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Low-Pressure Wafer-Level-Packaged Capacitive Accelerometers With High Dynamic Range and Wide Bandwidth Using Nano-Gap Sloped Electrode Design

Journal of microelectromechanical systems, 2017-12, Vol.26 (6), p.1335-1344

2017

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Precision wearable accelerometer contact microphones for longitudinal monitoring of mechano-acoustic cardiopulmonary signals

NPJ digital medicine, 2020-02, Vol.3 (1), p.19-19, Article 19

2020

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Process compensated CMOS temperature sensor for microprocessor application

2012 IEEE International Symposium on Circuits and Systems (ISCAS), 2012, p.3118-3121

2012

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IEEE transactions on microwave theory and techniques, 2014-07, Vol.62 (7), p.1567

2014

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IEEE transactions on microwave theory and techniques, 2014-07, Vol.62 (7), p.1567-1568

2014

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IEEE transactions on microwave theory and techniques, 2014-07, Vol.62 (7), p.1567-1568

2014

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A dual-axis single-proof-mass angular accelerometer for a vestibular prosthesis

2016 38th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), 2016, Vol.2016, p.4695-4698

2016

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Shock-protection of nano-gap capacitive MEMS accelerometers using sloped electrode design

2017 IEEE 30th International Conference on Micro Electro Mechanical Systems (MEMS), 2017, p.1150-1153

2017

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Precision wearable accelerometer contact microphones for longitudinal monitoring of mechano-acoustic cardiopulmonary signals

NPJ digital medicine, 2020-02, Vol.3 (1), p.19

2020

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High-Q Timing and Inertial Measurement Unit Chip (TIMU) with 3D Wafer-Level Packaging

2019 IEEE Custom Integrated Circuits Conference (CICC), 2019, p.1-8

2019

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Wafer-level-packaged HARPSS+ MEMS platform: Integration of robust timing and inertial measurement units (TIMU) on a single chip

2018 IEEE/ION Position, Location and Navigation Symposium (PLANS), 2018, p.261-266

2018

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0.25 deg/h Closed-Loop Bulk Acoustic Wave Gyroscope

2022 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL), 2022, p.1-4

2022

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A high-performance single-chip timing and inertial measurement unit with robust mode-matched gyroscopes

2018 IEEE Micro Electro Mechanical Systems (MEMS), 2018, p.105-108

2018

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Low-Pressure Wafer-Level-Packaged Capacitive Accelerometers With High Dynamic Range and Wide Bandwidth Using Nano-Gap Sloped Electrode Design

Precision wearable accelerometer contact microphones for longitudinal monitoring of mechano-acoustic cardiopulmonary signals

Process compensated CMOS temperature sensor for microprocessor application

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A dual-axis single-proof-mass angular accelerometer for a vestibular prosthesis

Shock-protection of nano-gap capacitive MEMS accelerometers using sloped electrode design

Precision wearable accelerometer contact microphones for longitudinal monitoring of mechano-acoustic cardiopulmonary signals

High-Q Timing and Inertial Measurement Unit Chip (TIMU) with 3D Wafer-Level Packaging

Wafer-level-packaged HARPSS+ MEMS platform: Integration of robust timing and inertial measurement units (TIMU) on a single chip

0.25 deg/h Closed-Loop Bulk Acoustic Wave Gyroscope

A high-performance single-chip timing and inertial measurement unit with robust mode-matched gyroscopes

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