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Mechanical characterization of porous nano-thin films by use of atomic force acoustic microscopy

Ultramicroscopy, 2016-03, Vol.162 (C), p.82-90

2016

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Creep of thermally aged SnAgCu-solder joints

Microelectronics and reliability, 2007-02, Vol.47 (2), p.223-232

2007

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Simulation of capacity and cost for the planning of future process chains

International journal of production research, 2012-11, Vol.50 (21), p.6122-6132

2012

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Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders

Microelectronics and reliability, 2004-12, Vol.44 (12), p.1923-1931

2004

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Dual resonance excitation system for the contact mode of atomic force microscopy

Review of scientific instruments, 2012-04, Vol.83 (4), p.043703-043703-8

2012

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The effect of downscaling the dimensions of solder interconnects on their creep properties

Microelectronics and reliability, 2008-06, Vol.48 (6), p.843-850

2008

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Cyclooxygenase inhibitors differentially modulate p73 isoforms in neuroblastoma

Oncogene, 2009-05, Vol.28 (19), p.2024-2033

2009

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Mechanical characterization of nanoporous materials by use of atomic force acoustic microscopy methods

Nanotechnology, 2013-09, Vol.24 (35), p.355703-355703

2013

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μ-Raman spectroscopy and FE-modeling for TSV-Stress-characterization

Microelectronic engineering, 2015-04, Vol.137, p.105-110

2015

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Modular Design of Fully Integrated Counting Line Detectors

Procedia engineering, 2012, Vol.47, p.530-533

2012

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Fodel microresistors––processing and basic electrical properties

Microelectronics and reliability, 2003-03, Vol.43 (3), p.377-383

2003

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Impedance as guidance for electrode placement in intraoperative monitoring of nerve fibers

Journal of physics. Conference series, 2013-01, Vol.434 (1), p.1-4

2013

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Reliability of copper-ribbons in photovoltaic modules under thermo-mechanical loading

2010 35th IEEE Photovoltaic Specialists Conference, 2010, p.001283-001288

2010

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pH measurements of FET-based (bio)chemical sensors using portable measurement system

2015 37th Annual International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC), 2015, Vol.2015, p.6445-6448

2015

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Characterization of the annealing behavior for copper-filled TSVs

2012 IEEE 62nd Electronic Components and Technology Conference, 2012, p.619-624

2012

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Development of radiation resistant, direct converting X-ray line detectors in terms of their assembly technology

Procedia engineering, 2011, Vol.25, p.459-462

2011

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Bath chemistry and copper overburden as influencing factors of the TSV annealing

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.1753-1758

2013

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Assembly tolerant design of multi-cell laser power converters for wafer-level photonic packaging

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.1866-1873

2013

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Reliability of embedding concepts for discrete passive components in organic circuit boards

2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.1243-1251

2013

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Temperature compensated field bus sensor interface for applications in process engineering

Proceedings of the 36th International Spring Seminar on Electronics Technology, 2013, p.365-371

2013

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The effect of Cu and Ag on the yielding behaviour of lead-free solders at high strain rates

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 2013, p.298-303

2013

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Assembly tolerance requirements for photonics packaging of multi-cell laser power converters

2012 4th Electronic System-Integration Technology Conference, 2012, p.1-6

2012

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Reliability analysis of encapsulated components in 3D-circuit board integration

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2018, p.1-12

2018

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Reliability assessment of discrete passive components embedded into PCB core

2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2014, p.1-7

2014

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Inductively excited lock-in thermography for PCB-vias

2012 4th Electronic System-Integration Technology Conference, 2012, p.1-6

2012

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Mechanical characterization of porous nano-thin films by use of atomic force acoustic microscopy

Creep of thermally aged SnAgCu-solder joints

Simulation of capacity and cost for the planning of future process chains

Microstructure and creep behaviour of eutectic SnAg and SnAgCu solders

Dual resonance excitation system for the contact mode of atomic force microscopy

The effect of downscaling the dimensions of solder interconnects on their creep properties

Cyclooxygenase inhibitors differentially modulate p73 isoforms in neuroblastoma

Mechanical characterization of nanoporous materials by use of atomic force acoustic microscopy methods

μ-Raman spectroscopy and FE-modeling for TSV-Stress-characterization

Modular Design of Fully Integrated Counting Line Detectors

Fodel microresistors––processing and basic electrical properties

Impedance as guidance for electrode placement in intraoperative monitoring of nerve fibers

Reliability of copper-ribbons in photovoltaic modules under thermo-mechanical loading

pH measurements of FET-based (bio)chemical sensors using portable measurement system

Characterization of the annealing behavior for copper-filled TSVs

Development of radiation resistant, direct converting X-ray line detectors in terms of their assembly technology

Bath chemistry and copper overburden as influencing factors of the TSV annealing

Assembly tolerant design of multi-cell laser power converters for wafer-level photonic packaging

Reliability of embedding concepts for discrete passive components in organic circuit boards

Temperature compensated field bus sensor interface for applications in process engineering

The effect of Cu and Ag on the yielding behaviour of lead-free solders at high strain rates

Assembly tolerance requirements for photonics packaging of multi-cell laser power converters

Reliability analysis of encapsulated components in 3D-circuit board integration

Reliability assessment of discrete passive components embedded into PCB core

Inductively excited lock-in thermography for PCB-vias

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