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Anisotropic response of Ti-6Al-4V alloy fabricated by 3D printing selective laser melting

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2017-01, Vol.682, p.389-395

2017

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Microstructure and mechanical properties of open-cell porous Ti-6Al-4V fabricated by selective laser melting

Journal of alloys and compounds, 2017-08, Vol.713, p.248-254

2017

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Full intermetallic joints for chip stacking by using thermal gradient bonding

Acta materialia, 2016-07, Vol.113, p.90-97

2016

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Genome-wide association study for high-temperature tolerance in the Japanese flounder

Animal (Cambridge, England), 2024-09, Vol.18 (9), p.101273, Article 101273

2024

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CIRBP protects H9C2 cells against myocardial ischemia through inhibition of NF-κB pathway

Brazilian journal of medical and biological research, 2017-03, Vol.50 (4), p.e5861-e5861

2017

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The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction

Scripta materialia, 2011-08, Vol.65 (4), p.331-334

2011

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Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections

Materials letters, 2013-11, Vol.110, p.13-15

2013

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Preparation of transparent conducting ZnO:Al films on polymer substrates by r. f. magnetron sputtering

Applied surface science, 2000-05, Vol.158 (1), p.43-48

2000

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Eutectic-reaction brazing of Al0.3CoCrFeNi high-entropy alloys using Ni/Nb/Ni interlayers

Journal of materials science & technology, 2022-09, Vol.121, p.245-255

2022

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Vacuum diffusion bonding of high-entropy Al0.85CoCrFeNi alloy to TiAl intermetallic

Journal of materials processing technology, 2020-04, Vol.278, p.116455, Article 116455

2020

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Low temperature bonding for high temperature applications by using SnBi solders

Journal of alloys and compounds, 2015-10, Vol.647, p.681-685

2015

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Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing

Scripta materialia, 2014-06, Vol.80, p.37-40

2014

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ROLE OF CIRCULATING MIR-497 IN ACUTE MYOCARDIAL INFARCTION PATIENTS AND HYPOXIA/REOXYGENATION H9C2 CELLS

Journal of the American College of Cardiology, 2019-03, Vol.73 (9), p.259-259

2019

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Investigation on the microstructure and mechanical properties of CoCrFeNi high-entropy alloy joint bonded with BNi2 interlayer

Journal of materials processing technology, 2021-08, Vol.294, p.117144, Article 117144

2021

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In-situ eutectic-reaction bonding of Al0·3CoCrFeNi high-entropy alloys using pure niobium

Materials science & engineering. A, Structural materials : properties, microstructure and processing, 2022-02, Vol.835, p.142674, Article 142674

2022

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Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigration

Journal of alloys and compounds, 2015-04, Vol.627, p.281-286

2015

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Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications

Journal of alloys and compounds, 2018-06, Vol.750, p.570-576

2018

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Ab initio study of stability and migration of point defects in copper-graphene layered composite

Journal of alloys and compounds, 2017-01, Vol.692, p.49-58

2017

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Growth kinetics of Ag3Sn in silicon solar cells with a sintered Ag metallization layer

Solar energy materials and solar cells, 2014-04, Vol.123, p.139-143

2014

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Salispheres from Different Major Salivary Glands for Glandular Regeneration

Journal of dental research, 2019-07, Vol.98 (7), p.786-794

2019

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Effects of silver addition on Cu–Sn microjoints for chip-stacking applications

Journal of alloys and compounds, 2014-08, Vol.605, p.193-198

2014

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Endwall heat transfer and pressure drop in rectangular channels with attached and detached circular pin-fin array

International journal of heat and mass transfer, 2008-10, Vol.51 (21), p.5247-5259

2008

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Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing

Acta materialia, 2011-04, Vol.59 (6), p.2462-2468

2011

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Flow patterns and wall stresses in a moving granular filter bed with an asymmetric louvered-wall and obstacles

Chemical engineering and processing, 2006-02, Vol.45 (2), p.79-89

2006

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Study on optical films with AgNWs using UV laser patterning

Optical materials, 2018-03, Vol.77, p.55-66

2018

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Anisotropic response of Ti-6Al-4V alloy fabricated by 3D printing selective laser melting

Microstructure and mechanical properties of open-cell porous Ti-6Al-4V fabricated by selective laser melting

Full intermetallic joints for chip stacking by using thermal gradient bonding

Genome-wide association study for high-temperature tolerance in the Japanese flounder

CIRBP protects H9C2 cells against myocardial ischemia through inhibition of NF-κB pathway

The orientation relationship between Ni and Cu6Sn5 formed during the soldering reaction

Gold and palladium embrittlement issues in three-dimensional integrated circuit interconnections

Preparation of transparent conducting ZnO:Al films on polymer substrates by r. f. magnetron sputtering

Eutectic-reaction brazing of Al0.3CoCrFeNi high-entropy alloys using Ni/Nb/Ni interlayers

Vacuum diffusion bonding of high-entropy Al0.85CoCrFeNi alloy to TiAl intermetallic

Low temperature bonding for high temperature applications by using SnBi solders

Effects of Sn grain orientation on substrate dissolution and intermetallic precipitation in solder joints under electron current stressing

ROLE OF CIRCULATING MIR-497 IN ACUTE MYOCARDIAL INFARCTION PATIENTS AND HYPOXIA/REOXYGENATION H9C2 CELLS

Investigation on the microstructure and mechanical properties of CoCrFeNi high-entropy alloy joint bonded with BNi2 interlayer

In-situ eutectic-reaction bonding of Al0·3CoCrFeNi high-entropy alloys using pure niobium

Dominant effects of Sn orientation on serrated cathode dissolution and resulting failure in actual solder joints under electromigration

Pronounced effects of Zn additions on Cu-Sn microjoints for chip-stacking applications

Ab initio study of stability and migration of point defects in copper-graphene layered composite

Growth kinetics of Ag3Sn in silicon solar cells with a sintered Ag metallization layer

Salispheres from Different Major Salivary Glands for Glandular Regeneration

Effects of silver addition on Cu–Sn microjoints for chip-stacking applications

Endwall heat transfer and pressure drop in rectangular channels with attached and detached circular pin-fin array

Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing

Flow patterns and wall stresses in a moving granular filter bed with an asymmetric louvered-wall and obstacles

Study on optical films with AgNWs using UV laser patterning

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