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C5L2: a controversial receptor of complement anaphylatoxin, C5a

The FASEB journal, 2013-03, Vol.27 (3), p.855-864

2013

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Label-free sensing of exosomal MCT1 and CD147 for tracking metabolic reprogramming and malignant progression in glioma

Science advances, 2020-06, Vol.6 (26), p.eaaz6119-eaaz6119

2020

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Synthesis of Hierarchical Porous ZnO Disklike Nanostructures for Improved Photovoltaic Properties of Dye-Sensitized Solar Cells

Journal of physical chemistry. C, 2010-08, Vol.114 (31), p.13157-13161

2010

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The wettability and microstructure of Sn-Zn-RE alloys

Journal of electronic materials, 2003-02, Vol.32 (2), p.63-69

2003

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Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys

Journal of electronic materials, 2002-09, Vol.31 (9), p.928-932

2002

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Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys

Journal of electronic materials, 2006-01, Vol.35 (1), p.89-93

2006

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Creep behavior of eutectic Sn–Ag lead-free solder alloy

Journal of materials research, 2002-11, Vol.17 (11), p.2897-2903

2002

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N–P transition sensing behaviors of ZnO nanotubes exposed to NO2 gas

Nanotechnology, 2009-11, Vol.20 (46), p.465501-465501

2009

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Rare-earth additions to lead-free electronic solders: Lead-free electronic solders

Journal of materials science. Materials in electronics, 2007-03, Vol.18 (1-3), p.77-91

2007

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Valproic acid selectively increases vascular endothelial tissue‐type plasminogen activator production and reduces thrombus formation in the mouse

Journal of thrombosis and haemostasis, 2016-12, Vol.14 (12), p.2496-2508

2016

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The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements

Journal of electronic materials, 2002-09, Vol.31 (9), p.921-927

2002

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Creep resistance of tin-based lead-free solder alloys

Journal of electronic materials, 2005-11, Vol.34 (11), p.1373-1377

2005

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Properties of lead-free solder alloys with rare earth element additions

Materials science & engineering. R, Reports : a review journal, 2004-04, Vol.44 (1), p.1-44

2004

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AGCM simulations of intraseasonal variability associated with the Asian summer monsoon

Climate dynamics, 2003-11, Vol.21 (5-6), p.423-446

2003

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Microstructural evolution of oxides and semiconductor thin films

Progress in materials science, 2011-09, Vol.56 (7), p.901-1029

2011

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Tensile creep behavior of Sn–Ag–Cu–Ni multicomponent lead-free solder alloy

Journal of materials science. Materials in electronics, 2016-07, Vol.27 (7), p.6630-6636

2016

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Creep behavior of eutectic Sn-Cu lead-free solder alloy

Journal of electronic materials, 2002-05, Vol.31 (5), p.442-448

2002

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Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging

Journal of electronic materials, 2000-08, Vol.29 (8), p.1021-1026

2000

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The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during soldering

Journal of alloys and compounds, 2010-03, Vol.492 (1-2), p.433-438

2010

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Pulsed Laser Ablation for Tin Dioxide: Nucleation, Growth, and Microstructures

Critical reviews in solid state and materials sciences, 2008-07, Vol.33 (3-4), p.197-209

2008

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Advection from the North Atlantic as the forcing of winter greenhouse effect over Europe

Geophysical research letters, 2002-04, Vol.29 (8), p.133-1-133-4

2002

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High-Performance CdSe:In Nanowire Field-Effect Transistors Based on Top-Gate Configuration with High-κ Non-Oxide Dielectrics

Journal of physical chemistry. C, 2010-03, Vol.114 (10), p.4663-4668

2010

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Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method

Journal of alloys and compounds, 2005-04, Vol.392 (1), p.192-199

2005

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On the tearing fracture of polycarbonate films

Polymer testing, 2007-02, Vol.26 (1), p.102-107

2007

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Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder

Journal of materials science. Materials in electronics, 2010-10, Vol.21 (10), p.1046-1054

2010

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C5L2: a controversial receptor of complement anaphylatoxin, C5a

Label-free sensing of exosomal MCT1 and CD147 for tracking metabolic reprogramming and malignant progression in glioma

Synthesis of Hierarchical Porous ZnO Disklike Nanostructures for Improved Photovoltaic Properties of Dye-Sensitized Solar Cells

The wettability and microstructure of Sn-Zn-RE alloys

Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys

Microstructure, solderability, and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys

Creep behavior of eutectic Sn–Ag lead-free solder alloy

N–P transition sensing behaviors of ZnO nanotubes exposed to NO2 gas

Rare-earth additions to lead-free electronic solders: Lead-free electronic solders

Valproic acid selectively increases vascular endothelial tissue‐type plasminogen activator production and reduces thrombus formation in the mouse

The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements

Creep resistance of tin-based lead-free solder alloys

Properties of lead-free solder alloys with rare earth element additions

AGCM simulations of intraseasonal variability associated with the Asian summer monsoon

Microstructural evolution of oxides and semiconductor thin films

Tensile creep behavior of Sn–Ag–Cu–Ni multicomponent lead-free solder alloy

Creep behavior of eutectic Sn-Cu lead-free solder alloy

Microstructural evolution of a lead-free solder alloy Sn-Bi-Ag-Cu prepared by mechanical alloying during thermal shock and aging

The adsorption of Ag3Sn nano-particles on Cu-Sn intermetallic compounds of Sn-3Ag-0.5Cu/Cu during soldering

Pulsed Laser Ablation for Tin Dioxide: Nucleation, Growth, and Microstructures

Advection from the North Atlantic as the forcing of winter greenhouse effect over Europe

High-Performance CdSe:In Nanowire Field-Effect Transistors Based on Top-Gate Configuration with High-κ Non-Oxide Dielectrics

Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method

On the tearing fracture of polycarbonate films

Effect of Y2O3 particles on microstructure formation and shear properties of Sn-58Bi solder

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