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Electro-thermo-mechanical modelling of a SiC MOSFET transistor under non-destructive short-circuit

Microelectronics and reliability, 2023-11, Vol.150, p.115143, Article 115143

2023

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Remaining useful life prediction of lithium batteries in calendar ageing for automotive applications

Microelectronics and reliability, 2012-09, Vol.52 (9-10), p.2438-2442

2012

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Characterization methods and modelling of ultracapacitors for use as peak power sources

Journal of power sources, 2007-06, Vol.168 (2), p.553-560

2007

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Impact of Calendar Life and Cycling Ageing on Supercapacitor Performance

IEEE transactions on vehicular technology, 2009-10, Vol.58 (8), p.3917-3929

2009

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Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity

Microelectronics and reliability, 2015-08, Vol.55 (9-10), p.1997-2002

2015

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Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices

Microelectronics and reliability, 2016-09, Vol.64, p.409-414

2016

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A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization

Microelectronics and reliability, 2012-09, Vol.52 (9-10), p.2321-2325

2012

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Study of die attach technologies for high temperature power electronics: Silver sintering and gold–germanium alloy

Microelectronics and reliability, 2013-09, Vol.53 (9-11), p.1617-1621

2013

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Effect of HTRB lifetest on AlGaN/GaN HEMTs under different voltages and temperatures stresses

Microelectronics and reliability, 2018-09, Vol.88-90, p.402-405

2018

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Identification and analysis of power substrates degradations subjected to severe aging tests

Microelectronics and reliability, 2015-08, Vol.55 (9-10), p.1961-1965

2015

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Innovative conception of SiC MOSFET-Schottky 3D power inverter module with double side cooling and stacking using silver sintering

Microelectronics and reliability, 2017-09, Vol.76-77, p.431-437

2017

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Ageing monitoring of lithium-ion cell during power cycling tests

Microelectronics and reliability, 2011-09, Vol.51 (9-11), p.1968-1971

2011

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How supercapacitors reach end of life criteria during calendar life and power cycling tests

Microelectronics and reliability, 2011-09, Vol.51 (9-11), p.1976-1979

2011

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Temperature and voltage effects on HTRB and HTGB stresses for AlGaN/GaN HEMTs

2018 IEEE International Reliability Physics Symposium (IRPS), 2018, p.P-RT.2-1-P-RT.2-6

2018

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Comparison of crack resistance of two SiC MOSFETs gate geometries under short-circuit by FE simulations

2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM), 2024, p.1-3

2024

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Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach

Microelectronics and reliability, 2013-09, Vol.53 (9-11), p.1719-1724

2013

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Analysis of the dynamic behavior changes of supercapacitors during calendar life test under several voltages and temperatures conditions

Microelectronics and reliability, 2009-09, Vol.49 (9), p.1391-1397

2009

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Quantification of ageing of ultracapacitors during cycling tests with current profile characteristics of hybrid and electric vehicles applications

IET electric power applications, 2007-09, Vol.1 (5), p.683-689

2007

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Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature

Microelectronics and reliability, 2010-09, Vol.50 (9), p.1815-1821

2010

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Failure mechanism of trench IGBT under short-circuit after turn-off

Microelectronics and reliability, 2006-09, Vol.46 (9), p.1778-1783

2006

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Multi-scale electro-thermo-mechanical simulation of a SiC MOSFET transitor during short-circuit

2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2023, p.1-7

2023

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An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications

Microelectronics and reliability, 2009-09, Vol.49 (9), p.1370-1374

2009

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Contribution of calendar ageing modes in the performances degradation of supercapacitors during power cycling

Microelectronics and reliability, 2010-08 (50), p.1796-1803

2010

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Impact of Calendar Life and Cycling Ageing on Supercapacitor Performance : VEHICULAR ENERGY-STORAGE SYSTEMS

IEEE transactions on vehicular technology, 2009, Vol.58 (8), p.3917-3929

2009

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Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation

Microelectronics and reliability, 2009-09, Vol.49 (9), p.1398-1403

2009

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Electro-thermo-mechanical modelling of a SiC MOSFET transistor under non-destructive short-circuit

Remaining useful life prediction of lithium batteries in calendar ageing for automotive applications

Characterization methods and modelling of ultracapacitors for use as peak power sources

Impact of Calendar Life and Cycling Ageing on Supercapacitor Performance

Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity

Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices

A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization

Study of die attach technologies for high temperature power electronics: Silver sintering and gold–germanium alloy

Effect of HTRB lifetest on AlGaN/GaN HEMTs under different voltages and temperatures stresses

Identification and analysis of power substrates degradations subjected to severe aging tests

Innovative conception of SiC MOSFET-Schottky 3D power inverter module with double side cooling and stacking using silver sintering

Ageing monitoring of lithium-ion cell during power cycling tests

How supercapacitors reach end of life criteria during calendar life and power cycling tests

Temperature and voltage effects on HTRB and HTGB stresses for AlGaN/GaN HEMTs

Comparison of crack resistance of two SiC MOSFETs gate geometries under short-circuit by FE simulations

Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach

Analysis of the dynamic behavior changes of supercapacitors during calendar life test under several voltages and temperatures conditions

Quantification of ageing of ultracapacitors during cycling tests with current profile characteristics of hybrid and electric vehicles applications

Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature

Failure mechanism of trench IGBT under short-circuit after turn-off

Multi-scale electro-thermo-mechanical simulation of a SiC MOSFET transitor during short-circuit

An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications

Contribution of calendar ageing modes in the performances degradation of supercapacitors during power cycling

Impact of Calendar Life and Cycling Ageing on Supercapacitor Performance : VEHICULAR ENERGY-STORAGE SYSTEMS

Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation

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