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2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2023, p.1-6
2023
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-6
2022
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2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.1177-1182
2021
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2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.484-490
2021
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2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2021, p.130-138
2021
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2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), 2022, p.1-6
2022
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020, p.229-235
2020
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2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020, p.776-782
2020
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.861-866
2020
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2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.19-23
2023
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2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.2072-2077
2020
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Stroke (1970), 2022-11, Vol.53 (11), p.3401-3409
2022
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Journal of infection and public health, 2024-02, Vol.17 (2), p.286-292
2024
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Chest, 2023-10, Vol.164 (4), p.A825-A826
2023
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Journal of clinical medicine, 2020-04, Vol.9 (4), p.1213
2020
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2022 International EOS/ESD Symposium on Design and System (IEDS), 2022, p.1-4
2022
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Thema
- Science & Technology
- Engineering
- Engineering, Electrical & Electronic
- Technology
- Thermal Resistance
- Electronic Packaging Thermal Management
- Engineering, Mechanical
- Physical Sciences
- Thermodynamics
- Thermomechanical Processes
- Package On Package
- Temperature Sensor
- Temperature Sensors
- Central Processing Unit
- Electronic Systems
- Life Sciences & Biomedicine
- System On Chip
- Thermal Sensor
- Application Processor
- Computational Fluid Dynamics
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