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Distribution of Heat Transfer Coefficients of an Impinging Two Dimensional Free Jet on an Oblique Flat Surface

Transactions of the Japan Society of Mechanical Engineers Series B, 2000/10/25, Vol.66(650), pp.2669-2674

2000

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A calculation method for temperature distribution of IC packages on a printed wiring board. (3rd Report, Temperature distribution of IC packages)

Nihon Kikai Gakkai rombunshuu. B hen, 1989, Vol.55 (518), p.3172-3177

YANAGIDA, Takehiko

1989

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A calculation method for temperature distribution of IC packages on a printed wiring board. (2nd Report, Heat transfer coefficients of IC packages)

Nihon Kikai Gakkai rombunshuu. B hen, 1989, Vol.55 (513), p.1432-1437

YANAGIDA, Takehiko

1989

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Thermal Characteristics of Si Mask for EB Cell Projection Lithography

JPN J APPL PHYS PART 1 REGUL PAP SHORT NOTE, 1992-12, Vol.31 (12S), p.4268-4272

1992

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A calculating method for temperature distribution of IC packages on a printed wiring board. (1st report. Temperature distribution in the thermal wake of an IC package)

Nihon Kikai Gakkai rombunshuu. B hen, 1988, Vol.54 (503), p.1730-1735

YANAGIDA, Takehiko

1988

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Pressure Drop and Heat Transfer Characteristics of Axial Air Flow through an Annulus with a Deep-Slotted Outer Cylinder and a Rotating Inner Cylinder : 2nd Report, Heat Transfer Characteristics

Transactions of the Japan Society of Mechanical Engineers Series B, 1991/06/25, Vol.57(538), pp.2099-2103

1991

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Heat Transfer from Finned LSI Packages in a Channel between Circuit Boards

Transactions of the Japan Society of Mechanical Engineers Series B, 1991/05/25, Vol.57(537), pp.1808-1812

1991

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Heat Transfer Characteristics of Fluid Flow in an Annulus with an Inner Rotating Cylinder having a Labyrinth Structure

Transactions of the Japan Society of Mechanical Engineers Series B, 1996/06/25, Vol.62(598), pp.2376-2383

1996

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Pressure Drop Characteristics of Circuit Board with Arrays of LSI Packages

Transactions of the Japan Society of Mechanical Engineers Series B, 1993/04/25, Vol.59(560), pp.1244-1251

1993

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Algorithm for Prediction of the Thermal Resistance of Finned LSI Packages Mounted on a Circuit Board

Transactions of the Japan Society of Mechanical Engineers Series B, 1992/02/25, Vol.58(546), pp.548-553

1992

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Thermal Analysis by the Finite-Element Method Considering the Temperature Change of a Fluid along a Path

Transactions of the Japan Society of Mechanical Engineers Series B, 1990/09/25, Vol.56(529), pp.2712-2716

1990

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A Calculation Method for Temperature Distribution of IC Packages on a Printed Wiring Board : 3rd Report, Temperature Distribution of IC Packages

Transactions of the Japan Society of Mechanical Engineers Series B, 1989/10/25, Vol.55(518), pp.3172-3177

YANAGIDA, Takehiko

1989

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A Calculation Method for Temperature Distribution of IC Packages on a Printed Wiring Board : 2nd Report, Heat Transfer Coefficients of IC Packages

Transactions of the Japan Society of Mechanical Engineers Series B, 1989/05/25, Vol.55(513), pp.1432-1437

YANAGIDA, Takehiko

1989

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A Calculating Method for Temperature Distribution of IC Packages on a Printed Wiring Board : 1st Report, Temperature Distribution in the Thermal Wake of an IC Package

Transactions of the Japan Society of Mechanical Engineers Series B, 1988/07/25, Vol.54(503), pp.1730-1735

YANAGIDA, Takehiko

1988

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Enhanced heat transfer tubes for the evaporator of refrigrating machines. (3rd report. Evaporative heat transfer from horizontal tubes in thin film flow)

Nihon Kikai Gakkai rombunshuu. B hen, 1987, Vol.53 (494), p.3088-3092

1987

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406 Thermal Contact Resistance between Sliding Plates

The Proceedings of Yamanashi District Conference, 2004-10, Vol.2004, p.101-102

2004

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Shell-Side Single-Phase Flows and Heat Transfer in Shell-and-Tube Heat Exchangers : 4th Report, Critical Design Conditions of Steam Generators Heated by High Temperature Helium

Transactions of the Japan Society of Mechanical Engineers Series B, 1987/11/25, Vol.53(495), pp.3403-3408

1987

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Enhanced heat transfer tubes for the evaporator of refrigerating machines. (2nd report. Optimized Combination of shell side and tube-side enhancements)

Nihon Kikai Gakkai rombunshuu. B hen, 1987, Vol.53 (494), p.3082-3087

1987

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Shell-Side Single-Phase Flows and Heat Transfer in Shell-and-Tube Heat Exchangers : 3rd Report. Experimental Study on Axial and Circumferential Distribution of Local Heat Transfer Coefficients around a Tube Bundle

Transactions of the Japan Society of Mechanical Engineers Series B, 1987/04/25, Vol.53(488), pp.1344-1350

1987

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Shell-side single-phase flows and heat transfer in shell-and-tube heat exchangers (2nd report, Effects of inlet nozzle diameter on flow patterns and local heat transfer coefficients)

Nihon Kikai Gakkai rombunshuu. B hen, 1985, Vol.51 (466), p.2000-2005

1985

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Pressure Drop and Heat Transfer Characteristics of Axial Air Flow through an Annulus with a Deep-Slotted Outer Cylinder and a Rotating Inner Cylinder. 2nd Report. Heat Transfer Characteristics

Nihon Kikai Gakkai rombunshuu. B hen, 1991, Vol.57 (538), p.2099-2103

1991

Volltextzugriff (PDF)

Heat Transfer from finned LSI Packages in a Channel between Circuit Boards

Nihon Kikai Gakkai rombunshuu. B hen, 1991, Vol.57 (537), p.1808-1812

1991

Volltextzugriff (PDF)

Pressure Drop and Heat Transfer Characteristics of Axial Air Flow Through an Annulus with a Deep-Slotted Outer Cylinder and a Rotating Inner Cylinder : 1st Report, Pressure Drop Characteristics

Transactions of the Japan Society of Mechanical Engineers Series B, 1987/09/25, Vol.53(493), pp.2714-2719

1987

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Pressure drop and heat transfer characteristics of axial air flow through an annulus with a deep-slotted outer cylidder and a rotating inner cylinder. 1st Report. Pressure drop characteristics

Nihon Kikai Gakkai rombunshuu. B hen, 1987, Vol.53 (493), p.2714-2719

1987

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Pressure Drop Characteristics of Circuit Board with Arrays of LSI Packages

Nihon Kikai Gakkai rombunshuu. B hen, 1993-01, Vol.59 (560), p.1244-1251

1993

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Distribution of Heat Transfer Coefficients of an Impinging Two Dimensional Free Jet on an Oblique Flat Surface

A calculation method for temperature distribution of IC packages on a printed wiring board. (3rd Report, Temperature distribution of IC packages)

A calculation method for temperature distribution of IC packages on a printed wiring board. (2nd Report, Heat transfer coefficients of IC packages)

Thermal Characteristics of Si Mask for EB Cell Projection Lithography

A calculating method for temperature distribution of IC packages on a printed wiring board. (1st report. Temperature distribution in the thermal wake of an IC package)

Pressure Drop and Heat Transfer Characteristics of Axial Air Flow through an Annulus with a Deep-Slotted Outer Cylinder and a Rotating Inner Cylinder : 2nd Report, Heat Transfer Characteristics

Heat Transfer from Finned LSI Packages in a Channel between Circuit Boards

Heat Transfer Characteristics of Fluid Flow in an Annulus with an Inner Rotating Cylinder having a Labyrinth Structure

Pressure Drop Characteristics of Circuit Board with Arrays of LSI Packages

Algorithm for Prediction of the Thermal Resistance of Finned LSI Packages Mounted on a Circuit Board

Thermal Analysis by the Finite-Element Method Considering the Temperature Change of a Fluid along a Path

A Calculation Method for Temperature Distribution of IC Packages on a Printed Wiring Board : 3rd Report, Temperature Distribution of IC Packages

A Calculation Method for Temperature Distribution of IC Packages on a Printed Wiring Board : 2nd Report, Heat Transfer Coefficients of IC Packages

A Calculating Method for Temperature Distribution of IC Packages on a Printed Wiring Board : 1st Report, Temperature Distribution in the Thermal Wake of an IC Package

Enhanced heat transfer tubes for the evaporator of refrigrating machines. (3rd report. Evaporative heat transfer from horizontal tubes in thin film flow)

406 Thermal Contact Resistance between Sliding Plates

Shell-Side Single-Phase Flows and Heat Transfer in Shell-and-Tube Heat Exchangers : 4th Report, Critical Design Conditions of Steam Generators Heated by High Temperature Helium

Enhanced heat transfer tubes for the evaporator of refrigerating machines. (2nd report. Optimized Combination of shell side and tube-side enhancements)

Shell-Side Single-Phase Flows and Heat Transfer in Shell-and-Tube Heat Exchangers : 3rd Report. Experimental Study on Axial and Circumferential Distribution of Local Heat Transfer Coefficients around a Tube Bundle

Shell-side single-phase flows and heat transfer in shell-and-tube heat exchangers (2nd report, Effects of inlet nozzle diameter on flow patterns and local heat transfer coefficients)

Pressure Drop and Heat Transfer Characteristics of Axial Air Flow through an Annulus with a Deep-Slotted Outer Cylinder and a Rotating Inner Cylinder. 2nd Report. Heat Transfer Characteristics

Heat Transfer from finned LSI Packages in a Channel between Circuit Boards

Pressure Drop and Heat Transfer Characteristics of Axial Air Flow Through an Annulus with a Deep-Slotted Outer Cylinder and a Rotating Inner Cylinder : 1st Report, Pressure Drop Characteristics

Pressure drop and heat transfer characteristics of axial air flow through an annulus with a deep-slotted outer cylidder and a rotating inner cylinder. 1st Report. Pressure drop characteristics

Pressure Drop Characteristics of Circuit Board with Arrays of LSI Packages

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