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Chip Stackable, Ultra-thin, High-Flexibility 3D FOWLP (3D SWIFT® Technology) for Hetero-Integrated Advanced 3D WL-SiP

2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, p.580-586

2018

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Electrical and Thermal Simulation of SWIFT (TM) High-Density Fan-Out PoP Technology

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.1962-1967

2017

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SLIM (TM), High Density Wafer Level Fan-Out Package Development with Submicron RDL

2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, p.8-13

2017

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High-Density Fan-Out Technology for Advanced SiP and Heterogeneous Integration

2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM), 2018, p.138-141

Do, WonChul

2018

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Clinical characteristics of patients with treated epilepsy in Korea: A nationwide epidemiologic study

Epilepsia (Copenhagen), 2014-01, Vol.55 (1), p.67-75

2014

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Silicon Wafer Integrated Fan-out Technology

IMAPS other content, 2015-01, Vol.2015 (DPC), p.217-247

2015

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Substrate Silicon Wafer Integrated Fan-out Technology (S-SWIFT®) Packaging with Fine Pitch Embedded Trace RDL

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.1355-1361

2022

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Optimization of Temporary Carrier Technology for HDFO Packaging

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.1495-1499

2022

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Reliability Performance of S-Connect Module (Bridge Technology) for Heterogeneous Integration Packaging

2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 2023, p.1027-1031

2023

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A Hybrid Panel Level Package (Hybrid PLP) Technology Based on a 650-mm x 650-mm Platform

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2022, p.824-827

2022

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Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packages in the 4th Industrial Revolution Era

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1332-1337

2020

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Hybrid 3D Package with RDL and Laminate Substrate for Ultra-Thin and High-Bandwidth Applications

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 2020, p.1-5

2020

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S-Connect Fan-out Interposer For Next Gen Heterogeneous Integration

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.96-100

2021

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Chip-Last HDFO (High-Density Fan-Out) Interposer-PoP

2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, p.56-61

2021

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Wafer Level Void-Free Molded Underfill for High-Density Fan-out Packages

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 2020, p.419-424

2020

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A Novel System-in-Package using High-Density Fan-out Technology for Heterogeneous Integration

2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM), 2018, p.230-232

2018

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Silicon Wafer Integrated Fan-out Technology

IMAPS other content, 2017-01, Vol.2017 (DPC), p.1-23

2017

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A New RDL-First PoP Fan-Out Wafer-Level Package Process with Chip-to-Wafer Bonding Technology

2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, p.1910-1915

2020

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A patent-based approach to identifying potential technology opportunities realizable from a firm’s internal capabilities

Computers & industrial engineering, 2022-09, Vol.171, p.108395, Article 108395

Seo, Wonchul

2022

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Border-Crossing Being: A Theological Reflection on the Imago Dei in an Age of Migration

Theology today (Ephrata, Pa.), 2024-07, Vol.81 (2), p.112-125

Shin, Wonchul

2024

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Impact of a Truck Safety Fare System on Rail Freight Transport Volume

KSCE Journal of Civil Engineering, 2024, 28(10), , pp.4618-4623

Kim, Wonchul

2024

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Avulsion Fracture of the Posterior Cruciate Ligament from Femoral Insertion Occurred in a Patient with Residual Poliomyelitis: A Case Report

Journal of the Korean Fracture Society, 2018, Vol.31 (4), p.149

2018

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Predictive modeling for technology convergence: A patent data-driven approach through technology topic networks

Computers & industrial engineering, 2024-02, Vol.188, p.109909, Article 109909

2024

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Uncanny Valley Effects on Chatbot Trust, Purchase Intention, and Adoption Intention in the Context of E-Commerce: The Moderating Role of Avatar Familiarity

International journal of human-computer interaction, 2024-01, Vol.40 (2), p.441-456

2024

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Sleep measurement accuracy of smartwatch in patients with obstructive sleep apnea

Journal of the neurological sciences, 2023-12, Vol.455, p.122249, Article 122249

2023

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Chip Stackable, Ultra-thin, High-Flexibility 3D FOWLP (3D SWIFT® Technology) for Hetero-Integrated Advanced 3D WL-SiP

Electrical and Thermal Simulation of SWIFT (TM) High-Density Fan-Out PoP Technology

SLIM (TM), High Density Wafer Level Fan-Out Package Development with Submicron RDL

High-Density Fan-Out Technology for Advanced SiP and Heterogeneous Integration

Clinical characteristics of patients with treated epilepsy in Korea: A nationwide epidemiologic study

Silicon Wafer Integrated Fan-out Technology

Substrate Silicon Wafer Integrated Fan-out Technology (S-SWIFT®) Packaging with Fine Pitch Embedded Trace RDL

Optimization of Temporary Carrier Technology for HDFO Packaging

Reliability Performance of S-Connect Module (Bridge Technology) for Heterogeneous Integration Packaging

A Hybrid Panel Level Package (Hybrid PLP) Technology Based on a 650-mm x 650-mm Platform

Development of an Extremely High Thermal Conductivity TIM for Large Electronics Packages in the 4th Industrial Revolution Era

Hybrid 3D Package with RDL and Laminate Substrate for Ultra-Thin and High-Bandwidth Applications

S-Connect Fan-out Interposer For Next Gen Heterogeneous Integration

Chip-Last HDFO (High-Density Fan-Out) Interposer-PoP

Wafer Level Void-Free Molded Underfill for High-Density Fan-out Packages

A Novel System-in-Package using High-Density Fan-out Technology for Heterogeneous Integration

Silicon Wafer Integrated Fan-out Technology

A New RDL-First PoP Fan-Out Wafer-Level Package Process with Chip-to-Wafer Bonding Technology

A patent-based approach to identifying potential technology opportunities realizable from a firm’s internal capabilities

Border-Crossing Being: A Theological Reflection on the Imago Dei in an Age of Migration

Impact of a Truck Safety Fare System on Rail Freight Transport Volume

Avulsion Fracture of the Posterior Cruciate Ligament from Femoral Insertion Occurred in a Patient with Residual Poliomyelitis: A Case Report

Predictive modeling for technology convergence: A patent data-driven approach through technology topic networks

Uncanny Valley Effects on Chatbot Trust, Purchase Intention, and Adoption Intention in the Context of E-Commerce: The Moderating Role of Avatar Familiarity

Sleep measurement accuracy of smartwatch in patients with obstructive sleep apnea

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