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Enhanced thermal conductivity of boron nitride epoxy-matrix composite through multi-modal particle size mixing

Journal of applied polymer science, 2007-12, Vol.106 (6), p.3587-3591

2007

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Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing

Journal of alloys and compounds, 2014-05, Vol.595, p.92-102

2014

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Preparation and properties of hollow glass microsphere-filled epoxy-matrix composites

Composites science and technology, 2009-02, Vol.69 (2), p.260-264

2009

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Development of the Asia Pacific Consortium on Osteoporosis (APCO) Framework: clinical standards of care for the screening, diagnosis, and management of osteoporosis in the Asia-Pacific region

Osteoporosis international, 2021-07, Vol.32 (7), p.1249-1275

2021

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Effect of graphene doping on microstructural and mechanical properties of Sn–8Zn–3Bi solder joints together with electromigration analysis

Journal of alloys and compounds, 2013-12, Vol.580, p.162-171

2013

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Study on the properties of the epoxy-matrix composites filled with thermally conductive AlN and BN ceramic particles

Journal of applied polymer science, 2010-12, Vol.118 (5), p.2754-2764

2010

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Review of life cycle assessment on consumer electronic products: Developments and the way ahead

Critical reviews in environmental science and technology, 2016-09, Vol.46 (18), p.1441-1497

2016

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Analysis of Manufacturing-Induced Defects and Structural Deformations in Lithium-Ion Batteries Using Computed Tomography

Energies (Basel), 2018-04, Vol.11 (4), p.925

2018

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Enhanced redshift of the optical band gap in Sn-doped ZnO free standing films using the sol–gel method

Journal of physics. D, Applied physics, 2009-09, Vol.42 (18), p.185002-185002 (5)

2009

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Thermal investigation of a high brightness LED array package assembly for various placement algorithms

Applied thermal engineering, 2014-02, Vol.63 (1), p.105-118

2014

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A Three-Dimensional Evaluation of Skeletal and Dentoalveolar Changes in Growing Class II Patients after Functional Appliance Therapy: A Retrospective Case-Control Study

Journal of clinical medicine, 2024-02, Vol.13 (5), p.1315

2024

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Thermal performance of high brightness LED array package on PCB

International communications in heat and mass transfer, 2010-11, Vol.37 (9), p.1266-1272

2010

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Introduction to graphene electronics - a new era of digital transistors and devices

Contemporary physics, 2013-09, Vol.54 (5), p.233-251

2013

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Effect of the filler size and content on the thermomechanical properties of particulate aluminum nitride filled epoxy composites

Journal of applied polymer science, 2010-04, Vol.116 (1), p.225-236

2010

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Effect of AlN content on the performance of brominated epoxy resin for printed circuit board substrate

Journal of polymer science. Part B, Polymer physics, 2007-07, Vol.45 (13), p.1662-1674

2007

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Development of epoxy-matrix composite with both high-thermal conductivity and low-dielectric constant via hybrid filler systems

Journal of applied polymer science, 2010-04, Vol.116 (1), p.518-527

2010

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Study of microstructure evolution in novel Sn–Zn/Cu bi-layer and Cu/Sn–Zn/Cu sandwich structures with nanoscale thickness for 3D packaging interconnection

Microelectronic engineering, 2014-06, Vol.122, p.52-58

2014

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Laser polishing of additive manufactured tool steel components using pulsed or continuous-wave lasers

International journal of advanced manufacturing technology, 2019-11, Vol.105 (1-4), p.425-440

2019

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A finite element model and experimental analysis of PTH reliability in rigid-flex printed circuits using the Taguchi method

International journal of fatigue, 2012-07, Vol.40, p.84-96

2012

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Fabrication and adhesion performance of gold conductive patterns on silicon substrate by laser sintering

Applied surface science, 2011-10, Vol.258 (1), p.478-481

2011

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Synthesis of submicron sized silver powder for metal deposition via laser sintered inkjet printing

Journal of materials science, 2009, Vol.44 (1), p.154-159

2009

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Prerequisite for maximizing thermal conductivity of epoxy laminate using filler

Journal of materials science. Materials in electronics, 2013-04, Vol.24 (4), p.1095-1104

2013

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Rectified Ocean Heat Uptake from Oscillatory Surface Forcing

Journal of climate, 2023-04, Vol.36 (8), p.2663-2680

2023

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Selective laser processing of ink-jet printed nano-scaled tin-clad copper particles

Applied physics. A, Materials science & processing, 2010-11, Vol.101 (2), p.393-397

2010

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Laser polishing of additive manufactured CoCr components for controlling their wettability characteristics

Surface & coatings technology, 2018-10, Vol.351, p.89-98

2018

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Enhanced thermal conductivity of boron nitride epoxy-matrix composite through multi-modal particle size mixing

Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3.5Ag0.5Cu solder joint under current stressing

Preparation and properties of hollow glass microsphere-filled epoxy-matrix composites

Development of the Asia Pacific Consortium on Osteoporosis (APCO) Framework: clinical standards of care for the screening, diagnosis, and management of osteoporosis in the Asia-Pacific region

Effect of graphene doping on microstructural and mechanical properties of Sn–8Zn–3Bi solder joints together with electromigration analysis

Study on the properties of the epoxy-matrix composites filled with thermally conductive AlN and BN ceramic particles

Review of life cycle assessment on consumer electronic products: Developments and the way ahead

Analysis of Manufacturing-Induced Defects and Structural Deformations in Lithium-Ion Batteries Using Computed Tomography

Enhanced redshift of the optical band gap in Sn-doped ZnO free standing films using the sol–gel method

Thermal investigation of a high brightness LED array package assembly for various placement algorithms

A Three-Dimensional Evaluation of Skeletal and Dentoalveolar Changes in Growing Class II Patients after Functional Appliance Therapy: A Retrospective Case-Control Study

Thermal performance of high brightness LED array package on PCB

Introduction to graphene electronics - a new era of digital transistors and devices

Effect of the filler size and content on the thermomechanical properties of particulate aluminum nitride filled epoxy composites

Effect of AlN content on the performance of brominated epoxy resin for printed circuit board substrate

Development of epoxy-matrix composite with both high-thermal conductivity and low-dielectric constant via hybrid filler systems

Study of microstructure evolution in novel Sn–Zn/Cu bi-layer and Cu/Sn–Zn/Cu sandwich structures with nanoscale thickness for 3D packaging interconnection

Laser polishing of additive manufactured tool steel components using pulsed or continuous-wave lasers

A finite element model and experimental analysis of PTH reliability in rigid-flex printed circuits using the Taguchi method

Fabrication and adhesion performance of gold conductive patterns on silicon substrate by laser sintering

Synthesis of submicron sized silver powder for metal deposition via laser sintered inkjet printing

Prerequisite for maximizing thermal conductivity of epoxy laminate using filler

Rectified Ocean Heat Uptake from Oscillatory Surface Forcing

Selective laser processing of ink-jet printed nano-scaled tin-clad copper particles

Laser polishing of additive manufactured CoCr components for controlling their wettability characteristics

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