, Vol.36 (6), p.85-88

刘洋梁润园黄洁莹袁长安张国旗孙凤莲

2015

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Wire Boning Process Failure Risk Estimation of the Cu/low-k Structure using the Transient Finite Element

2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2022, p.1-4

2022

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IEEE_Xplore

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An AI-Based Adaptive Surrogate Modeling Method for the In-Service Response of UVLED Modules

Nanowire-based gas sensors

Solder Joint Reliability Modeling by Sequential Artificial Neural Network for Glass Wafer Level Chip Scale Package

Solder Joint Reliability Risk Estimation by AI-Assisted Simulation Framework with Genetic Algorithm to Optimize the Initial Parameters for AI Models

Coefficient Extraction of SAC305 Solder Constitutive Equations Using Equation-Informed Neural Networks

The extended Beer–Lambert theory for ray tracing modeling of LED chip-scaled packaging application with multiple luminescence materials

Deep machine learning of the spectral power distribution of the LED system with multiple degradation mechanisms

Investigation of the mechanical characteristics of the Cu/low-k BEOL under wire bonding process loading

Impact of the functional group on the working range of polyaniline as carbon dioxide sensors

The research on the dental bridge model-making process based on the curing shrinkage epoxy and residual stress reduction

Biomechanical analysis of rigid and non-rigid connection with implant abutment designs for tooth-implant supported prosthesis: A finite element analysis

Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate

Molecular modeling of temperature dependence of solubility parameters for amorphous polymers

Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors

Molecular model for the charge carrier density dependence of conductivity of polyaniline as chemical sensing materials

Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging

Thermal and mechanical effects of voids within flip chip soldering in LED packages

Simulation education utilizing phantom and angle reference guide in pulmonary nodule CT localization

Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering

Using a Flexible IoT Architecture and Sequential AI Model to Recognize and Predict the Production Activities in the Labor-Intensive Manufacturing Site

Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes

Thermal analysis of chip-on-flexible LED packages with Cu heat sinks by SnBi soldering

Establishment of the coarse grained parameters for epoxy-copper interfacial separation

Thermal simulation of flexible LED package enhanced with copper pillars

Wire Boning Process Failure Risk Estimation of the Cu/low-k Structure using the Transient Finite Element

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