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Effects of CO2 laser pretreatment conditions on adhesion properties of Cu/Ti films and polyimide substrates

Journal of materials science. Materials in electronics, 2021-06, Vol.32 (11), p.14740-14748

2021

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In-situ Observation and Modeling of Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with OSP and ENEPIG Surface Finish

Electronic materials letters, 2023-05, Vol.19 (3), p.229-238

2023

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Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate

Microelectronics and reliability, 2019-08, Vol.99, p.62-73

2019

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Enhanced Thermo-Mechanical Reliability of Ultralow-K Dielectrics with Self-Organized Molecular Pores

Materials, 2021-04, Vol.14 (9), p.2284

2021

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Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction

Journal of materials science. Materials in electronics, 2021-12, Vol.32 (24), p.28346-28357

2021

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Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate

Materials, 2021-05, Vol.14 (9), p.2367

2021

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Effects of graphene oxide on the electromigration lifetime of lead-free solder joints

Journal of materials science. Materials in electronics, 2019-02, Vol.30 (3), p.2334-2341

2019

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Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate

Metals (Basel ), 2021-02, Vol.11 (2), p.210

2021

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Effect of Cu/Fe addition on the microstructures and electrical performances of Ni–Co–Mn oxides

Journal of alloys and compounds, 2021-04, Vol.859, p.157769, Article 157769

2021

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Thermal reliability of Cu sintering joints for high-temperature die attach

Microelectronics and reliability, 2023-08, Vol.147, p.115002, Article 115002

2023

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Effects of solvents, activators, and additives on sintering properties of Cu paste for die attach

Journal of materials science. Materials in electronics, 2023-07, Vol.34 (19), p.1459, Article 1459

2023

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Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

Journal of alloys and compounds, 2017-12, Vol.728, p.992-1001

2017

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Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition

Metals (Basel ), 2018-08, Vol.8 (8), p.586

2018

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Effect of Ar Plasma Treatment for Surface of Insert Metal on Property of TLP Bonding Joint for Power Module

Journal of Welding and Joining, 2020-08, Vol.38 (4), p.366-373

2020

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Interfacial Properties of Sn-Cu-xCr Alloy using Laser-Assisted Bonding

Journal of Welding and Joining, 2023-08, Vol.41 (4), p.291-298

2023

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Effect of Bimodal Cu Paste on Interfacial Properties and Mechanical Strength of Sintered Joints

Journal of electronic materials, 2022-12, Vol.51 (12), p.7326-7336

2022

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Intermetallic compound formation and mechanical property of SN-CU-XCR/CU lead-free solder joint

2018 Pan Pacific Microelectronics Symposium (Pan Pacific), 2018, p.1-8

2018

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A Study on Aging Fracture Behavior of Sintered Joint by Bi-Modal Cu Paste

Journal of Welding and Joining, 2022-12, Vol.40 (6), p.540-546

2022

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A Study on Joint Properties of Sn-Cu-(X)Al-(Y)Si/Cu Solder by Multiple Reflow

Journal of Welding and Joining, 2020-04

2020

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A Study on the Electrochemical Corrosion Property of Sn-xSb Solder Alloy

Journal of Welding and Joining, 2018-06, Vol.36 (3), p.78-82

2018

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Terminal Sinter-Bonding Using Silver Paste for Aluminum Nitride Heater

Journal of Welding and Joining, 2021-08, Vol.39 (4), p.384-391

2021

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Intermetallic Compounds and Mechanical Property of Sn-Cu-xCr/Cu Solder Joint by Multiple reflows Conditions

Journal of Welding and Joining, 2018-04, Vol.36 (2), p.21-27

2018

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Trends of Researches and Technologies of Electronic Packaging Using Graphene

Journal of the Microelectronics and Packaging Society, 2016-06, Vol.23 (2), p.1-10

2016

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Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint

Journal of Welding and Joining, 2016-02, Vol.34 (1), p.26-34

2016

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Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module

Journal of Welding and Joining, 2017-10, Vol.35 (5), p.38-47

2017

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Effects of CO2 laser pretreatment conditions on adhesion properties of Cu/Ti films and polyimide substrates

In-situ Observation and Modeling of Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with OSP and ENEPIG Surface Finish

Intermetallic compound growth between Sn-Cu-Cr lead-free solder and Cu substrate

Enhanced Thermo-Mechanical Reliability of Ultralow-K Dielectrics with Self-Organized Molecular Pores

Microstructure and mechanical properties of Ag nanoparticles-modified Sn–58Bi/Cu solder joints during liquid-state reaction

Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate

Effects of graphene oxide on the electromigration lifetime of lead-free solder joints

Nucleation and Morphology of Cu6Sn5 Intermetallic at the Interface between Molten Sn-0.7Cu-0.2Cr Solder and Cu Substrate

Effect of Cu/Fe addition on the microstructures and electrical performances of Ni–Co–Mn oxides

Thermal reliability of Cu sintering joints for high-temperature die attach

Effects of solvents, activators, and additives on sintering properties of Cu paste for die attach

Intermetallic compound formation and mechanical property of Sn-Cu-xCr/Cu lead-free solder joint

Improvement in Thermomechanical Reliability of Low Cost Sn-Based BGA Interconnects by Cr Addition

Effect of Ar Plasma Treatment for Surface of Insert Metal on Property of TLP Bonding Joint for Power Module

Interfacial Properties of Sn-Cu-xCr Alloy using Laser-Assisted Bonding

Effect of Bimodal Cu Paste on Interfacial Properties and Mechanical Strength of Sintered Joints

Intermetallic compound formation and mechanical property of SN-CU-XCR/CU lead-free solder joint

A Study on Aging Fracture Behavior of Sintered Joint by Bi-Modal Cu Paste

A Study on Joint Properties of Sn-Cu-(X)Al-(Y)Si/Cu Solder by Multiple Reflow

A Study on the Electrochemical Corrosion Property of Sn-xSb Solder Alloy

Terminal Sinter-Bonding Using Silver Paste for Aluminum Nitride Heater

Intermetallic Compounds and Mechanical Property of Sn-Cu-xCr/Cu Solder Joint by Multiple reflows Conditions

Trends of Researches and Technologies of Electronic Packaging Using Graphene

Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint

Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module

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