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Printed circuit board technology inspired stretchable circuits

MRS bulletin, 2012-03, Vol.37 (3), p.254-260

2012

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Degradation mapping of IGZO TFTs

2022 IEEE International Integrated Reliability Workshop (IIRW), 2022, p.1-5

2022

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IEEE_Xplore

Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects

Microelectronic engineering, 2014-04, Vol.117, p.26-34

2014

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Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-)MEMS devices

Journal of micromechanics and microengineering, 2005-07, Vol.15 (7), p.S89-S96

2005

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Risk-based educational accountability in Dutch primary education

Educational assessment, evaluation and accountability, 2015-11, Vol.27 (4), p.323-346

2015

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Nozzle scaling effects for the thermohydraulic performance of microjet impingement cooling with distributed returns

Applied thermal engineering, 2020-11, Vol.180, p.115767, Article 115767

2020

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Creep-resistant aluminum alloys for use in MEMS

Journal of micromechanics and microengineering, 2005-07, Vol.15 (7), p.S165-S170

2005

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A methodology for mechanical stress and wafer warpage minimization during 3D NAND fabrication

Microelectronic engineering, 2022-02, Vol.254, p.111660, Article 111660

2022

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An electrostatic fringing-field actuator (EFFA): application towards a low-complexity thin-film RF-MEMS technology

Journal of micromechanics and microengineering, 2007-07, Vol.17 (7), p.S204-S210

2007

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Analytical Model of the DC Actuation of Electrostatic MEMS Devices With Distributed Dielectric Charging and Nonplanar Electrodes

Journal of microelectromechanical systems, 2007-10, Vol.16 (5), p.1243-1253

2007

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IEEE_Xplore

Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures

Microelectronics and reliability, 2012-09, Vol.52 (9-10), p.1971-1974

2012

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Fast and Distributed Thermal Model for Thermal Modeling of GaN Power Devices

IEEE transactions on components, packaging, and manufacturing technology (2011), 2018-10, Vol.8 (10), p.1747-1755

2018

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IEEE_Xplore

Materials issues in the processing, the operation and the reliability of MEMS

Microelectronic engineering, 2004-10, Vol.76 (1-4), p.245-257

2004

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Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters

2023 IEEE International Reliability Physics Symposium (IRPS), 2023, p.1-7

2023

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IEEE_Xplore

A physical model to predict stiction in MEMS

Journal of micromechanics and microengineering, 2002-09, Vol.12 (5), p.702-713, Article 329

2002

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Techniques for mechanical strain analysis in sub-micrometer structures: TEM/CBED, micro-Raman spectroscopy, X-ray micro-diffraction and modeling

Microelectronic engineering, 2003-11, Vol.70 (2), p.425-435

2003

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Influence of process-induced stress on device characteristics and its impact on scaled device performance

IEEE transactions on electron devices, 1999-06, Vol.46 (6), p.1245-1252

1999

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IEEE_Xplore

Cu pumping in TSVs: Effect of pre-CMP thermal budget

Microelectronics and reliability, 2011-09, Vol.51 (9-11), p.1856-1859

2011

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Creep characterization of Al alloy thin films for use in MEMS applications

Microelectronic engineering, 2004-10, Vol.76 (1-4), p.272-278

2004

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Anisotropic stress in narrow sGe fin field-effect transistor channels measured using nano-focused Raman spectroscopy

APL materials, 2018-05, Vol.6 (5), p.058501-058501-6

2018

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B-Spline X-Ray Diffraction Imaging — Rapid non-destructive measurement of die warpage in ball grid array packages

Microelectronics and reliability, 2016-04, Vol.59, p.108-116

2016

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In-situ scanning electron microscope observation of electromigration-induced void growth in 30 nm ½ pitch Cu interconnect structures

Journal of applied physics, 2014-02, Vol.115 (7)

2014

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Investigation of temporary stiction in poly-SiGe micromirror arrays

Sensors and actuators. A. Physical., 2012-12, Vol.188, p.320-328

2012

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Observation of single interface traps in submicron MOSFET's by charge pumping

IEEE transactions on electron devices, 1996-06, Vol.43 (6), p.940-945

1996

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IEEE_Xplore

Laser Bonding of Glass to Silicon Using Polymer for Microsystems Packaging

Journal of microelectromechanical systems, 2007-06, Vol.16 (3), p.571-580

2007

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IEEE_Xplore

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Printed circuit board technology inspired stretchable circuits

Degradation mapping of IGZO TFTs

Degradation of Cu6Sn5 intermetallic compound by pore formation in solid–liquid interdiffusion Cu/Sn microbump interconnects

Mechanical and electrical characterization of BCB as a bond and seal material for cavities housing (RF-)MEMS devices

Risk-based educational accountability in Dutch primary education

Nozzle scaling effects for the thermohydraulic performance of microjet impingement cooling with distributed returns

Creep-resistant aluminum alloys for use in MEMS

A methodology for mechanical stress and wafer warpage minimization during 3D NAND fabrication

An electrostatic fringing-field actuator (EFFA): application towards a low-complexity thin-film RF-MEMS technology

Analytical Model of the DC Actuation of Electrostatic MEMS Devices With Distributed Dielectric Charging and Nonplanar Electrodes

Diffusion growth of Cu3Sn phase in the bump and thin film Cu/Sn structures

Fast and Distributed Thermal Model for Thermal Modeling of GaN Power Devices

Materials issues in the processing, the operation and the reliability of MEMS

Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters

A physical model to predict stiction in MEMS

Techniques for mechanical strain analysis in sub-micrometer structures: TEM/CBED, micro-Raman spectroscopy, X-ray micro-diffraction and modeling

Influence of process-induced stress on device characteristics and its impact on scaled device performance

Cu pumping in TSVs: Effect of pre-CMP thermal budget

Creep characterization of Al alloy thin films for use in MEMS applications

Anisotropic stress in narrow sGe fin field-effect transistor channels measured using nano-focused Raman spectroscopy

B-Spline X-Ray Diffraction Imaging — Rapid non-destructive measurement of die warpage in ball grid array packages

In-situ scanning electron microscope observation of electromigration-induced void growth in 30 nm ½ pitch Cu interconnect structures

Investigation of temporary stiction in poly-SiGe micromirror arrays

Observation of single interface traps in submicron MOSFET's by charge pumping

Laser Bonding of Glass to Silicon Using Polymer for Microsystems Packaging

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