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Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package

Journal of materials science. Materials in electronics, 2020-07, Vol.31 (13), p.10170-10176

2020

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Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package

Journal of materials science. Materials in electronics, 2020-05, Vol.31 (9), p.6835-6842

2020

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Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock

Journal of electronic materials, 2018-07, Vol.47 (7), p.4165-4169

2018

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The reliability of ultrasonic bonded Cu to Cu electrode for 3D TSV stacking

Journal of materials science. Materials in electronics, 2017-11, Vol.28 (21), p.16467-16475

2017

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Mechanical property of the epoxy-contained Sn–58Bi solder with OSP surface finish

Journal of alloys and compounds, 2014-12, Vol.615, p.S411-S417

2014

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Mechanical, electrical, and thermal reliability of Sn-58wt.%Bi solder joints with Ag-decorated MWCNT for LED package component during aging treatment

Composites. Part B, Engineering, 2020-02, Vol.182, p.107617, Article 107617

2020

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Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB

Journal of electronic materials, 2016-11, Vol.45 (11), p.5895-5903

2016

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Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Journal of electronic materials, 2016-07, Vol.45 (7), p.3651-3658

2016

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Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes

Journal of electronic materials, 2015-11, Vol.44 (11), p.4637-4645

2015

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Effects of Ag content on the reliability of LED package component with Sn–Bi–Ag solder

Journal of materials science. Materials in electronics, 2015-11, Vol.26 (11), p.8707-8713

2015

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Effects of Plasma Polymerized Acrylic Acid Film on the Adhesion of Ag Tracks Screen-Printed on Polyimide

The Journal of adhesion, 2012-04, Vol.88 (4-6), p.337-349

2012

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Effects of sintering conditions on microstructure and characteristics of screen-printed Ag thin film

Electronic Materials Letters, 2012, 8(3), , pp.309-314

2012

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Bonding Strength of the Sn-58Bi Jointed IC Card Component Bonded by Ultrasonic Energy

Nanoscience and nanotechnology letters, 2017-08, Vol.9 (8), p.1190-1194

2017

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Adhesion Characteristics of Silver Tracks Screen-Printed on Polyimide with an Environmental Reliability Test

Journal of nanoscience and nanotechnology, 2012-07, Vol.12 (7), p.5769-5773

2012

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Evaluation of the Long-Term Reliability of the Epoxy-Contained SAC305 Solder with Organic Solderability Preservative Surface Finish

Nanoscience and nanotechnology letters, 2017-08, Vol.9 (8), p.1202-1206

2017

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Wire Sweep Characterization in System-in-Package (SiP) Component with Au Wire Bonding During Epoxy Molding Compounds Molding Process

Nanoscience and nanotechnology letters, 2015-12, Vol.7 (12), p.994-998

2015

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Thermomechanical Properties of Fan-Out Wafer Level Package with Various Chip and Mold Thickness

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.2121-2126

2018

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Effects of Cu Opening Size on the Mechanical Properties of Epoxy-Contained Sn-58Bi Solder Joints

Journal of nanoscience and nanotechnology, 2019-10, Vol.19 (10), p.6437-6443

2019

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Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test

Journal of nanoscience and nanotechnology, 2018-09, Vol.18 (9), p.6316-6320

2018

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Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental Conditions

Journal of nanoscience and nanotechnology, 2018-09, Vol.18 (9), p.6162-6166

2018

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Effects of Temperature–Humidity Treatment on Bending Reliability of Epoxy Sn–58Bi Solder with Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finishes

Science of advanced materials, 2020-04, Vol.12 (4), p.564-570

2020

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Mechanical Reliability of Epoxy Sn–58wt.%Bi Composite Solder Under Temperature-Humidity Treatment with Organic Solderability Preservatives (OSP) Surface Finish

Science of advanced materials, 2020-04, Vol.12 (4), p.525-530

2020

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Atmospheric-Pressure Plasma Sintering of Silver Nanopaste Screen-Printed on PI

Supplemental Proceedings, 2012, p.1-1

2012

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Atmospheric-Pressure Plasma Sintering of Silver Nanopaste Screen-Printed on PI

AIP conference proceedings, 2012-03

2012

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Microstructures and Drop Impact Test of SAC305, Sn58%Bi and Epoxy Sn58%Bi Solder Joint on the OSP Surface Finished PCB Substrate

Journal of Welding and Joining, 2018-04, Vol.36 (2), p.14-20

2018

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Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package

Effect of epoxy mold compound and package dimensions on the thermomechanical properties of a fan-out package

Mechanical Reliability of the Epoxy Sn-58wt.%Bi Solder Joints with Different Surface Finishes Under Thermal Shock

The reliability of ultrasonic bonded Cu to Cu electrode for 3D TSV stacking

Mechanical property of the epoxy-contained Sn–58Bi solder with OSP surface finish

Mechanical, electrical, and thermal reliability of Sn-58wt.%Bi solder joints with Ag-decorated MWCNT for LED package component during aging treatment

Effects of Aging Treatment on Mechanical Properties of Sn-58Bi Epoxy Solder on ENEPIG-Surface-Finished PCB

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes

Effects of Ag content on the reliability of LED package component with Sn–Bi–Ag solder

Effects of Plasma Polymerized Acrylic Acid Film on the Adhesion of Ag Tracks Screen-Printed on Polyimide

Effects of sintering conditions on microstructure and characteristics of screen-printed Ag thin film

Bonding Strength of the Sn-58Bi Jointed IC Card Component Bonded by Ultrasonic Energy

Adhesion Characteristics of Silver Tracks Screen-Printed on Polyimide with an Environmental Reliability Test

Evaluation of the Long-Term Reliability of the Epoxy-Contained SAC305 Solder with Organic Solderability Preservative Surface Finish

Wire Sweep Characterization in System-in-Package (SiP) Component with Au Wire Bonding During Epoxy Molding Compounds Molding Process

Thermomechanical Properties of Fan-Out Wafer Level Package with Various Chip and Mold Thickness

Effects of Cu Opening Size on the Mechanical Properties of Epoxy-Contained Sn-58Bi Solder Joints

Effect of Epoxy on Mechanical Property of SAC305 Solder Joint with Various Surface Finishes Under 3-Point Bend Test

Mechanical Property of SAC305 Ball-Grid Array and Epoxy Sn-58Bi Solder Joints with 85 °C/85% Relative Humidity Environmental Conditions

Effects of Temperature–Humidity Treatment on Bending Reliability of Epoxy Sn–58Bi Solder with Electroless Nickel Immersion Gold (ENIG) and Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finishes

Mechanical Reliability of Epoxy Sn–58wt.%Bi Composite Solder Under Temperature-Humidity Treatment with Organic Solderability Preservatives (OSP) Surface Finish

Atmospheric-Pressure Plasma Sintering of Silver Nanopaste Screen-Printed on PI

Atmospheric-Pressure Plasma Sintering of Silver Nanopaste Screen-Printed on PI

Microstructures and Drop Impact Test of SAC305, Sn58%Bi and Epoxy Sn58%Bi Solder Joint on the OSP Surface Finished PCB Substrate

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