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Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations

Journal of electronic materials, 2009, Vol.38 (1), p.78-87

2009

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Modulating Cell Adhesion Dynamics on Carbon Nanotube Monolayer Engineered with Extracellular Matrix Proteins

ACS applied materials & interfaces, 2010-04, Vol.2 (4), p.1038-1047

2010

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Templated self-assembly of non-close-packed colloidal crystals: Toward diamond cubic and novel heterostructures

Journal of materials research, 2011-01, Vol.26 (2), p.247-253

2011

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Anti-infiltration for Fabrication of a Suspended Nanoparticle Layer on Porous Close-Packed Colloidal Arrays

ACS applied materials & interfaces, 2009-04, Vol.1 (4), p.775-779

2009

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Temporal Effect of Functional Blocking of β1 Integrin on Cell Adhesion Strength under Serum Depletion

Langmuir, 2009-09, Vol.25 (18), p.10939-10947

2009

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Effect of plating parameters on the intrinsic stress in electroless nickel plating

Surface & coatings technology, 2003-04, Vol.167 (2), p.170-176

2003

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Temporal effect of functional blocking of beta1 integrin on cell adhesion strength under serum depletion

Langmuir, 2009-09, Vol.25 (18), p.10939-10947

2009

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Temporal Effect of Functional Blocking of β 1 Integrin on Cell Adhesion Strength under Serum Depletion

Langmuir, 2009-09, Vol.25 (18), p.10939-10947

2009

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Surface-energy-driven secondary grain growth in thin Au films

Applied physics letters, 1986-02, Vol.48 (5), p.335-337

1986

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Selected Peer-Reviewed Papers from the 4th International Conference on Technological Advances of Thin Films and Surface Coatings (Thin Films 2008)

Journal of nanoscience and nanotechnology, 2010-07, Vol.10 (7), p.4548-4550

2010

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Ambient Copper-Copper Thermocompression Bonding using Self Assembled Monolayers

MRS proceedings, 2008, Vol.1112 (1), Article 1112-E02-03

2008

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Assessment of Fluxless Solid Liquid Interdiffusion Bonding by Compressive Force of Au-PbSn and Au-SAC for Flip Chip Packaging

IEEE transactions on advanced packaging, 2009-02, Vol.32 (1), p.116-122

2009

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A novel joint-in-via flip-chip chip-scale package

IEEE transactions on advanced packaging, 2006-02, Vol.29 (1), p.186-194

2006

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Signal prediction by an optically controlled neural network

Applied Optics, 1991-03, Vol.30 (8), p.950

1991

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Ovulation induction in polycystic ovary syndrome

Journal of obstetrics and gynaecology Canada, 2010-05, Vol.32 (5), p.503-511

2010

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Single embryo transfer for in vitro fertilization

Journal of obstetrics and gynaecology Canada, 2010-05, Vol.32 (5), p.477-494

2010

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Secondary Grain Growth and Graphoepitaxy in thin Au films on Submicrometer-Period Gratings

MRS proceedings, 1985, Vol.47, Article 35

1985

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Scientists in Power

Science, Technology, & Human Values, 1980, Vol.5 (30), p.58-59

Wong, Chee C.

1980

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Back-propagation learning and nonidealities in analog neural network hardware

IEEE transactions on neural networks, 1991-01, Vol.2 (1), p.110-117

1991

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Standards, Quality Control, and Measurement Sciences in 3D Printing and Additive Manufacturing

1, 2017

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Outcome of 143 Pregnancies Conceived by Assisted Reproductive Techniques

Asia-Oceania Journal of Obstetrics and Gynaecology, 1992-12, Vol.18 (4), p.299-307

1992

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Harnessing high-dimensional hyperentanglement through a biphoton frequency comb

Nature photonics, 2015-08, Vol.9 (8), p.536-542

2015

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Nasopharyngeal carcinoma: an evolving paradigm

Nature reviews. Clinical oncology, 2021-11, Vol.18 (11), p.679-695

2021

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Tourism’s long- and short-term influence on global cities’ economic growth: The case of Hong Kong

PloS one, 2022-09, Vol.17 (9), p.e0275152-e0275152

2022

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ST2 as a Marker for Risk of Therapy-Resistant Graft-versus-Host Disease and Death

The New England journal of medicine, 2013-08, Vol.369 (6), p.529-539

2013

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Effect of Electromigration on the Mechanical Performance of Sn-3.5Ag Solder Joints with Ni and Ni-P Metallizations

Modulating Cell Adhesion Dynamics on Carbon Nanotube Monolayer Engineered with Extracellular Matrix Proteins

Templated self-assembly of non-close-packed colloidal crystals: Toward diamond cubic and novel heterostructures

Anti-infiltration for Fabrication of a Suspended Nanoparticle Layer on Porous Close-Packed Colloidal Arrays

Temporal Effect of Functional Blocking of β1 Integrin on Cell Adhesion Strength under Serum Depletion

Effect of plating parameters on the intrinsic stress in electroless nickel plating

Temporal effect of functional blocking of beta1 integrin on cell adhesion strength under serum depletion

Temporal Effect of Functional Blocking of β 1 Integrin on Cell Adhesion Strength under Serum Depletion

Surface-energy-driven secondary grain growth in thin Au films

Selected Peer-Reviewed Papers from the 4th International Conference on Technological Advances of Thin Films and Surface Coatings (Thin Films 2008)

Ambient Copper-Copper Thermocompression Bonding using Self Assembled Monolayers

Assessment of Fluxless Solid Liquid Interdiffusion Bonding by Compressive Force of Au-PbSn and Au-SAC for Flip Chip Packaging

A novel joint-in-via flip-chip chip-scale package

Signal prediction by an optically controlled neural network

Ovulation induction in polycystic ovary syndrome

Single embryo transfer for in vitro fertilization

Secondary Grain Growth and Graphoepitaxy in thin Au films on Submicrometer-Period Gratings

Scientists in Power

Back-propagation learning and nonidealities in analog neural network hardware

Standards, Quality Control, and Measurement Sciences in 3D Printing and Additive Manufacturing

Outcome of 143 Pregnancies Conceived by Assisted Reproductive Techniques

Harnessing high-dimensional hyperentanglement through a biphoton frequency comb

Nasopharyngeal carcinoma: an evolving paradigm

Tourism’s long- and short-term influence on global cities’ economic growth: The case of Hong Kong

ST2 as a Marker for Risk of Therapy-Resistant Graft-versus-Host Disease and Death

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