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Investigation of low-cost through glass vias formation on borosilicate glass by picosecond laser-induced selective etching

Journal of materials science. Materials in electronics, 2021-06, Vol.32 (12), p.16481-16493

2021

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Development of a Reliable High-Performance WLP for a SAW Device

Sensors (Basel, Switzerland), 2022-08, Vol.22 (15), p.5760

2022

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Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter

Sensors (Basel, Switzerland), 2022-03, Vol.22 (6), p.2114

2022

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Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Sensors (Basel, Switzerland), 2023-12, Vol.24 (1), p.171

2023

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Synthesis of 4-in. multilayer molybdenum disulfide via space-confinement thermolysis

Applied physics letters, 2023-11, Vol.123 (21)

2023

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Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application

Sensors (Basel, Switzerland), 2020-07, Vol.20 (15), p.4077

2020

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Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection

Micromachines (Basel), 2022-10, Vol.13 (10), p.1799

2022

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Warpage Prediction and Optimization for Embedded Silicon Fan-Out Wafer-Level Packaging Based on an Extended Theoretical Model

IEEE transactions on components, packaging, and manufacturing technology (2011), 2019-05, Vol.9 (5), p.845-853

2019

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Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state

Journal of materials science. Materials in electronics, 2020-02, Vol.31 (4), p.2967-2975

2020

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Development of reliable low temperature wafer level hermetic bonding using composite seal joint

Microelectronics and reliability, 2012-03, Vol.52 (3), p.589-594

Yu, Daquan

2012

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Fast frequency upconversion imaging based on quasi-phase match

Optical and quantum electronics, 2021-08, Vol.53 (8), Article 413

2021

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Quasi in-situ observation of Ni-plated solder from various fracture mechanism using EBSD

Journal of materials research and technology, 2023-05, Vol.24, p.1875-1881

2023

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Electrical performance characterization of glass substrate for millimeter-wave applications

Journal of materials science. Materials in electronics, 2023, Vol.34 (2), p.126, Article 126

2023

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The development of effective model for thermal conduction analysis for 2.5D packaging using TSV interposer

Microelectronics and reliability, 2014-02, Vol.54 (2), p.425-434

2014

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A Low-Loss Bandpass Filter with Stacked Double-Layer Structure using Glass-based Integrated Passive Device Technology

IEEE electron device letters, 2023-07, Vol.44 (7), p.1-1

2023

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Experimental and Numerical Investigations of the Warpage of Fan-Out Wafer-Level Packaging With SAW Filters

IEEE transactions on components, packaging, and manufacturing technology (2011), 2022-05, Vol.12 (5), p.869-877

2022

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Properties and electric characterizations of tetraethyl orthosilicate-based plasma enhanced chemical vapor deposition oxide film deposited at 400°C for through silicon via application

Thin solid films, 2014-01, Vol.550, p.259-263

2014

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33.5 A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm2 Power Density

2021 IEEE International Solid- State Circuits Conference (ISSCC), 2021, Vol.64, p.468-470

2021

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Synthesized Improvement of Die Fly and Die Shift Concerning the Wafer Molding Process for Ultrafine SAW Filter FOWLP

Electronics (Basel), 2023-04, Vol.12 (9), p.2073

2023

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Meta-Biosensor With High Q-Factor Based on Wet Etching for Terahertz Detection

IEEE sensors journal, 2024-04, Vol.24 (7), p.9989-9997

2024

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Development of Compact Millimeter-Wave Antenna by Stacking of Five Glass Wafers With Through Glass Vias

IEEE electron device letters, 2022-06, Vol.43 (6), p.934-937

2022

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Design, analysis and test of high-frequency interconnections in 2.5D package with silicon interposer

Journal of semiconductors, 2016-04, Vol.37 (4), p.113-119

任晓黎庞诚秦征平野姜峰薛恺刘海燕于大全

2016

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Optimal design analysis for thermal performance of high power 2.5D package

Journal of semiconductors, 2016-03, Vol.37 (3), p.110-114

刘晓阳马鹤于大全陈文录吴小龙

2016

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Warpage Prediction and Optimization for Wafer Level Glass Interposer Packaging

IEEE transactions on components, packaging, and manufacturing technology (2011), 2024-05, p.1-1

2024

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Growth behavior and mechanism of atomic layer deposition of Ru for replacing Cu-interconnects

Vacuum, 2024-03, Vol.221, p.112927, Article 112927

2024

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Investigation of low-cost through glass vias formation on borosilicate glass by picosecond laser-induced selective etching

Development of a Reliable High-Performance WLP for a SAW Device

Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter

Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and Packaging

Synthesis of 4-in. multilayer molybdenum disulfide via space-confinement thermolysis

Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application

Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection

Warpage Prediction and Optimization for Embedded Silicon Fan-Out Wafer-Level Packaging Based on an Extended Theoretical Model

Comparison and mechanism of electromigration reliability between Cu wire and Au wire bonding in molding state

Development of reliable low temperature wafer level hermetic bonding using composite seal joint

Fast frequency upconversion imaging based on quasi-phase match

Quasi in-situ observation of Ni-plated solder from various fracture mechanism using EBSD

Electrical performance characterization of glass substrate for millimeter-wave applications

The development of effective model for thermal conduction analysis for 2.5D packaging using TSV interposer

A Low-Loss Bandpass Filter with Stacked Double-Layer Structure using Glass-based Integrated Passive Device Technology

Experimental and Numerical Investigations of the Warpage of Fan-Out Wafer-Level Packaging With SAW Filters

Properties and electric characterizations of tetraethyl orthosilicate-based plasma enhanced chemical vapor deposition oxide film deposited at 400°C for through silicon via application

33.5 A 1.25W 46.5%-Peak-Efficiency Transformer-in-Package Isolated DC-DC Converter Using Glass-Based Fan-Out Wafer-Level Packaging Achieving 50mW/mm2 Power Density

Synthesized Improvement of Die Fly and Die Shift Concerning the Wafer Molding Process for Ultrafine SAW Filter FOWLP

Meta-Biosensor With High Q-Factor Based on Wet Etching for Terahertz Detection

Development of Compact Millimeter-Wave Antenna by Stacking of Five Glass Wafers With Through Glass Vias

Design, analysis and test of high-frequency interconnections in 2.5D package with silicon interposer

Optimal design analysis for thermal performance of high power 2.5D package

Warpage Prediction and Optimization for Wafer Level Glass Interposer Packaging

Growth behavior and mechanism of atomic layer deposition of Ru for replacing Cu-interconnects

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