UB Paderborn / Katalog / Suche / in CDI

Experimental Study of Freeze-thaw Cycles Placement in Heat Pump Drying of Tilapia Fillets

Chemical engineering transactions, 2016-12, Vol.55

2016

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RESPONSES OF PHOTOSYNTHESIS, CHLOROPLAST ULTRASTRUCTURE, AND ANTIOXIDANT SYSTEM OF MORINDA OFFICINALIS HOW. TO EXOGENOUS 2, 4-EPIBRASSINOLIDE TREATMENTS UNDER HIGH TEMPERATURE STRESS

Applied ecology and environmental research, 2020, Vol.18 (3), p.3981-4004

2020

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PHYSIOLOGICAL AND PROTEOMIC RESPONSES OF DENDROCALAMUS MINOR VAR. AMOENUS (GHOST BAMBOO) UNDER DROUGHT STRESS

Applied ecology and environmental research, 2020, Vol.18 (4), p.4817-4838

2020

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A novel soldering method to evaluate PCB pad cratering for pin-pull testing

Microelectronics and reliability, 2013-09, Vol.53 (9-11), p.1568-1574

2013

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A new experimental method to evaluate creep fatigue life of flip-chip solder joints with underfill

Microelectronics and reliability, 2000-07, Vol.40 (7), p.1191-1198

Xie, D.J.

2000

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Process capability study and thermal fatigue life prediction of ceramic BGA solder joints

Finite elements in analysis and design, 1998-07, Vol.30 (1), p.31-45

1998

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Experimental studies of pore formation in surface mount solder joints

Materials science & engineering. B, Solid-state materials for advanced technology, 1996-03, Vol.38 (1-2), p.53-61

1996

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MANUFACTURING OF ALUMINUM/FLY ASH COMPOSITE WITH LIQUID REACTIVE SINTERING TECHNOLOGY

Acta metallurgica sinica : English letters, 2002-10, Vol.15 (5), p.465-470

2002

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Total phosphorus concentrations in surface water of typical agro- and forest ecosystems in China, 2004-2010

Frontiers of environmental science & engineering, 2014-08, Vol.8 (4), p.561-569

2014

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A simple and reproducible method towards fabricating defect-free and reliable solder joints

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future', 1995, p.366-371

1995

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Electrical and thermal modelling of QFN packages

Proceedings of 3rd Electronics Packaging Technology Conference (EPTC 2000) (Cat. No.00EX456), 2000, p.352-356

2000

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Fatigue life estimation of surface mount solder joints

IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 1996-08, Vol.19 (3), p.669-678

1996

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An experimental approach to pore-free reflow soldering

IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 1996-02, Vol.19 (1), p.148-153

1996

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Effect of thermal ageing and thermal cycling on the reliability of solder joints of TAB outer lead bonds

Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307), 1997, p.86-92

1997

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Fatigue life studies on defect-free solder joints fabricated from modified reflow soldering

IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 1996-08, Vol.19 (3), p.679-684

1996

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Application of direct strain measurement to fatigue studies in surface solder joints

IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, 1995-11, Vol.18 (4), p.715-719

1995

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Porosity formation and its effects on mechanical properties of SMT solder joints

1994 Proceedings. 44th Electronic Components and Technology Conference, 1994, p.590-594

1994

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(Fe, Ni)/C nanocapsules for electromagnetic-wave-absorber in the whole Ku-band

Carbon (New York), 2009-02, Vol.47 (2), p.470-474

2009

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Rapid microbial methanogenesis during CO.sub.2 storage in hydrocarbon reservoirs

Nature (London), 2021-12, Vol.600 (7890), p.670

2021

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Effects of anodization parameters on the formation of titania nanotubes in ethylene glycol

Electrochimica acta, 2010-12, Vol.56 (2), p.905-912

2010

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Influence of flotation cell hydrodynamics on the flotation kinetics and scale up, Part 1: Hydrodynamic parameter measurements and ore property determination

Minerals engineering, 2016-12, Vol.99, p.40-51

2016

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A recurrent de novo splice site variant involving DNM1 exon 10a causes developmental and epileptic encephalopathy through a dominant-negative mechanism

American journal of human genetics, 2022-12, Vol.109 (12), p.2253-2269

2022

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Effect of humification during hydrothermal treatment of Aquatic Wastes with inorganic acid

E3S Web of Conferences, 2022, Vol.341, p.1012

2022

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Influence of flotation cell hydrodynamics on the flotation kinetics and scale up, Part 2: Introducing turbulence parameters to improve predictions

Minerals engineering, 2017-01, Vol.100, p.31-39

2017

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Genetic Diversity of SARS-CoV-2 among Travelers Arriving in Hong Kong

Emerging infectious diseases, 2021-10, Vol.27 (10), p.2666-2668

2021

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Experimental Study of Freeze-thaw Cycles Placement in Heat Pump Drying of Tilapia Fillets

RESPONSES OF PHOTOSYNTHESIS, CHLOROPLAST ULTRASTRUCTURE, AND ANTIOXIDANT SYSTEM OF MORINDA OFFICINALIS HOW. TO EXOGENOUS 2, 4-EPIBRASSINOLIDE TREATMENTS UNDER HIGH TEMPERATURE STRESS

PHYSIOLOGICAL AND PROTEOMIC RESPONSES OF DENDROCALAMUS MINOR VAR. AMOENUS (GHOST BAMBOO) UNDER DROUGHT STRESS

A novel soldering method to evaluate PCB pad cratering for pin-pull testing

A new experimental method to evaluate creep fatigue life of flip-chip solder joints with underfill

Process capability study and thermal fatigue life prediction of ceramic BGA solder joints

Experimental studies of pore formation in surface mount solder joints

MANUFACTURING OF ALUMINUM/FLY ASH COMPOSITE WITH LIQUID REACTIVE SINTERING TECHNOLOGY

Total phosphorus concentrations in surface water of typical agro- and forest ecosystems in China, 2004-2010

A simple and reproducible method towards fabricating defect-free and reliable solder joints

Electrical and thermal modelling of QFN packages

Fatigue life estimation of surface mount solder joints

An experimental approach to pore-free reflow soldering

Effect of thermal ageing and thermal cycling on the reliability of solder joints of TAB outer lead bonds

Fatigue life studies on defect-free solder joints fabricated from modified reflow soldering

Application of direct strain measurement to fatigue studies in surface solder joints

Porosity formation and its effects on mechanical properties of SMT solder joints

(Fe, Ni)/C nanocapsules for electromagnetic-wave-absorber in the whole Ku-band

Rapid microbial methanogenesis during CO.sub.2 storage in hydrocarbon reservoirs

Effects of anodization parameters on the formation of titania nanotubes in ethylene glycol

Influence of flotation cell hydrodynamics on the flotation kinetics and scale up, Part 1: Hydrodynamic parameter measurements and ore property determination

A recurrent de novo splice site variant involving DNM1 exon 10a causes developmental and epileptic encephalopathy through a dominant-negative mechanism

Effect of humification during hydrothermal treatment of Aquatic Wastes with inorganic acid

Influence of flotation cell hydrodynamics on the flotation kinetics and scale up, Part 2: Introducing turbulence parameters to improve predictions

Genetic Diversity of SARS-CoV-2 among Travelers Arriving in Hong Kong

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